IPC-TM-650 EN 2022 试验方法.pdf - 第735页

photolithographic processes such that a minimum of twelve good specimens are yielded at the end of 3.4.5. On the ‘‘Test Surface,’’ etch four conductors 3.2 mm [0.126 in] wide, 5.7 mm [0.224 in] pitch, 230 - 250 mm [9 - 1…

1 Scope This test method describes the procedure for

establishing the service temperature for metal-clad flexible

base material (laminate) as described in IPC-4204 as well as

cover materials and adhesive bonding films (unsupported

adhesive and supported bond plies) as described in IPC-

4203. For purposes of this test method, cover material shall

consist of coverlay and coverfilm but shall not include cover-

coat materials. Properties evaluated after thermal aging in this

test are: visual, peel strength and dielectric strength.

2 Applicable Documents

2.1 IPC

IPC-T-50 Terms and Definitions for Interconnecting and

Packaging Electronic Circuits

IPC-TM-650 Test Methods Manual

2.4.9 Peel Strength, Flexible Dielectric Materials

2.4.13 Solder Float Resistance Flexible Printed Wiring

Materials

IPC-4203 Adhesive Coated Dielectric Films for Use as Cover

Sheets for Flexible Printed Circuitry and Flexible Adhesive

Bonding Films

IPC-4562 Metal Foil for Printed Board Applications

2.2 ASTM International

ASTM D-149 Standard Test Method for Dielectric Break-

down Voltage and Dielectric Strength of Solid Electrical Insu-

lating Materials at Commercial Power Frequencies

3 Bond Strength Test Procedure

3.1 Specimen Preparation for Metal-Clad Flexible Base

Material (Laminate)

3.1.1

Prepare twelve specimens according to the procedure

outlined for method A of IPC TM-650, method 2.4.9, using

appropriate photolithographic processes. Etch four conduc-

tors 3.2 mm [0.126 in] wide, 5.7 mm [0.224 in] pitch, 230 -

250 mm [9 - 10 in] long on a nominal 25 mm [1 in] wide strip

of flexible base dielectric (see Figure 1).

Single-clad or double-clad flexible base material shall be

tested in the format supplied. If the flexible base material

under test is double-clad, prepare a separate set of speci-

mens for each side. It is permissible to leave the unetched

copper on the non-test side (see Notes 6.1 and 6.2).

3.2 Specimen Preparation for Cover Material

3.2.1

Single-clad base material shall be produced from

specimens of the cover materials. Cover material shall be

bonded to the shiny side of 34.3 µm [1.35 mil] copper foil,

type CU-E1-1S or CU-E7-1S per IPC-4562 (CU-E1-1S shall

be the referee material). Copper foil cleaning shall be per the

manufacturer’s normal cleaning procedure. The referee clean-

ing procedure shall be per Table 1.

3.2.2 Prepare twelve specimens according to the procedure

outlined for method A of IPC TM-650, method 2.4.9, using

appropriate photolithographic processes. Etch four conduc-

tors 3.2 mm [0.126 in] wide, 5.7 mm [0.224 in] pitch, 230 -

250 mm [9 - 10 in] long on a nominal 25 mm [1 in] wide strip

of flexible base dielectric (see Figure 1).

3.3 Specimen Preparation for Adhesive Bonding Film

3.3.1

Metal-clad flexible base material shall be produced

from specimens of the adhesive bonding film being evaluated.

Adhesive bonding film shall be bonded to the shiny side of

34.3 µm [1350 µin] ED copper foil, type CU-E1-1S or RA

copper foil, CU-E7-1S per IPC-4562 (CU-E1-1S shall be the

referee material). Adhesive bonding film shall be bonded

between the copper foil and CU-E1-1S as support material as

illustrated in Figure 2. Copper foil cleaning shall be per the

manufacturer’s normal cleaning procedure. The referee clean-

ing procedure shall be per Table 1, the same as detailed in

IPC-4203.

Prepare specimens according to the procedure outlined for

method A of IPC TM-650, method 2.4.9, using appropriate

1. www.ipc.org

2. Current and revised IPC Test Methods are available on the IPC Web site (www.ipc.org/html/testmethods.htm)

3. www.astm.org

3000 Lakeside Drive, Suite 309S

Bannockburn, IL 60015-1249

IPC-TM-650

TEST METHODS MANUAL

Number

2.6.21

Subject

Service Temperature of Metal-Clad Flexible Laminate,

Cover Material and Adhesive Bonding Films

Date

6/11

Revision

Originating Task Group

Flexible Circuits Test Methods Subcommittee

(D-15)

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

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photolithographic processes such that a minimum of twelve

good specimens are yielded at the end of 3.4.5. On the ‘‘Test

Surface,’’ etch four conductors 3.2 mm [0.126 in] wide,

5.7 mm [0.224 in] pitch, 230 - 250 mm [9 - 10 in] long on a

nominal 25 mm [1 in] wide strip of flexible base dielectric (see

Figures 1 and 2).

3.4 Conditioning and Aging Procedure

3.4.1

Twelve specimens, as described in section 3, shall be

subjected to a stabilization period of a minimum of 24 hours

at23°C±2°C[73.4 °F ± 3.6 °F] and 50% ± 5% RH.

IPC-2-6-21a

Figure 1 Construction of Specimens for Peel Strength Testing

Metal Conductor (4 each)

3.2 mm

[0.126 in]

25 mm [1 in]

(nom.)

230–250 mm [9–10 in]

5.7 mm

[0.224 in]

Table 1 Cleaning Process for Shiny Copper

Step Process Material Temperature Time

1 Soak Clean

Use commercially available acid or alkaline

cleaners

Per supplier recommended

temperature

Per supplier recommended

time

2 Rinse Running tap water Room Temperature 3 - 5 minutes

3 Microetch

Sodium persulfate: Two liters of deionized

water, 280 grams of sodium persulfate,

25 cc sulfuric acid

Room Temperature 1 - 2 minutes

4 Rinse Running tap water Room Temperature 1 minute

5 Acid Dip

Sulfuric acid 10% by volume, dilution 1.8

liters deionized water, 200 cc sulfuric acid

96% assay

Room Temperature 45 seconds

6 Rinse Running tap water Room Temperature 1 minute

7 Rinse Deionized water Room Temperature 1 minute

8 Dry Force air dry or blot with paper towels Room Temperature 1 - 3 minutes

9 Bake Bake in clean air-circulating oven 110±5°C[230.0 ± 9.0 °F] 10 to 15 minutes

10 Lamination

*Maximum delay between bake and

lamination shall be 30 minutes

*Lamination conditions (e.g., pressure, temperature, time, etc.) shall conform to suppliers’ recommendations.

IPC-TM-650

Number

2.6.21

Subject

Service Temperature of Metal-Clad Flexible Laminate, Cover

Material and Adhesive Bonding Films

Date

6/11

Revision

Page2of5

3.4.2 Measure the flexible base dielectric thickness and the

metal thickness of the twelve specimens by micrometer, cali-

per or similar following the stabilization period in 3.4.1. Nomi-

nal metal thickness to be tested is either 1 oz or 34.3 µm

[1350 µin] thick (preferred) or

⁄

oz or 17.1 µm [680 µin] thick.

3.4.3 On the specimens stabilized in 3.4.1, measure and

verify that the conductor widths are 3.2 mm ± 0.15 mm

[0.126 in ± 5.9 µin].

3.4.4 Examine the twelve specimens measured in 3.4.3

using normal or corrected 20/20 (also termed 6/6 or 1.0)

vision, and discard any peel strips showing the presence of

any wrinkles, cracks, blisters, or loose conductors. Twelve

specimens are required for the test, so any specimens not

meeting this criterion shall be replaced.

3.4.5 Per IPC-TM-650, TM 2.4.13, Method B, subject the

specimens examined in 3.4.4 to pre-drying and then solder

float.

3.4.6 Examine the specimens subjected to solder float in

3.4.5 using normal or corrected 20/20 (also termed 6/6 or 1.0)

vision. Discard any peel strips showing the presence of any

wrinkles, cracks, blisters, or loose conductors. Verify that at

least twelve good specimens remain.

3.4.7 Place six specimens into an air-circulating oven at the

desired Service Temperature value. The oven temperature

shall be held at a tolerance of ± 3°C [5.4 °F]. The specimens

are to continuously remain in the oven for 1000 hours, -0

hours / +12 hours.

3.4.8 After being aged per 3.4.7, the test specimens shall

be cooled to room temperature at standard ambient labora-

tory conditions. After being cooled to room temperature, the

thermally aged (oven conditioned) specimens shall be sub-

jected to a stabilization period of a minimum of 24 hours at

23 °C ± 2 °C [73.4 °F ± 3.6 °F] and 50% ± 5% RH.

3.4.9 After the stabilization period in 3.4.8, examine the

specimens using normal or corrected 20/20 (also termed 6/6

or 1.0) vision, and record the presence of any wrinkles,

cracks, blisters, or loose conductors, or any delamination.

3.5 Measurement of Peel Strength

3.5.1

AABUS, test specimens may have rigid reinforcement

material attached to all twelve specimens that were subjected

to the solder float in 3.4.5, including those six specimens that

were additionally subjected to thermal aging in 3.4.7. The rigid

reinforcement material shall not be attached prior to condi-

tioning and aging. The attachment of the rigid reinforcement

material depends on a number of factors, including the type of

peel test apparatus as described in IPC-TM-650, Method

2.4.9. If the rigid reinforcement material is to be utilized, it

should be adhered to the specimens using double-faced

adhesive tape or appropriate adhesive system to the back

side of the specimens.

If the test specimens are generated from double-clad flexible

base materials with metal remaining on the non-test side, the

additional rigid reinforcement material is unnecessary and

should not be used.

3.5.2 Measure the peel strength of the twelve conductors

per the procedures outlined in IPC TM-650, Method 2.4.9.

Specifically, peel the etched copper conductors away from

the dielectric at a 90° angle and at a 50.8 mm [2 in] per min-

ute crosshead speed.

3.6 Document and Report Results

3.6.1

Calculate the average peel strength of the six speci-

mens that were only exposed to the solder float (i.e., only as

per 3.4.5 and not exposed to the thermal aging of 3.4.7). Do

the same for the six thermally aged specimens per 3.4.7. Cal-

culate the ratio of the ‘‘thermally aged’’ average peel

strengths divided by the solder-floated only average peel

strength to determine the percentage retention of peel

strength. Record this number to ± 1% accuracy.

[Ave. of Six (6) Peel Strengths of Thermally Aged Specimens]

[Ave. of Six (6) Peel Strengths of Solder Floated-Only Specimens

x100=%ofPeel Strength Retained

IPC-2-6-21-2

Figure 2 Use of Adhesive Bonding Film to Form Test

Specimen

1 oz ED or RA Copper Foil Test Surface

(Shiny side toward the adhesive)

1 oz ED Copper Foil with Treated Matte

Side Inward as Support Material

Adhesive Bonding Film

IPC-TM-650

Number

2.6.21

Subject

Service Temperature of Metal-Clad Flexible Laminate, Cover

Material and Adhesive Bonding Films

Date

6/11

Revision

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