IPC-TM-650 EN 2022 试验方法.pdf - 第381页

1.0 Scope This test is to determine the ability of a printed pattern of solder paste to retain a probe placed in the solder paste by measuring the force required to separate the probe from the paste. Time between printin…

Figure

1 Solder ball test standards

Preferred Acceptable

Unacceptable;

Clusters

Unacceptable

IPC-TM-650

Number

2.4.43

Subject

Solder

Paste—Solder Ball Test

Date

1/95

Revision

age3of3

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1.0

Scope

This

test is to determine the ability of a printed

pattern of solder paste to retain a probe placed in the solder

paste by measuring the force required to separate the probe

from the paste. Time between printing and probe placement

are progressively increased to simulate variables in a manu-

facturing process.

2.0

Applicable Documents

None

3.0

Test Specimen

representative sample of this paste

should then be printed out, using a stencil, onto clean plain-

glass slides. At least six paste deposits should be printed per

required time data-point. The final deposits must be circular,

6.3 mm in diameter and 0.25 mm thick. Mark the test speci-

men in a suitable manner to identify the sample and the time

after printing when tackiness is to be measured. The prepared

samples shall be stored at 25°C ± 2°C and 50°C ± 10% rela-

tive humidity (RH) until evaluated. The samples shall not be

stored in an enclosed cabinet or container, which allows the

solder paste solvent vapors to saturate the environment sur-

rounding the printed paste, thus preventing natural drying of

the material.

4.0

Equipment/Apparatus

Chatillon tackiness tester or

other equipment may be used, providing it is capable of accu-

rately measuring force when tested at a similar velocity. The

equipment shall have a stainless steel test probe with a nomi-

nal 5.1 mm ± 0.13 mm diameter bottom surface, which is

smooth, flat, and aligned parallel to the plane of the subject

test specimen. The probe shall contact the test specimen at a

controlled speed and apply a controlled, fixed initial contact

force. Finally, a means shall be provided to withdraw the test

probe from the surface of the test specimen at a controlled

speed and record the peak force required to break contact

with the test specimen.

5.0

Procedure

Place

the specimen slide under the test

probe and center the probe over one of the three printed pat-

terns. Bring the test probe in contact with the printed paste

specimen at a rate of 2.5 mm/min. ± 0.5 mm/min. and apply

a force of 300g±30gtothespecimen. Within five seconds

following application of this force, withdraw the probe from the

specimen at a rate of 2.5 mm/min. ± 0.5 mm/min. and record

the peak force required to break the contact. Take at least five

additional measurements under the same test conditions and

average all the readings. Record both the tack force and time

following paste printing.

5.1

Evaluation

Initial

measurements are to be taken imme-

diately after printing. Subsequent measurements of force shall

be taken as needed to best define the rise and decline of the

tack force. Tackiness data should be presented in graph form,

provided that the graph with tack force is plotted as a func-

tion of time after printing. The data can also be reported as

follows:

1. Time to reach 80% of the peak value.

2. The peak tack force in grams with the expected variation.

3. Time over which the peak value is maintained or for the

tack force to decline to 80% of its peak value.

6.0 Notes

6.1

Test Equipment Sources

The

equipment sources

described in 6.1.1 and 6.1.2 represent those currently known

to the industry. Users of this test method are urged to submit

additional source names as they become available so that this

list can be kept as current as possible.

6.1.1

AMETEK/Chatillon

8600

Somerset Drive

Largo, FL 33773

Phone: 1 (800) 527-9999

6.1.2

Malcom

Instruments Corp.

26226 Industrial Blvd.

Hayward, CA 94545

Phone: 1 (510) 293-0580

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.44

Subject

Solder

Paste—Tack Test

Date

3/98

Revision

Reaffirmed

Originating Task Group

Solder Paste Task Group (5-24b)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

age1of1

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1.0

Scope

Determine

the ability of a solder paste to wet an

oxidized copper surface and to qualitatively examine the

amount of spatter of the solder paste during reflow.

2.0

Applicable Documents

None

IPC-TM-650

Test Methods Manual

2.4.43

Solder Paste—Solder Ball Test

3.0

Test Specimen

7.6

cm x 2.5 cm x 0.8 mm specimen of 1 ounce oxygen-free

high conductivity (OFHC) copper.

4.0

Equipment/Materials/Apparatus

Flat

hot plate

Specimen tongs

Beaker 400 cc

Magnifying glass with 10 times magnification

Liquid copper cleaner

Deionized water

Isopropyl alcohol

Solvent for residual flux removal

4.1 Stencil

76 mm x 25 mm x 0.2 mm provided with at least

3 round holes or 6.5 mm diameter aperature with a minimum

between centers of 10 mm.

5.0

Procedure

5.1 Preparation

5.1.1

The

specimen shall be cleaned with a liquid copper

cleaner, washed thoroughly with water, rinsed with isopropyl

alcohol, dried and then placed in boiling deionized water for

10 minutes and air dried

5.2 Test

5.2.1

Place

stencil on test specimen and print solder paste

test pattern.

5.2.2

Reflow

using the procedure outlined in paragraph

5.2.3.2 of IPC-TM-650, Test Method 2.4.43.

5.2.3

After

reflow, the residual flux shall be removed with a

suitable solvent.

5.3

Evaluation

When

examined visually at 10X, the solder

shall uniformly wet the copper and there should be no evi-

dence of dewetting or non-wetting of the copper and there

shall be no solder spatter around the printed dots.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.45

Subject

Solder

Paste—Wetting Test

Date

1/95

Revision

Originating Task Group

Solder Paste Task Group (5-24b)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

age1of1

电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ