IPC-TM-650 EN 2022 试验方法.pdf - 第247页

5.5.2 Apply sufficient force to the punch using the appara- tus in 4.6 to remove the section from the test specimen. 5.5.3 Use a permanent marker or vibrating scribe to serial- ize each resulting piece. 5.6 Visual Examin…

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1 Scope This test method specifies techniques for the
determination of machineability of a solder mask.
2 Applicable Documents
IPC-SM-840
Qualification and Performance of Permanent
Solder Mask
IPC-A-25A-G-KIT
1
Multipurpose One-Sided Test Pattern
3 Test Specimens Six (6) IPC-B-25A boards coated with
solder mask on the top side. Three are to be tested
as-received and three are to be tested after solder float expo-
sure.
The IPC-A-25A-G-KIT artwork package provides the Gerber
information necessary for the fabrication of the standard IPC-
B-25A test board.
4 Apparatus and Reagents
4.1 Drill
4.1.1
Drill speed of 1500 ± 250 rpm
4.1.2 Drill bit size of 6.35 mm [0.25 in]
4.2 Router
4.2.1
Speed of 20,000 ± 5,000 rpm
4.2.2 Router bit to be standard for printed board fabrication
and operation at recommended speed. Bit must be sharp and
in good working order.
4.3 Band Saw
4.3.1
Speed of (442 ± 76) m/min [(1450 ± 250) ft/min]
4.3.2 Blade of 1.2 cm [0.5 in] width, 0.89 mm [0.035 in]
gauge, and 10-14 pitch
4.4 Punch
4.4.1
2.5 cm [1 in] square die
4.4.2 Clearance range between punch and die to be [0.001
to 0.003 in]
4.5 Permanent Marker and/or Vibrating Scribe
4.6 Hammer or Mechanical Punching Apparatus
5 Procedures
5.1 Preconditioning
5.1.1
Process three of the IPC-B-25A coupons per IPC-SM-
840, Resistance to Tin-Lead Solder - Solder Float
5.2 Drilling
5.2.1
Drill three holes in each coupon directly below the
label ‘‘B’’ on the test specimen.
5.3 Routing
5.3.1
Route a straight edge along the top side of each cou-
pon.
5.3.2 Use a permanent marker or vibrating scribe to serial-
ize each resulting piece.
5.4 Sawing
5.4.1
Make a single cut along the bottom edge of each cou-
pon removing the finger tab area.
5.4.2 Use a permanent marker or vibrating scribe to serial-
ize each resulting piece.
5.5 Punching
5.5.1
Place the punch over the fiducial above the comb pat-
tern labeled ‘‘F’’ on the test specimen.
1. www.ipc.org/onlinestore
3000 Lakeside Drive
Bannockburn, IL 60015-1249
IPC-TM-650
TEST METHODS MANUAL
Number
2.4.7.1
Subject
Solder Mask - Determination of Machineability
Date
03/07
Revision
Originating Task Group
Solder Mask Performance Task Group (5-33b)
Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.
Page1of2
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES
®
5.5.2 Apply sufficient force to the punch using the appara-
tus in 4.6 to remove the section from the test specimen.
5.5.3 Use a permanent marker or vibrating scribe to serial-
ize each resulting piece.
5.6 Visual Examination
5.6.1
Visually examine each coupon and the extracted
pieces for evidence of tears or cracks of the solder mask.
6 Notes
6.1 Safety
Operator should be trained and familiar with the
hazards inherent to the chemicals being used and analyzed.
Proper personal safety equipment, such as safety glasses,
gloves and splash apron, and adequate ventilation shall be
used.
IPC-TM-650
Number
2.4.7.1
Subject
Solder Mask - Determination of Machineability
Date
03/07
Revision
Page2of2
1.0
Scope
This
test method is designed to determine the
peel strength of metallic cladding when tested in the following
conditions, ‘‘as received,’’ after thermal stress, and after
exposure to processing chemicals; and to evaluate the base
laminate material after the peel strength test is completed for
degradation due to the conditioning.
2.0
Applicable Documents
IPC-TM-650
Method
2.4.8.1, Peel Strength, Metal Foil (Keyhole Method for
Thin Laminates)
Method 5.8.3, Peel Strength Test Pattern
3.0
Test Specimens
3.1 Size and Configuration
Specimens
shall be 50.8 mm
x 50.8 mm [2.0 x 2.0 in] by the thickness of the laminate.
Cladding test strips shall be as specified (see 5.1.2).
3.2
Quantity and Sampling
At
least 2 specimens per clad
side per each test condition (see 5.2) shall be taken at random
from the laminate lot. They may be taken from samples used
for other QA testing or inspection. One specimen per side
shall be used for crosswise and one specimen per side for
lengthwise testing.
4.0
Apparatus or Material
4.1 Tensile Tester
A
tensile strength tester equipped with
a load cell, capable of measuring to the nearest 0.0045 kg
[0.01 lbs], and light load wire or chain and clamp at least 457
mm [18.0 in] long (its weight is included in the load cell calcu-
lation). The clamp jaws must cover the entire width of each
peel strip. Any equipment or apparatus having the described
accuracy, precision, and reproducibility may be used.
4.2
Solder Pot
A
solder bath or pot capable of maintaining
solder at the specified temperature when measured 25.4 mm
[1.0 in] below the surface. Type Sn60 or Sn63 solder shall be
used.
4.3
Specimen Hold-down
A
suitable hold-down clamping
system equivalent in performance as that defined in IPC-TM-
650, Method 2.4.8.1.
4.4
Chemicals
A
minimum of two ounces of the following
processing solutions:
4.4.1
Organic
chemical stripper, such as Methylene Chlo-
ride, or equivalent
4.4.2
Sodium
Hydroxide 10 gr/liter
4.4.3
Boric
Acid 30 gr/liter and Sulfuric Acid 10 gr/liter
4.4.4
Organic
degreaser, such as isopropyl alcohol, or
equivalent.
4.5
Hot
fluid bath, capable of being maintained at the speci-
fied temperature, when measured 25.4 mm [1.0 in] below the
surface.
4.5.1
Dow
Silicone Fluid No. 704, or equivalent.
4.6
Dow
Silicone Grease, Compound 4, or equivalent.
4.7
Data Collection
For
qualification testing, a recording
system capable of permanent data retention must be incorpo-
rated into the test apparatus.
4.8
Etching
system capable of complete removal of metallic
cladding.
4.9
Measuring
device capable of measuring from 0.000 to
12.7 mm [0.5 in] to within ± 0.0025 mm [0.0001 in].
4.10
Etch Resist Materials or Systems
4.10.1
Platers
tape, or equivalent, to act as etch resist for
strip formation of the specified widths (see 5.2.1.1, 5.2.2.1,
and 5.2.3.1).
4.10.2
Photoresist
system (printing, developing, and stripping).
5.0
Procedure
5.1 Specimen Preparation
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.4.8
Subject
Peel
Strength of Metallic Clad Laminates
Date
12/94
Revision
C
Originating Task Group
MIL-P-13949 Test Methods Task Group (7-11b)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
P
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