IPC-TM-650 EN 2022 试验方法.pdf - 第359页

1.0 Scope This procedure defines a test method used to determine dimensional stability of glass reinforced, copper- clad, thin laminates intended for use in rigid multilayer printed boards. The test is appropriate for ch…

able 2 Initial Stackweight (Wo, grams) vs. Calculated Initial Thickness (ho, mils)

104

106 108 112 113 116 7628

Wo ho Wo ho Wo ho Wo ho Wo ho Wo ho Wo ho

20 1.03 25 1.28 40 1.95 35 3.13 35 2.97 45 3.82 80 6.71

21 1.10 26 1.35 41 2.02 36 3.24 36 3.09 46 3.94 81 6.73

22 1.16 27 1.41 42 2.08 37 3.36 37 3.21 47 4.06 82 6.85

23 1.23 28 1.48 43 2.15 38 3.48 38 3.32 48 4.17 83 6.97

24 1.29 29 1.54 44 2.21 39 3.60 39 3.44 59 4.29 84 7.08

25 1.36 30 1.61 45 2.28 40 3.71 40 3.56 50 4.41 85 7.20

26 1.43 31 1.68 46 2.34 41 3.83 41 3.67 51 4.52 86 7.32

27 1.49 32 1.74 47 2.41 42 3.95 42 3.79 52 4.64 87 7.44

28 1.56 33 1.81 48 2.47 43 4.07 43 3.91 53 4.76 88 7.55

29 1.62 34 1.87 49 2.54 44 4.18 44 4.03 54 4.88 89 7.67

30 1.69 35 1.94 50 2.60 45 4.30 45 4.14 55 4.99 90 7.79

31 1.75 36 2.00 51 2.67 46 4.42 46 4.26 56 5.11 91 7.91

32 1.82 37 2.07 52 2.73 47 4.54 47 4.38 57 5.23 92 8.02

33 1.88 38 2.13 53 2.80 48 4.65 48 4.50 58 5.35 93 8.14

34 1.95 39 2.20 54 2.86 49 4.77 49 4.61 59 5.46 94 8.26

35 2.01 40 2.26 55 2.93 50 4.89 50 4.73 60 5.58 95 8.38

36 2.08 41 2.33 56 2.99 51 5.01 51 4.85 61 5.70 96 8.49

37 2.14 42 2.39 57 3.06 52 5.12 52 4.97 62 5.82 97 8.61

38 2.21 43 2.46 58 3.13 53 5.24 53 5.08 63 5.95 98 8.73

39 2.27 44 2.52 59 3.19 54 5.36 54 5.20 64 6.05 99 8.85

40 2.34 45 2.59 60 3.26 55 5.48 55 5.32 65 6.17 100 8.96

41 2.40 46 2.65 61 3.32 56 5.59 56 5.44 66 6.29 101 9.08

42 2.47 47 2.72 62 3.39 57 5.71 57 5.55 67 6.40 102 9.20

43 2.53 58 2.78 63 3.45 58 5.83 58 5.67 68 6.52 103 9.32

44 2.60 59 2.85 64 3.52 59 5.95 59 5.79 69 6.64 104 9.43

45 2.66 50 2.91 65 3.58 60 6.06 60 5.91 70 6.76 105 9.55

Wo = grams, ho = mils; (n) for 104, 106, 108 = 18; (n) for 112, 113, 116 7628 = 10

Reference Documents

1. Journal of Elastomers and Plastics, 10,367 (1978), C.J. Bartlett

2. Journal of Elastomers and Plastics, 10,365 (1978) D.P. Bloechle

3. IPC-TP-281, The Use of Scaled Flow Testing for B-Stage Prepreg, C.J. Bartlett, D.P. Bloechle, W.A. Mazeika

4. IPC-TP-418, Application of Scaled Flow Testing as an Incoming Inspection Criteria, H.J. Brown

5. IPC-TP-420, Scaled Flow for Testing CRC Prepreg, J. Del, P. Marx, J. Sallo

6. D.P. Bloechle, ‘‘Epoxy Prepreg Characterization using Scaled Flow Testing Techniques,’’ Circuit World, 9,1 (1982), p.8

IPC-TM-650

Number

2.4.38

Subject

Prepreg

Scaled Flow Testing

Date

6/91

Revision

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1.0

Scope

This

procedure defines a test method used to

determine dimensional stability of glass reinforced, copper-

clad, thin laminates intended for use in rigid multilayer printed

boards.

The test is appropriate for checking material consistency. It is

not intended for defining suitability of the raw material to be

used in a specific printed board product or process.

2.0

Applicable Documents

IPC-TR-483

‘‘Dimensional

Stability Testing of Thin Lami-

nates’’

3.0

Test Specimen

The

specimen shall be 300 mm x 280

mm [12 in x 11 in] in size with the warp direction in the 300

mm dimension. A minimum of three specimens is required per

inspection lot. When evaluating laminate sheets, specimens

should be taken from opposite diagonal corners and from the

center of the sheet. For precut panels three randomly selected

panels shall be used to obtain the test specimens.

4.0

Apparatus

4.1

The

measurement apparatus shall be capable of mea-

suring the specimen within an accuracy of 0.0125 mm

[0.0005 in], over 250 mm [10.0 in] dimension. (Supergauge, or

equivalent, may be used.)

4.2

Ovens

used for baking must be of the air circulating type

and capable of ± 2°C control. The recovery time of the tem-

perature must be less than 15 minutes after specimens are

placed in the oven.

4.3

stabilization chamber (drying cabinet) containing cal-

cium chloride or silica gel capable of maintaining less than 20

RH at 21 ± 2°C.

5.0

Test Procedure

5.1 Preparation of the Specimen

5.1.1

Mark

the specimen for traceability in the identification

area (see Figure 1). No mechanical or chemical pre-cleaning is

permitted on the specimen.

5.1.2

Prepare

the four location points (see Figure 1) by drill-

ing or scribing.

5.1.3

Measure

distances Fl, F2, W1, and W2 utilizing the

apparatus defined in paragraph 4.1. Define distances to the

nearest 2.5 microns [0.0001 in]; the last digit of the reading

may be estimated. Record all values as initial measurements.

5.1.3.1

optical measurement must be used, a rigid plate

shall maintain the test specimen in a flat and horizontal posi-

tion.

5.1.4

Place

a 12 mm [0.5 in] diameter tape dot over holes

or scribe marks on side of laminate to be measured and a

piece of 25 mm x 12 mm [1.0 in x 0.5 in] wide tape over iden-

tifying information.

IPC-2439-a

Figure

1 All dimensions are in inches. Four

measurements are required as indicated. Locate

measuring points approximately 12.7mm [0.500 in] from

each edge in the ﬁll direction, and 25.4 mm [1.00 in] from

each edge in the warp direction.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.39

Subject

Dimensional

Stability, Glass Reinforced Thin

Laminates

Date

2/86

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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5.2

Copper Removal

Remove

copper by etching in cupric

chloride containing spray etcher at less than 50°C (122°F).

Rack samples upon exit from etcher, rinse, remove the tape,

and air-dry laminate. Submit to bake cycle (paragraph 5.3)

within four hours. (

Note:

not use resist stripping solutions.)

5.3 If only the thermal stress cycle is to be used proceed to

5.5. If not, proceed to 5.4.

5.4

Bake Cycle

5.4.1

Bake

specimens at 105°C ± 5°C for four hours ± 10

minutes. Vertically rack and place specimens in oven parallel

to air flow with specimens being separated by a minimum of

1/2 inch.

5.4.2

After

baking, immediately place the test specimens in

a stabilization chamber (paragraph 4.3).

5.4.3

Remove

from stabilization chamber after one hour

⁄

/-0

hours and, within 5 minutes, measure W1

and

using the apparatus defined in paragraph 4.1.

5.4.4

the thermal stress cycle is to be included in this test,

proceed to paragraph 5.5. If not, proceed to 5.6.

5.5

Thermal Stress Cycle

After

the bake cycle measure-

ment (5.4), if immediate further processing is not feasible,

place specimens in a stabilization chamber until test is contin-

ued.

5.5.1

a stabilization chamber is used, remove from the

stabilization chamber and bake specimens at 150°C ± 5°C for

two hours ± 5 minutes. Vertically rack and place specimens in

oven parallel to air flow, with specimens being separated by a

minimum of 1/2 in.

5.5.2

After

baking, immediately place the test specimen in a

stabilization chamber (paragraph 4.3).

5.5.3

Remove

from stabilization chamber after 1 hour + 1/ 2

hour, -0 hours, and, within 5 minutes, measure W1, W2, F1,

and F2, using the apparatus indicated in paragraph 4.1.

Record values as W1

and F2

5.6

Evaluation

Determine

the change in dimensional sta-

bility using the following formulation:

5.6.1

Warp Evaluations

Warp =

− W1

= Mils/per

inch for W1 after bake

− W2

= Mils/per

inch for W2 after bake

Repeat for W1

and

for

after stress

Where W1/W2 = initial dimensions,

/W2

after bake dimensions, and

/W2

after thermal stress.

5.6.2

Fill Evaluations

Fill =

− F1

= Mils/per

inch for F1 after bake

− F2

= Mils/per inch for F2 after bake

Repeat for F1

and

for

after stress

Where F1/F2 = initial dimensions,

/F2

after bake dimensions, and

/F2

after thermal stress.

5.6.3

Calculations

Take

the warp dimensions made on all

the measured specimens and determine the mean value for

the warp dimensional stability characteristics of the laminate

after bake. Follow similar procedures on the calculations for

the fill dimensional stability characteristics after bake. Extreme

values should be eliminated using the procedure defined in

paragraph 5.6.4. Similar measurements are made to calculate

the after thermal stress dimensional stability characteristics.

5.6.4

Extreme Value Eliminated

Take

measurements in

subgroup (warp or fill) and arrange in descending order of

magnitude. Solve for D, using procedure detailed in Table 1. If

calculated D is larger than the value of D shown in Table 2 for

the number of measurements being evaluated, the outlier is

significant and should be deleted.

6.0 Notes

The following is a checklist that should be used

by personnel responsible for performing this method in order

to provide repeatable/correlatable results. The IPC Dimen-

sional Stability Task Group responsible for the technical report

on dimensional stability has determined that checklist items 2,

5, 6, 9, 14, 15, 16 and 18 are critical to appropriate use of this

procedure. (See IPC-TR-463.)

IPC-TM-650

Number

2.4.39

Subject

Dimensional

Stability, Glass Reinforced Thin Laminates

Date

2/86

Revision

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