IPC-TM-650 EN 2022 试验方法.pdf - 第390页

1.0 Scope This solder pool test method provides a mea- surement of wetting characteristics of flux on/in flux-coated and/or flux-cored solder. 2.0 Applicable Documents J-STD-006 Requirements and Test Methods for Electron…

IPC-I-003166-

Figure

1 Test apparatus for spitting test

▼

Stand

Soldering Iron

Metal tray to

collect solder

Hole 11mm Diameter

45°

Metal tray

Aluminum Foil

Flux Cored Solder Wire

IPC-TM-650

Number

2.4.48

Subject

Spitting

of Flux-Cored Wire Solder

Date

1/95

Revision

age2of2

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1.0

Scope

This

solder pool test method provides a mea-

surement of wetting characteristics of flux on/in flux-coated

and/or flux-cored solder.

2.0

Applicable Documents

J-STD-006

Requirements

and Test Methods for Electronic

Grade Solder Alloys and Fluxed and Non-fluxed Solid Solders

for Electronic Soldering Applications

ASTM

B-36

Brass

Plate, Sheet, Strip, and Rolled Bar

3.0

Test Specimen

3.1

Three

approximately 30 mm long pieces of 1.5 mm

diameter, flux-cored wire solder, three approximate 2 gram

pieces of flux-coated, flux-cored, or flux-coated and flux-

cored ribbon solder, or three approximately 2 gram quantities

of flux-coated, flux-cored, or flux-coated and flux-cored solder

preforms.

3.2

Approximately

10 ml of flux extracted and prepared in

accordance with J-STD-006, and three pieces of 1.5 mm,

non-fluxed wire solder per J-STD-006.

4.0

Apparatus and Reagents

4.1

Three

flat pieces of 0.25 mm thick 70/30 brass (per

ASTM B-36 C2600 H02) approximately 75 x 40 mm.

4.2 Degreased

steel wool #00.

4.3

Solder

pot containing not less than 4 Kg of molten sol-

der at a stabilized temperature of 60 ± 10°C above the liqui-

dus temperature of the alloy used in the solder specimens,

and having a solder surface diameter of not less than 80 mm

and a solder depth of not less than 25 mm.

4.4

Mandrel

having a diameter of 3 ± 0.5 mm.

4.5

One

pair laboratory forceps suitable for use in handling

hot brass coupons.

4.6

Timer

with a seconds display.

5.0

Test Procedure

5.1 Preparation for Test

5.1.1

Thoroughly

clean three brass coupons with steel wool

and bend one corner of each coupon up at an angle of

approximately 60° to facilitate the handling of the coupons

with forceps.

5.1.2

Preparation of Test Specimen

5.1.2.1

When

using fluxed wire or ribbon solder specimens,

individually coil each piece of the solder specimen around

mandrel and place one coiled piece in the approximate center

of each brass test coupon.

5.1.2.2

When

using fluxed solder preform specimens, place

one approximately 2 gram quantity in the approximate center

of each brass test coupon.

5.1.2.3

When

using extracted flux and non-fluxed wire sol-

der, individually coil each piece of the non-fluxed solder speci-

men around mandrel, place one drop of flux (approximately

0.05 ml) in the approximate center of each brass test coupon,

and place one coiled piece of non-fluxed solder in the center

of the flux drop on each brass test coupon.

5.2

Test

CAUTION:

When moving the brass test coupons,

take extreme care to move coupons slowly and keep their test

surface horizontal, so that the tests are not prejudiced by

movement of flux or solder unrelated to the fluxing action.

5.2.1

Scrape

the surface of the molten solder in the solder

pot to remove any dross.

5.2.2

Carefully

place one test coupon on the surface of the

molten solder, leave for 15 ± 1 second, and remove it to a flat,

level surface allowing the solder pool to solidify undisturbed.

5.2.3

Repeat

step 5.2.2 with the remaining two test

coupons.

5.3

Evaluation

5.3.1

Visually

examine the surface of the test coupons for

any evidence of flux spattering as evidenced by spots of flux

and/or flux residue outside of the main pool of solder and flux

residue.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.49

Subject

Solder

Pool Test

Date

1/95

Revision

Originating Task Group

Solder Alloy Task Group (5-24c)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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5.3.2

Using

a suitable solvent, remove the flux residues from

the three coupons sufficient to clearly see the solidified solder

pool and the remaining brass coupon surface.

5.3.3

Visually

examine the thickness of the solder pool edge

on the surface test coupons for any evidence of non-wetting

or de-wetting.

5.3.4 The

fluxed solder and/or the solder from which the flux

was extracted shall fail this solder pool test if there is any evi-

dence of non-wetting, de-wetting, or flux spattering or if the

solder pool does not feather out to a thin edge.

Note:

Irregularly

shaped solder pools do not necessarily

indicate de-wetting or non-wetting.

6.0

Safety

Observe

all appropriate safety precautions.

Consult MSDS sheets for safety precautions for chemicals

involved in this test method.

IPC-TM-650

Number

2.4.49

Subject

Solder

Pool Test

Date

1/95

Revision

age2of2

电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ