IPC-TM-650 EN 2022 试验方法.pdf - 第269页

should be maintained until the adhesive layer cools to 100°C. Allow the test sample to cool slightly before handling. The compliant material (if one is used) should be placed between the thermode and flex circuit prior t…

Scope

order to assess the actual performance of any

given lot of material, it is necessary to apply and thermally

bond the material between the substrates of interest. This

method describes the recommended procedure for both pre-

tacking and bonding anisotropically conductive films (ACF).

This method describes a fully manual procedure.

Applicable Documents

3 Test Specimens

3.1

Appropriate

flex circuit and test substrate(s)

Apparatus

4.1

‘‘Hot-Bar’’

type soldering station: Unitek PM-4 or

equivalent

4.2

Thermode:

1.5 mm width minimum; sufficient length to

span bond-line

4.3

Hot-Plate:

Pace, Inc., ’Hot Spot’ or equivalent (optional

if hot bar bonder is used for tacking or if adhesive can be

tacked without applied heat)

4.4

Razor

blade

4.5

Cotton

swab (optional; see 4.3)

4.6

One

roll or sheet of conductive adhesive

4.7

Appropriate

compliant material (as required)

Procedure

5.1 Sample Preparation

5.1.1

Allow

the roll of adhesive to equilibrate at room tem-

perature before handling.

5.1.2

Cut

the flex circuit sample to the appropriate length

and width for the given performance test.

5.1.3 Cut

an adhesive sample to match the width and

length of the bond area.

5.2

Procedure

5.2.1

Position

the adhesive over the pads on the flex circuit,

liner-side up.

5.2.2

the adhesive requires heat to tack it, tack the adhe-

sive in place on the flex circuit using the hot plate and cotton

swab (alternatively, the adhesive can be tacked using an

appropriately low setting of the hot bar equipment). The adhe-

sive should be easily tackable with a three to five second

exposure at 100°C. A cotton swab should be used to apply

mild pressure in order to facilitate wetting. Allow the flex circuit

to cool before handling further.

5.2.3

Peel

the release liner away from the flex circuit in order

to expose the adhesive. The adhesive may need pre-cutting

(using a razor blade) to separate it from the liner along the

starting edge.

5.2.4

Align

the flex circuit to the test substrate. In instances

requiring extreme accuracy of alignment, it is helpful to affix

the flex circuit relative to the substrate to prevent misregistra-

tion prior to and during bonding. This can be accomplished

with custom fixturing. Alternatively, a soldering iron can be

brushed lightly along the bond-line in order to tackify the

adhesive, thereby temporarily adhering the flex circuit to the

test substrate.

Note: When a soldering iron is used, it should be powered

through a Variac in order to provide temperature control. The

temperature/time of the soldering iron should be just high

enough to tackify the adhesive but not so high as to substan-

tially cross-link the adhesive (i.e., 100°-130°C) and only a few

seconds exposure to these temperatures.

5.2.5

Bond

the flex circuit to the test substrate using the

hot-bar soldering station. Apply a minimum of 20 kg and a

maximum of 40kg/sq. cm of total bond-line area (or as recom-

mended by the adhesive vendor), then ramp the temperature

to the set point. The thermode set point needs to be set to

permit the adhesive layer to reach 180°C within 10 seconds

(or as recommended by the adhesive vendor) of the time at

which the thermode reaches its setpoint. The thermode

should remain at the setpoint for a time sufficient to cure the

adhesive according to vendor’s specification (typically 20 sec-

onds). Some vendors may advise that the bond pressure

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.9.2

Subject

Bonding

Process

Date

11/98

Revision

Originating Task Group

SMT Mounting Adhesives Task Group (5-24d)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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should

be maintained until the adhesive layer cools to 100°C.

Allow the test sample to cool slightly before handling. The

compliant material (if one is used) should be placed between

the thermode and flex circuit prior to bonding.

IPC-TM-650

Number

2.4.9.2

Subject

Bonding

Process

Date

11/98

Revision

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1.0

Scope This method is used to determine the solderability

of copper foil, copper clad laminate, and printed boards. This

method does not specifically relate to the solderability of the inter-

nal plating in holes.

2.0 Applicable Documents

None

3.0

Test Specimen

Boards

Specimen

can be a scrap edge, a finished product

or a specially prepared specimen processed with a group of

production boards, as mutually determined between vendor

and user.

Copper

Foil

representative sample of copper foil that is 25

mm [1 in] wide and of sufficient length to dip approximately 50

mm [2 in] into the solder.

4.0

Apparatus

4.1 Solder Pot

electrically heated thermostatically con-

trolled pot of sufficient size to accommodate the specimen

containing no less than five pounds of solder.

4.2

Dipping Device

device as shown in Figure 1 shall be

used. A similar device may be used if:

1. the rate of immersion, dwell time and rate by withdrawal

are within the test limits described in the procedures;

2. the board and solder remain perpendicular within five

degrees and

3. wobble, vibration and other extraneous movements, are

eliminated.

4.3

Flux

Nonactivated

rosin flux having a nominal composi-

tion of 25% by weight of water white gum rosin in a solvent of

isopropyl alcohol 99%. The specific gravity of the flux shall be

0.843 ± 0.005 at 25°C (77°F), and free of additional activators.

4.4

10%

HCL by volume

5.0

Procedure

5.1 Preparation

5.1.1

The

specimen shall be checked in an ‘‘as received’’

condition from the vendor and care must be exercised to pre-

vent contamination (by grease, perspirants, etc.) of the sur-

face to be tested.

5.1.2

Preclean

the specimen using a 15 second immersion

in 10% HCL (by volume) followed by water rinsing. The HCL

shall be maintained at 60 ± 5°C [140 ± 10°F]. Dry the speci-

men quickly to avoid excess oxidation of the sample. Use of

an air blower or isopropyl alcohol to expedite the drying is

permitted.

5.1.3

Dip

the specimen into the described flux and allow to

drain for 60 seconds before proceeding with the solder dip.

5.2

Test

5.2.1

Stir,

and skim the surface of the molten solder with a

clean stainless steel paddle to assure that the solder is of a

uniform composition and a temperature of 245 ± 5°C (473 ±

9°F).

5.2.2

Immerse

the specimen edgewise into the molten sol-

der. The insertion and withdrawal rates shall be 1 ± 0.025

inches per second, with a dwell time of 4 seconds ± 0.5 sec-

onds.

5.2.3 Upon

withdrawal, the solder shall be allowed to solidify

by air cooling while the specimen is in the vertical position.

5.2.4

Thoroughly

remove the flux and examine.

5.3

Evaluation

5.3.1

Examine

specimen for a new uniform adhering coating

of solder.

5.3.2

area of 3.2mm [0.125 in] width, approximately,

from the edge of the specimen shall not be evaluated.

6.0 Notes

6.1

an aid to evaluation of the test results, see Figure 2.

This aid to be used primarily to illustrate types of defects

rather than percentage of area covered.

6.2

quenching or other means of accelerating cooling

shall be used.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.12

Subject

Solderability,

Edge Dip Method

Date

6/91

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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