IPC-TM-650 EN 2022 试验方法.pdf - 第266页

IPC-249-5 Figure 5 Failure Modes with Adhesiveless Metal Foil Polyimide Film Start Metal = P olyimide Failure to Metal F oil PS = P olyimide Shatter Force (Chart Record) Metal PS IPC-TM-650 Number 2.4.9 Subject Peel Stre…

IPC-249-4

Figure 4 Typical Failure Modes with Adhesive

NOTE: Zipper failure (also termed Slipstick failure): A peel failure that propagates faster than the crosshead speed and oscillates from

the interface between the adhesive layer and the metal foil through the cohesive layer of the adhesive itself to the adhesive interface

with the dielectric film and into the dielectric film where it fails cohesively and reverses this failure. It also exhibits itself by peel strengths

that vary widely from a gradual build to a maximum peel value to a nearly instantaneous drop to no peel value at all in a cyclic manner.

Metal Foil

Adhesive Layer

Polyimide Film

Force

(Chart Record)

Start

Metal

Zippered

Effect

CA = Cohesive Failure within Adhesive Layer

Metal = Adhesive Failure to Metal Foil

P = Adhesive Failure to Polyimide Film

PS = Polyimide Shatter

Z = Zipper Failure within Adhesive Layer (surface-to-surface)

IPC-TM-650

Number

2.4.9

Subject

Peel Strength, Flexible Dielectric Materials

Date

04/14

Revision

Page5of6

IPC-249-5

Figure 5 Failure Modes with Adhesiveless

Metal Foil

Polyimide Film

Start

Metal = Polyimide Failure to Metal Foil

PS = Polyimide Shatter

Force

(Chart Record)

Metal

IPC-TM-650

Number

2.4.9

Subject

Peel Strength, Flexible Dielectric Materials

Date

04/14

Revision

Page6of6

Scope

The

purpose of this test is to characterize peel

adhesion at ambient conditions.

Applicable Documents

IPC-3408

General

Requirements for Anisotropically Con-

ductive Adhesive Films.

Test Specimens

3.1

mm pitch (center-to-center) flex test circuits and 1 mm

pitch (center-to-center) test boards

Apparatus

4.1

Soda-lime

glass test slides or printed circuit boards

4.2

All

other test materials listed in IPC-3408

4.3

‘Instron-1122’

tensile tester or equivalent, equipped with

air-powered jaws and 50 kg load cell, adjustable to 10 kg full

scale

4.4

Test

fixture, mountable on lower stage of tensile tester

Procedure

5.1 Sample Preparation

5.1.1

Cut

flex test circuits to the appropriate length (see Fig-

ure 1).

5.1.2

Use

of new PCBs is recommended. If new boards are

being used there should be no need for any special cleaning

procedure. If used boards are to be used, they should be

inspected to ensure that:

a) Protective metalization (Au or Pb-Sn) is intact,

b) FR-4 isn’t significantly discolored from prior high tempera-

ture exposure,

c) The board is free of any residue from previous tests.

5.1.3

Refer

to IPC-3408 for proper bonding procedure.

5.2

Procedure

5.2.1

Prepare at least three, and preferably five, samples for

each test point to be measured.

5.2.2

Confirm

proper calibration of the tensile tester, and

ensure proper full-scale setting.

5.2.3 Mount

sample in test fixture. Secure the flex circuit tail

into the air-powered jaws on the cross-head stage, being

careful to place the jaws as close to and as square to the

bond-line as possible.

5.2.4

Peel

the sample at a rate of 2.5 mm/min., and record

the peak adhesion value.

5.2.5

Repeat

steps 3 and 4 for all additional samples. Com-

pute the average adhesion value and record.

IPC-3408-fig1

Figure

1 Sample Pattern

1 mm Pitch Flex, 17 traces

20 mm x 20 mm

ACF, 0.050 mm, 3.2 mm x 20 mm

a) Flex-Board

b) Flex-Glass

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.9.1

Subject

Peel

Strength of Flexible Circuits

Date

11/98

Revision

Originating Task Group

SMT Mounting Adhesives Task Group (5-24d)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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