IPC-TM-650 EN 2022 试验方法.pdf - 第273页

1 Scope This test method establishes and defines the pro- cedures for determining the solder float resistance of copper foil clad and bare flexible dielectric material. 2 Applicable Documents J-STD-004 Requirements for S…

Figure

2 Aid to Evaluation

IPC-2412-2a-d

IPC-TM-650

Number

2.4.12

Subject

Solderability,

Edge Dip Method

Date

6/91

Revision

age3of3

电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ

Scope

This

test method establishes and defines the pro-

cedures for determining the solder float resistance of copper

foil clad and bare flexible dielectric material.

Applicable Documents

J-STD-004

Requirements

for Soldering Fluxes

Test Specimen

3.1

Two

specimens, approximately 50 mm x 50 mm per

clad side.

3.2

For

double clad laminate, a separate specimen unit shall

be prepared and tested for each side. The copper foil shall be

etched from the reverse or nontest side of each specimen

using standard commercial practices. Bare dielectric material

shall be tested bare.

Apparatus

4.1 Test Chamber

circulating air chamber capable of

maintaining a uniform temperature of 135°C ± 10°C.

4.2

Solder Pot

electrically-heated, thermostatically-

controlled solder pot of adequate dimensions to accommo-

date the specimen and containing no less than 2.25 Kg of

solder.

4.3

Cutter

template and cutter to prepare approximately 50

mm x 50 mm specimens of copper clad dielectric material.

4.4

Solder

float test fixture as per Figure 1.

4.5

Sn60,

Sn62, or Sn63 solder conforming to J-STD-004.

Procedure

5.1

Prepare

two specimens, clean the copper foil, then pre-

condition the test specimen in an air circulating oven main-

tained at 135°C ± 10°C for one hour. Specimens may then be

held in a room temperature desiccator.

5.2

Remove

the specimens from the conditioning chamber.

5.3 Attach

the specimens to the solder float test fixture with

a thumb tack or other low mass holding device (Figure 1) prior

to floating the sample. Float the specimen, foil side down, on

the surface of the molten solder, maintained at the tempera-

ture specified in Table 1, for 10 seconds.

able 1 Solder Float Temperatures

Method

A 260°C ± 5°C

Method B 288°C ± 5°C

5.4

Float

the specimen on the surface, then remove the

specimens and tap the edges to remove excess solder.

5.5

Evaluation

Thoroughly

clean each specimen and visu-

ally examine for blistering, delamination or wrinkling. For bare

dielectric films, examine for blistering, shrinkage, distortion or

melting.

6 Notes

6.1

For

materials that absorb moisture, the preconditioning

in this method is required to remove absorbed moisture from

the materials. Absorbed moisture can volatilize and cause

delamination and blistering because of the rapid temperature

rise experienced in the solder bath. Drying may not be

required for materials with low moisture absorption character-

istics.

IPC-1412-1

Figure

1 Solder ﬂoat test ﬁxture

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.13

Subject

Solder

Float Resistance Flexible Printed Wiring

Materials

Date

5/98

Revision

Originating Task Group

Flex Peel Strength Test Methods Task

Group (D-13A)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

age1of1

电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ

1.0

Scope

This

test method is designed to determine the

thermal integrity of unclad or metallic clad laminates using

short-term solder exposure.

2.0

Applicable Documents

IPC-TM-650 Test Methods Manual

Method

2.1.1, Microsectioning

MIL-F-14256

Flux,

Soldering, Liquid (Rosin Base)

3.0

Test Specimens

3.1 Size and Configuration

Unless

otherwise specified,

specimens shall be 50.8 mm x 50.8 mm ± 0.75 mm [2.00 x

2.00 in ± 0.30 in] by the thickness of the laminate. Metallic

clad laminate shall include specimens which are completely

clad and fully etched.

3.2

Quantity and Sampling

Unless

otherwise specified,

for each clad side and for each test condition, three speci-

mens shall be used for qualification testing and two speci-

mens for lot acceptance testing. Specimens may be cut from

anywhere in the sheet of material except no specimen shall be

taken closer than 25.4 mm [1.0 in] from any edge as lami-

nated.

4.0

Apparatus or Material

4.1 Oven

Air

circulating oven capable of maintaining a tem-

perature of 125 ± 2°C [257 ± 3.6°F].

4.2

Solder Bath

Electrically

heated solder pot; thermostati-

cally controlled; containing at least 1.0 kilograms of solder;

and capable of maintaining the specified temperature. Unless

otherwise specified, the temperature shall be 288 ± 5.5°C

[550 ± 10°F]. Type Sn60 or Sn63 shall be used.

4.3

Temperature Indicator

Thermocouple

or other device

capable of measuring the solder temperature at a depth of

25.4 mm [1 in] below the surface and capable of measuring

to within ± 2°C [3.6°F] at the solder temperature specified.

4.4

Desiccator

desiccation chamber capable of main-

taining an atmosphere less than 30% RH at 23°C [73.4°F].

4.5

Optical Magnification

4.5.1 Microscope

Range

100 to 200 X (for referee testing

only).

4.5.2

Magnifier

Magnifying

loupe, or equivalent, capable

of magnification of 4X to 10X.

4.6

Timer

Stop

watch, or equivalent, capable of measuring

to within 0.2 seconds.

4.7

Water White Rosin Flux

Type

R per MIL-F-14256.

4.8

Cutting Apparatus

Diamond

saw, shear or other

device capable of cutting to the specified size without exces-

sive damage or stress on the material.

4.9

Etching System

Etching

system capable of complete

removal of metallic cladding.

4.10

Flux Cleaning Solvent

Isopropyl

alcohol, flux thinner,

or equivalent.

5.0

Procedure

Specimens

shall be tested in accordance

with the following procedure.

5.1

Specimen Preparation

5.1.1 Etching

One-half

of the metallic clad laminate sam-

pling shall be completely etched in accordance with standard

industry practices.

5.1.2

Cutting

The

specimens shall be cut to size from the

unetched and etched samples by suitable means. The edges

shall be cleaned and smoothed by light sanding.

5.1.3

Conditioning

For

referee or qualification purposes,

specimens shall be placed in an air-circulating oven main-

tained at 125°±2°C [257 ± 3.6°F] for 4 to 6 hours. After

removal from the oven, place specimens in a desiccator and

allow to cool to room temperature.

5.2

Measurement

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.13.1

Subject

Thermal

Stress of Laminates

Date

12/94

Revision

Originating Task Group

MIL-P-13949 Test Methods Task Group (7-11b)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

age1of2

电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ