IPC-TM-650 EN 2022 试验方法.pdf - 第296页
5.3.2 Elongation shall be calculated by the following for- mula: D 2-D 1 D1 x 100 = % Elongation Where: D1 = Initial grip separation 101.6 mm D2 = Grip separation at break Average the five values obtained for the machine…

1
Scope
This
test is to determine the tensile strength and
elongation on specimens exposed to mechanical loads.
2
Applicable Documents
None
3
Test Specimen
The
test specimen shall consist of a strip
of flexible material 152.4 mm long x 12.7 mm wide. A mini-
mum of 10 specimens, five from the machine direction, and
five from the transverse direction, shall be prepared.
4
Apparatus
4.1 Equipment
Tinius-Olson
Super L Tester or equivalent
(with appropriate load cell). The machine used for tension test-
ing shall be in current calibration. The loads used in determin-
ing tensile strength shall be within the loading range of the
testing machine.
4.2
Gripping Devices
Various
types of gripping devices
may be used to transmit the measured load applied by the
testing machine to the test specimens. To ensure axial tensile
stress within the gauge length, the axis of the test specimen
should coincide with the centerline of the heads of the testing
machine.
4.3
Sample Cutter
Thwing
Albert Sample Cutter, Model
No. JDC-50, or equivalent.
4.4
Etcher
4.5
Sander
4.6
Micrometer
with 0.0025 mm resolution
4.7
Conditioning
chamber or work area 23°C ± 2°C, 50% ±
5% RH
5
Procedure
5.1 Preparation of Specimens
5.1.1
Condition
specimens for 24 hours at 23°C ± 2°C and
50% ± 5% relative humidity (RH). Stabilization time may be
reduced if statistically sound evidence has been generated on
the specific product line to support shorter conditioning times
to reach equilibrium.
5.1.2
Cut
at least 10 specimens, 152.4 mm long by 12.7
mm wide, using a precision sample cutter, which produces
smooth and undistorted edges. Specimens may be sanded
on the edges with 400-600 grit emery paper to further smooth
the edges and improve the repeatability of the test.
5.2
Test
5.2.1
Measure
and record the width and thickness of the
specimen at several points along its length. Calculate the mini-
mum cross-sectional area using the measured width. For
coated materials, ignore the thickness of the coating,
assumed to contribute nothing to the tensile properties of the
composite, and use the nominal substrate thickness for the
cross-sectional area calculation.
5.2.2
Set
the grip separation to 101.6 mm and the rate of
grip separation to 50.8 mm per minute.
5.2.3
Place
the test specimen in the grips of the testing
machine, taking care to align it with the centerline of the grips.
There should be no slack in the specimen.
5.2.4
Start
the machine and record load versus extension
(grip separation).
5.3
Evaluation
5.3.1
Tensile
strength shall be calculated by dividing the
load at break by the original cross-sectional area of the speci-
men. Average the five values obtained for the machine direc-
tion samples and report the average. Average the five values
obtained for the transverse direction samples and report the
average.
2215
Sanders Road
Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.4.19
Subject
Tensile
Strength and Elongation, Flexible Printed
Wiring Materials
Date
5/98
Revision
C
Originating Task Group
Flex Peel Strength Test Methods Task
Group (D-13A)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
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5.3.2
Elongation
shall be calculated by the following for-
mula:
D2-D1
D1
x
100 = % Elongation
Where:
D1 = Initial grip separation 101.6 mm
D2 = Grip separation at break
Average the five values obtained for the machine direction
samples and report the average. Average the five values
obtained for the transverse direction samples and report the
average.
6 Notes
If
a statistically sound evaluation shows that MD
and TD differ, the direction giving the lower measurement shall
be the only direction tested. If the two are the same, only MD
needs to be tested.
IPC-TM-650
Number
2.4.19
Subject
Tensile
Strength and Elongation, Flexible Printed Wiring
Materials
Date
5/98
Revision
C
P
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1 Scope This test method is to determine the land bond
strength of unsupported holes, after repeated soldering and
unsoldering, by mechanical pull in the perpendicular plane.
2 Applicable Documents
IPC-2221
Generic Standard on Printed Board Design
3 Test Specimen Any unsupported component hole
sample or test coupon ‘‘A’’ or ‘‘A/B’’ described in IPC-2221.
Three holes per sample or test coupon shall be tested.
4 Apparatus or Material
4.1 Soldering Iron
60-watt soldering iron capable of pro-
ducing a tip temperature of 232 °C to 260 °C [450 °F to
500 °F].
4.2 Force Tester Vertical pull force tester capable of oper-
ating at a speed of 50.0 mm [2.0 in] per minute and measur-
ing up to 9 kg [20 pounds] load.
4.3 Tinned or solder coated copper wire.
5 Procedure
5.1 Preparation
5.1.1
If conductors are connected to the land area, the fol-
lowing procedure is to be followed:
Take a sharp model knife and cut conductor at least 6.0 mm
[0.2 in] away from the land. Place blade of knife on edge of
land area where conductor enters. While holding the blade
down, pull conductor to the land and use knife blade as ful-
crum to break conductor from land without disturbing bond of
the land.
5.1.2 Insert wire so that the portion extending from the sol-
dered side of the circuit may be fitted into the gripping mecha-
nism of a tensile tester. The wires shall have a diameter
between 150 µm and 500 µm [5,906 µin and 19,685 µin] less
than the diameter of the hole. The wires shall not be clinched.
Select suitable wire of sufficient length to connect to gripping
mechanism of bond strength tester.
5.1.3 Insert wire in holes in selected lands and solder to
lands by machine or hand, as applicable. The wire shall not be
clinched.
5.2 Soldering Cycles
5.2.1
The hand soldering and desoldering operation of the
wire shall be performed as follows:
Step 1: Solder wire into lands
Step 2: Remove (desolder) wire from lands
Step 3: Resolder wire into lands
Step 4: Remove (desolder) wire from lands
Step 5: Resolder wire into lands
During the desolder and solder steps, solder every other land
in the row and allow the specimen to cool to room tempera-
ture. Then solder the remaining lands.
5.2.2 During the solder and desoldering steps, the soldering
and/or desoldering iron shall have a tip temperature as follows
(see 6.1):
Method A: 260 °C [500 °F] - Default method
Method B: 315 °C [599 °F]
Method C: 371 °C [700 °F]
5.3 Pull Test
5.3.1
Following the fifth cycle, clamp the test specimen suf-
ficiently in the jaws of the bond tester to assure that the test
specimen is perpendicular to the direction of pull.
5.3.2 Apply a pull at the rate of 50.0 mm per minute [2.0 in
per minute] to the wire on the pattern side of the test speci-
men.
5.3.3 The load must be applied perpendicular to the major
surface of the land. The load shall be applied until failure
occurs or the minimum force as specified by the procurement
documentation is reached. The formula to calculate force for
circular lands is as follows:
4L
π(D2
2
–D1
2
)
3000 Lakeside Drive
Bannockburn, IL 60015-1249
IPC-TM-650
TEST METHODS MANUAL
Number
2.4.21
Subject
Land Bond Strength, Unsupported Component Hole
Date
01/07
Revision
F
Originating Task Group
Rigid Printed Board Performance Task Group
(D-33a)
Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.
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ELECTRONICS INDUSTRIES
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