IPC-TM-650 EN 2022 试验方法.pdf - 第810页

6 Notes 6.1 Acceptance criteria shall be established in terms of one or any combination of the following: A. Visible evidence of damage or significant material change B. Deterioration of low level circuit or insulation r…

1 Scope This test method is used to determine the effects

of exposure to elevated ambient temperature on the electrical

and mechanical characteristics of a connector.

2 Applicable Documents None

3 Test Specimen

3.1

A mated connector (plug and receptacle) complete with

all applicable guide, keying, and engaging hardware shall be

terminated and mounted in its normal manner during this test.

3.2 The card-edge receptacle and an applicable PCB of

minimum thickness shall be mated during this test, except as

otherwise specified.

4 Equipment/Apparatus

4.1

A suitable chamber capable of maintaining the appli-

cable temperatures within ± 20°C at the geometric center

under no load conditions. Thermal distribution shall not

exceed ± 50°C of the temperature at the geometric center.

4.2 A thermocouple bridge, potentiometer, or resistance

bridge of suitable range for the specified test conditions

5 Procedure

5.1

The chamber shall be adjusted to, and maintained at,

the temperature specified in the individual connector specifi-

cation. Thermal equilibrium shall be attained prior to the start

of the test (see 6.3).

5.2 The mated test specimen shall be suspended within the

test chamber and subjected to the specified temperature for

the required time duration called out in the individual specifi-

cation.

Note: Table 1 and Table 2 may be used as a reference for

test temperatures and test times, however, the individual con-

nector specification shall take precedence.

5.3 If groups of samples are tested, they shall be mounted

in a manner, such that the normal heat dissipation, absorp-

tion, conduction, or reflection characteristics inherent in the

connector are not infringed.

5.4 The connector test potentials, duty cycle load, and other

operating conditions during exposure shall be specified in the

applicable connector specifications

5.5 At the completion of the specified exposure time, the

conductors shall be stabilized at ambient temperature and

checked for low level circuit and insulation resistance, unless

otherwise specified in the individual connector specification.

5.6 Visual examination shall be for evidence of the following:

A. Permanent dimensional changes or distortion

B. Cracking or delamination of finishes or dielectric materials

C. Opening of seals or seams

D. Hardening or softening of dielectric materials

E. Fusing or seizure of mating connectors or components

Table 1 Test Temperatures

Test Condition Chamber Temperature (°C)

155

270

385

4 105

5 125

6 150

7 200

Table 2 Length of Test

Test Time Condition Hours

A96

B 300

C 500

D 1000

E 1500

F 2000

G 3000

H 5000

2215 Sanders Road

Northbrook, IL 60062-6135

IPC-TM-650

TEST METHODS MANUAL

Number

3.14

Subject

High Temperature Life, Connectors

Date

7/75

Revision

Originating Task Group

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

Page1of2

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

6 Notes

6.1

Acceptance criteria shall be established in terms of one

or any combination of the following:

A. Visible evidence of damage or significant material change

B. Deterioration of low level circuit or insulation resistance

beyond allowable specified limits, or other requirements

called out in an individual specification

6.2 The test chambers shall be of the forced- (circulating) air

type to ensure temperature distribution.

6.3 Thermal equilibrium shall be assumed, when three suc-

cessive thermocouple readings taken at five-minute intervals

indicate variations of 30°C or less.

6.4 Information in this test method is intended to parallel the

test method described in EIA-RS-364/TP-17.

IPC-TM-650

Number

3.14

Subject

High Temperature Life, Connectors

Date

7/75

Revision

Page2of2

1 Scope This test method is used to determine if the

dielectric materials are nutrient to specific fungus microorgan-

isms.

2 Applicable Documents None

3 Test Specimen

3.1

The test specimen must be at least one end product

connector.

4 Equipment/Apparatus

4.1

Autoclave capable of maintaining 30°C and 95% RH

and an ultraviolet (3600 angstroms) source for subsequent

decontamination

4.2 Microorganisms

4.2.1

Choetomium globosum No. 6205

4.2.2 Memnoniella flavus No. 11973

4.2.3 Aspergillus flavus No. 10836

4.2.4 Penicillum citrinum No. 9849

4.3 Microscope capable of 18X

5 Procedure

5.1 Preparation

5.1.1

All glassware, inoculating loops, pipettes, etc., must

be sterilized at 117 Kp and 135°C prior to commencing any

phase of the test.

5.1.2 Use each one of the fungus microorganisms for a

composite spore suspension.

5.1.3 The spore suspension must be used within 24 hours

at temperatures between 22°C to 32°C and can be stored for

a maximum of 48 hours at 1.67°C to 7.22°C.

5.1.4 Prepare 25 ml of distilled water having a pH value from

5.8 to 7.2 at temperatures between 22°C to 32°C.

5.1.5 Introduce 1.0 ml of distilled water into each tube of

fungi and gently rub the spore layer with a sterilized inoculat-

ing loop without disturbing the agar surface.

5.1.6 Pour the four solutions in a sterilized Florence flask

containing 100 ml of distilled water and mix the suspension

thoroughly.

5.2 Test

5.2.1

Set the autoclave at 30°C and 95% RH and stabilize

for a minimum of two hours.

5.2.2 Place the specimen in the chamber and spray all of

the test surfaces thoroughly, using the 250 ml Florence flask

and atomizer attachment.

5.2.3 Operate the chamber for 28 days, observe and note

fungus growth daily. (Do not remove the specimen from the

chamber for prolonged periods.)

5.2.4 After exposure, examine all surfaces through an 18X

microscope.

5.3 Evaluation

5.3.1

Report the specimens that were found to be nutrient

to fungus growth.

5.3.2 Corrosion should be noted separately from the fungus

test results.

6 Notes

6.1

After exposure and subsequent examinations, the mate-

rials, equipment, component or part, and the test chamber

must be decontaminated by exposure on all sides to ultravio-

let rays (3600 angstroms) for a minimum of two hours, or

sprayed with a solution of 1:750 zephiran chloride. (One part

zephiran chloride to 750 parts distilled water.)

6.2 Microorganisms available from:

AMERICAN TYPE CULTURE

2301 Parklawn Drive

Rockville, MD 20852

2215 Sanders Road

Northbrook, IL 60062-6135

IPC-TM-650

TEST METHODS MANUAL

Number

3.15

Subject

Fungus Resistance, Connectors

Date

3/79

Revision

Originating Task Group

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

Page1of1

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES