IPC-TM-650 EN 2022 试验方法.pdf - 第713页

1 Scope This test method is used to determine the resis- tance of the applied solder mask to reverting to liquid when exposed to high humidity at a specific time and temperature condition. This test method evaluates the …

Parallax

displacement distortion will be indicated when round

holes appear oval or ‘‘cats eyed’’ on the X-ray image. For a

hole drilled through a panel of thickness, t, and offset from the

center of the X-ray beam axis by the angle A, the parallax dis-

placement between the top and bottom of the hole will be

equal to

txT

ran A.

5.2

Radiographic Quality Standard

radiographic qual-

ity standard such as an ASTM Image Quality Indicator or other

agreeable indicator shall be used on all radiographic studies.

5.3

Exposure when film is used

The

necessary X-ray

penetration exposure will depend on the construction of the

multilayer, X-ray source anode voltage, the anode current, the

distance from the source to the film plane and the speed or

sensitivity of the film. The exposure should be sufficient to

produce an optical density of at least 2.0 at those portions of

the film receiving the highest X-ray exposure, such as, holes

or unattenuated areas. In addition the conditions of paragraph

1.0 with respect to resolution and gray scale must be met.

The exposure apparatus for film can consist of an industrial

shielded X-ray cabinet with a nominal anode voltage of 80

kilovolts, nominal anode current of

millgrams

and

a focal

spot to film distance adequate to avoid parallax distortion of

the X-ray film image.

5.4

Exposure for realtime systems

The

X-ray source

operating parameters must be matched to the X-ray camera

sensitivity of the system to produce an X-ray image of suffi-

cient quality to comply with the conditions of paragraph 1.0.

6.0 Notes

None

IPC-TM-650

Number

2.6.10

Subject

X-Ray

(Radiography), Multilayer Printed Wiring Printed Board

Test Methods

Date

8/97

Revision

age2of2

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1 Scope This test method is used to determine the resis-

tance of the applied solder mask to reverting to liquid when

exposed to high humidity at a specific time and temperature

condition. This test method evaluates the stability of a cured

solder mask that has been applied to a printed board under

storage (nonoperating) conditions.

2 Applicable Documents

IPC-SM-840

Qualification and Performance of Permanent

Solder Mask

3 Test Specimens Three copper clad laminates, approxi-

mately 10 cm x 10 cm [3.94 in x 3.94 in], coated with solder

mask and cured according to the supplier’s recommenda-

tions.

4 Equipment

4.1 Desiccator

At least 25 cm [9.84 in] in diameter

4.2 Potassium Sulfate Reagent grade potassium sulfate

4.3 Cotton Swabs

4.4 Oven

Capable of maintaining temperature up to 100 °C

[212 °F]

4.5 Test Chamber Capable of maintaining a constant tem-

perature of 97±2°C[206.6 ± 3.6 °F] with 94 ± 4% relative

humidity.

4.6 High Temperature Silicone Grease

5 Procedures

5.1 Desiccator Method

5.1.1

Prepare a saturated solution of distilled or deionized

water and potassium sulfate [35 grams per 100 mL] at a tem-

perature of 97±2°C[206.6 ± 3.6 °F]. Pour the solution into

the desiccator just below the ceramic plate. Crystals of potas-

sium sulfate should remain visible in the saturated solution

during testing.

Note: Relative humidity is not to exceed 98%.

5.1.2 Place the three test specimens on the ceramic plate in

the desiccator so that they are not touching each other.

5.1.3 Seal the desiccator with high temperature silicone

grease and close the desiccator.

5.1.4 Place the desiccator in the oven maintained at 97 ± 2

°C [206.6 ± 3.6 °F].

5.1.5 Allow the desiccator, containing the test specimens,

to remain in the oven for 28 days (672 hours).

5.2 Chamber Method

5.2.1

Place the three test specimens in a rack so they do

not touch each other and place the rack into the test cham-

ber. Close the chamber door.

5.2.2 Set the chamber’s parameters at 97±2°C[206.6 ±

3.6 °F] and 94 ± 4% relative humidity. Activate the test cham-

ber and begin testing.

5.2.3 Allow the specimens to remain in the test chamber for

28 days (672 hours).

5.3 Evaluation

5.3.1

After the required time exposure remove the test

specimens and visually examine the specimens for evidence

of reversion as indicated by softening, chalking, blisters,

cracks, tackiness, loss of adhesion or liquefaction.

5.3.2 Touch (do not wipe) the surface of the solder mask

coating with a swab of absorbent cotton and observe for par-

ticles of the cotton adhering to the coating.

Note: Examination and testing may be done at intervals

within the required exposure time, if there is suspicion of early

failure and evaluation time is critical.

3000 Lakeside Drive, Suite 309S

Bannockburn, IL 60015-1249

IPC-TM-650

TEST METHODS MANUAL

Number

2.6.11

Subject

Solder Mask - Hydrolytic Stability

Date

03/07

Revision

Originating Task Group

Solder Mask Performance Task Group (5-33b)

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

Page1of1

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Scope

This

test method is to determine the resistance of

the applied conformal coating to reverting to liquid when

exposed to high humidity at a specific temperature and time

condition for each class. This test method is to evaluate the

quality of the coated printed boards under storage conditions

(nonoperating).

Applicable Documents

IPC-CC-830

Qualification

and Performance of Electrical Insu-

lating Compound for Printed Board Assemblies

FED-STD-141

Method

4061 (Dry-Through For Varnish, Lac-

quers And Enamels)

Test Specimens

Five

coated ‘‘Y’’ shape patterns (see

Figure 1) containing two resistors, one with marking ink and

one with color code bars, coated with conformal coating per

the coating supplier’s recommendations.

Equipment

4.1 Desiccator

least 25 cm [9.84 in] in diameter

4.2

Potassium Sulfate

Reagent

grade potassium sulfate

4.3

Cotton Swabs

4.4 Oven

Capable

of maintaining temperature up to 100°C

[212°F].

4.5

Test Chamber

Capable

of maintaining a constant tem-

perature of 85° ± 2°C [185° ± 3.6°F] with 95 ± 4% relative

humidity

4.6

Soldering Iron

applicable

4.7

High Temperature Silicone Grease

5.0 Procedures

5.1 Desiccator Method

5.1.1

Prepare

a saturated solution of distilled or deionized

water and potassium sulfate (35 grams per 100 cm

temperature of 85° ± 2°C [185° ± 3.6°F]. Pour the solution

into the desiccator just below the ceramic plate. Crystals of

potassium sulfate should remain visible in the saturated solu-

tion during testing.

Note: Relative humidity is not to exceed 98%.

5.1.2 Place

four of the five test specimens on the ceramic

plate in the desiccator so that they are not touching each

other. The fifth specimen is used as a control.

5.1.3

Seal

the desiccator with high temperature silicone

grease and close the desiccator.

5.1.4

Place

the desiccator in the oven maintained at 85° ±

2°C [185° ± 3.6°F].

5.1.5 Allow

the desiccator, containing the test specimens,

to remain in the oven for 120 days.

75 mm

[2.95 in]

4.7 mm

[0.185 in]

38 mm

[1.50 in]

19 mm

[0.748 in]

6.30 mm [0.248 in]

2.3 ± 0.13 mm DIA

[0.091 ± 0.005 in DIA]

Hole 0.75 ± 0.08 mm DIA

[0.029 ± 0.003 in DIA]

0.75 mm [0.029 in MIN]

0.75 mm ± 008 mm [0.029 in ± 0.003 in MIN]

0.75 mm [0.029 in MIN]

3.2 mm

[0.126 in]

25 ± 1.5 mm

[0.984 ± 0.059 in MIN]

3.8 ± 0.13 mm DIA

[0.150 ± 0.005 in DIA]

HOLE 1.3 ± 0.08 mm DIA

[0.051 ± 0.0031 in DIA]

IPC-26111-1

Figure

1 ‘‘Y’’ Shape Pattern

2215

Sanders Road

Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.6.11.1

(Supersedes

2.6.11B for Conformal Coating Test)

Subject

Hydrolytic Stability - Conformal Coating

Date

07/00

Revision

Originating Task Group

Conformal Coating Task Group (5-33a)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

age1of2

ASSOCIA

TION CONNECTING

ELECTRONICS INDUSTRIES

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