IPC-TM-650 EN 2022 试验方法.pdf - 第387页

6.0 Notes 6.1 Safety Observe all appropriate precautions on MSDS for chemicals involved in this test method. IPC-TM-650 Number 2.4.47 Subject Flux Residue Dryness Date 1/95 Revision P a g e3o f2 电子技术应用ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ

the center of the depression in one of the cleaned copper

test pieces (5.1).

Note:

This

may conveniently be done, if solder wire is used,

by forming the wire into a tight spiral.

5.1.4.2

the flux under test is in solid or paste form—weigh

between 0.035g and 0.040g of the solid or paste flux and add

this to the solder in the depression of the test piece.

5.1.4.3

the flux under test is in liquid form—first determine

it’s non-volatile matter content by the use of the method

described in ISO 9455: Part 1 or Part 2. Then add the appro-

priate volume of the liquid flux, to contain between 0.035g and

0.040g of non-volatile matter, to the solder in the depression

of the test piece. Evaporate the solvent at 60°C for 10 minutes

in the drying oven (5.3).

Note:

the liquid flux has low non-volatile content, it may be

necessary to add the flux in two increments, carrying out the

evaporation procedure after each addition.

5.1.5

For

flux cored solder samples. Degrease the surface

of a suitable length of the cored solder sample, using a cloth

dampened with the solvent (4.3). Weigh 1.00 +/–0.05g of the

degreased sample, form it into a small flat coil and place it in

the center of the depression in one of the cleaned copper test

pieces (5.1).

5.1.6

For solder paste samples. Weigh 0.50 +/–0.05g of the

solder paste sample into the center of the depression in one

of the cleaned copper test pieces (5.1).

5.2

Heating

the test piece.

5.2.1

Using

the tongs (4.11), or other suitable means, care-

fully lower the prepared test piece from 7.1 onto the surface

of the molten solder, maintained at 235 +/–5°C in the solder

bath (4.8).

5.2.2

Allow

the test piece to float on the solder bath until the

solder melts and leave the test piece in this position for a fur-

ther 5 seconds. Remove the test piece carefully from the bath

and allow it to cool, in air, in a horizontal position for 30 min-

utes.

5.3

Examination

of the test piece. Dust the surface of the

flux residue on the test piece liberally with the powdered chalk

(4.4). Lightly brush the chalked surface with the soft brush

(4.12).

5.4

Evaluation

If the chalk powder is easily removed by

brushing, the flux is deemed to be ‘‘not tacky.’’ If the chalk

powder cannot be removed by brushing, or can be removed

only with difficulty, the flux is deemed to be ‘‘tacky.’’

IPC-TM-650

Number

2.4.47

Subject

Flux

Residue Dryness

Date

1/95

Revision

age2of2

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6.0

Notes

6.1 Safety

Observe

all appropriate precautions on MSDS

for chemicals involved in this test method.

IPC-TM-650

Number

2.4.47

Subject

Flux

Residue Dryness

Date

1/95

Revision

age3of2

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1.0

Scope

This

test method provides a measurement of

the spitting characteristics of flux-cored wire and ribbon sol-

der.

2.0

Applicable Documents

J-STD-006

Requirements

and Test Methods for Electronic

Grade Solder Alloys and Fluxed and Non-fluxed Solid Solders

for Electronic Soldering Applications

3.0

Test Specimen

One

five meter length of the J-STD-

006 flux-cored wire or ribbon solder (may be cut into several

smaller lengths for convenient handling).

4.0

Apparatus

4.1

One

laboratory stand with soldering iron support clamp

and metal support ring or tray with a suitable hole in center.

4.2

One

20 by 20 cm piece of aluminum foil with 11 ± 0.5

mm diameter hole in center.

4.3

One

small metal tray with suitable hole in center, for

catching molten solder running down off of the soldering iron

tip.

4.4 One

soldering iron with a clean chisel point which has

been coated with solder and wiped clean.

5.0

Test Procedure

5.1 Preparation for Test

5.1.1

Using

additional pieces of solder identical to the test

specimen, determine the flux content of the flux cored solder

in accordance with IPC-TM-650, Test Method 2.3.34.1 and

expressed in percentage units (%F).

5.1.2

Set

up test configuration as shown in figure 1. The

soldering iron should be positioned so that its tip extends

approximately 6 mm through the aluminum foil.

5.1.3 Weight

the aluminum foil (P1) and place it on the labo-

ratory stand tray/ring so that the 11 mm hole is centered

around the tip of the soldering iron.

5.1.4

Weight

the solder sample (W1).

5.1.5 Turn on soldering iron and allow the tip temperature to

stabilize.

5.2

Test

5.2.1

Apply

the solder sample to the heated soldering iron

tip approximately at an even rate, 1 cm at a time, keeping the

soldering iron tip temperature steady.

5.3

Evaluation

5.3.1

Weight

the stub(s) of the solder specimen not melted

in the test (W2).

5.3.2

Weight

the aluminum foil containing the spattered flux

(P2).

5.3.3

Calculate

the percent weight of spattered flux as fol-

lows:

Percent by weight of spattered flux =

(P2−P1)

Fx(W

1−W2)

6.0

Notes

6.1 Safety

Observe

all appropriate safety precautions.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.48

Subject

Spitting

of Flux-Cored Wire Solder

Date

1/95

Revision

Originating Task Group

Solder Alloy Task Group (5-24c)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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