IPC-TM-650 EN 2022 试验方法.pdf - 第112页

Main image (Height) S-L surface Material ratio curve Angular spectrum Autocorrelation function 2.66um IPC-TM-650 Number 2.2.22 Subject Noncontact Metallic Foil Surface Topography/Texture Date 5/20 Revision P a g e5o f5

F-Operation

• A filter for removing surface shapes (i.e., Plane tilt, curved

surface).

• Insures that the geometry of the sample surface does not

affect the magnitude of the measured roughness value.

• Eliminates the user from having to place the sample per-

fectly flat during the scan.

L-Filter

• Commonly known as a high-pass filter.

• This filter is equivalent to λc for line roughness defined by

ISO 4287.

• Removes waviness and other nonuniform surface shapes to

extract surface roughness data (normalization filter).

A.2.2 As described in Section V, the proper filter values that

properly align with the ISO 25178 for this specific procedure

(50X objective with 0.95 NA, 200 µm X 1000 µm scanned

area) are:

• S-filter: 2 µm

• F-operation: Plane Correction

• L-filter: 0.2 mm

A.3 Sample Measurements Examples

A.3.1

Shown below are examples of what the user should

expect from a successful analysis with a 3-D measurement

tool. The first picture shows a qualitative 3-D rendering of the

metallic foil surface from a laser confocal microscope tool.

A.3.2 A laser confocal microscope, or similar noncontact

3-D surface measurement tool should be able to provide

enough resolution in both the XY and Z direction to provide an

accurate representation of the material.

A.3.3 Once the 3-D model is obtained, the surface will then

be quantified using the ISO 25178 Surface Roughness mod-

ule.

A.3.4 An example of how the data could be outputted is

shown below. Other similar forms of data outputs would be

provided to the user by other noncontact 3-D measurement

tools.

Surface roughness

Surface waviness

IPC-TM-650

Number

2.2.22

Subject

Noncontact Metallic Foil Surface Topography/Texture

Date

5/20

Revision

Page4of5

Main image (Height) S-L surface Material ratio curve

Angular spectrum

Autocorrelation function

2.66um

IPC-TM-650

Number

2.2.22

Subject

Noncontact Metallic Foil Surface Topography/Texture

Date

5/20

Revision

Page5of5

Scope

This

test method covers acceptance of incoming

copper clad epoxy-glass laminates ranging in thickness from

0.8 mm to 6.5 mm, clad on one or both sides. It provides for

a standard method of inspection and establishes operations

that simulate the manufacture of PWBs. Specific values for the

acceptability are based on copper foil adhesion and visual

surface condition of the base laminate.

Applicable Documents

MIL-STD-105

Sampling

Procedures and Tables for Inspec-

tion by Attributes

MIL-P-13949 Plastic

Sheet, Laminated, Copper-Clad (For

Printed Wiring)

Test Specimen

3.1 Specimen

One

specimen shall be tested for each

sample, except in the case where material is clad on both

sides, in which case two specimens shall be processed for

each sample (one for each surface). Each specimen will have

four readings.

3.2

Sampling

The

sampling procedure will be to MIL-STD-

105. The inspection level shall be S-2 at 6.5 A.Q.L.

Apparatus

4.1

Complete

photo processing facilities

4.2

Etching

facilities

Procedures

5.1 Print and Etch

For

print and etch testing use 5.3.1,

5.3.2, 5.3.4, 5.3.5, 5.3.7, 5.3.8, 5.3.9, 5.3.10, and 5.3.11

only.

5.2

Print, Etch, and Plate

For

print, etch, and plate test-

ing, use 5.3.1 through 5.3.11 inclusively.

5.3

Steps

5.3.1 Preparation

5.3.1.1

Sand

the edges of the test specimens to remove

burrs, allowing close contact between the specimen, nega-

tive, and frame glass, resulting in a better defined etched pat-

tern.

5.3.1.2

Scrub

the copper surface(s) with FFF pumice and

brush to remove any contamination on the surface of the

specimen until it passes a water break test.

5.3.1.3

Dry

using compressed filtered air.

5.3.2

Apply Resist

5.3.2.1

Dip

the specimens in the following photo-resist solu-

tion:

• One part KPR III

• One part Toluene

• One part Acetone

All parts are by volume and should be used at room tempera-

ture. Specific gravity of the solution is 0.920.

5.3.2.2

Hold the specimen by one corner when dipping.

Allow excess solution to drain until dripping stops.

5.3.2.3

Put

the specimens on the rack (after draining) into

80°C oven for three to five minutes to dry and harden KPR.

5.3.2.4

Remove

the rack from the oven and allow the speci-

mens to cool to room temperature.

5.3.2.5

Place

the specimens upon the negative in the print-

ing frame with the copper side against the negative.

5.3.2.6

Expose

the mounted specimen for seven minutes,

75 mm from the fluorescent black light.

5.3.2.7

Develop

in trichlorethylene vapor for 15 seconds. It

may require two to six cycles until the pattern is clear. Air dry

the specimen after developing.

5.3.2.8

Use

artwork from MIL-P-13949.

5.3.3 Etch

per MIL-P-13949, Method A or B

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.3.1

Subject

Chemical

Processing, Suitable Processing Material

Date

4/73

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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