IPC-TM-650 EN 2022 试验方法.pdf - 第772页
T able 5-3 245 °C Nominal Reflow Profile Specifications* V alue Time (Seconds) T emperature (°C) Description t1 198 ± 15 – Target preheat time t2 254 ± 10 – Target peak reflow time t3 311 ± 15 – Target cool-down start time …
IPC-2627-5-2
Figure 5-2 230 °C Nominal Reflow Profile Chart (Low Temperature Profile)*
230 °C Reflow Profile Specifications
t1 t2 t3
A
BC
DE
F
G
H
I
J
KL
M
N
T1
T2
30
60
90
120
150
180
210
240
270
300
0 60 120 180 240 300 360 420 480 540 600
Time (Seconds)
Temperature (°C)
USL LSL Example
IPC-TM-650
Number
2.6.27
Subject
Thermal Stress, Convection Reflow Assembly Simulation
Date
2/2020
Revision
B
Page6of10
Table 5-3 245 °C Nominal Reflow Profile Specifications*
Value Time (Seconds) Temperature (°C) Description
t1 198 ± 15 – Target preheat time
t2 254 ± 10 – Target peak reflow time
t3 311 ± 15 – Target cool-down start time
t3 - t1 113 ± 30 – Target time above T1
T1 – 217 Maximum preheat temperature
T2 – 245 ± 5 Target reflow temperature
Point Time (Seconds) Temperature (°C) Description
A030
Upper specification limit values
B 94 217
C 184 217
D 240 250
E 269 250
F 325 217
G 518 30
H3030
Lower specification limit values
I 148 88
J 212 217
K 245 240
L 264 240
M 297 217
N 361 30
Segment Slope (°C / second) Description
A-B & I-J 2.0 Maximum preheat rate
H-I 0.5 Minimum preheat rate
F-G -1.0 Minimum cool-down rate
M-N -3.0 Maximum cool-down rate
IPC-TM-650
Number
2.6.27
Subject
Thermal Stress, Convection Reflow Assembly Simulation
Date
2/2020
Revision
B
Page7of10
IPC-2627-5-3
Figure 5-3 245 °C Nominal Reflow Profile Chart*
* The times to t1, t2 and t3 may vary based on the mass of the sample test specimen.
IPC-TM-650
Number
2.6.27
Subject
Thermal Stress, Convection Reflow Assembly Simulation
Date
2/2020
Revision
B
Page8of10