IPC-TM-650 EN 2022 试验方法.pdf - 第705页

Figure 1 IPC-TM-650 Number 2.6.9.1 Subject Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy Date 1/95 Revision P a g e4o f5 电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ

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Note:
It is important that the IPC receives as much data as
possible, whether it be to support previously submitted
data, add new data, or provide conflicting data on cer-
tain components. All information received will be
entered into a database for all IPC members to access.
The database will prove more useful as the volume of
data increases.
6.0
Notes
Contact
IPC for a list of tested components.
6.1
References
6.1.1
William
Vuono and Ayche McClung, ‘‘An Update on
an Assessment of Ultrasonic Cleaning Techniques for Military
Printed Wiring Boards,’’ presented at IPC Fall Meeting, 1990.
6.1.2
B.P.
Richards, P. Burton and P.K. Footner, ‘‘Does
Ultrasonic Cleaning of PCBs Cause Component Problems: An
Appraisal,’’ IPC Technical Review, June 1990.
6.1.3
B.P.
Richards, P. Burton and P.K. Footner, ‘‘The
Effects of Ultrasonic Cleaning on Device Degradation,‘‘ Circuit
World. Vol 16, No. 3.
6.1.4
B.P.
Richards, P. Burton and P.K. Footner, ‘‘The
Effects of Ultrasonic Cleaning on Device Degradation—An
Update,‘‘ Circuit World. Vol 17, No. 4.
6.1.5
B.P.
Richards, P. Burton and P.K. Footner, ‘‘The
Effects of Ultrasonic Cleaning on Device Degradation—Quality
Crystal Devices,’’ Circuit World. Vol. 18, No. 4.
6.1.6
B.P.
Richards, P.K. Footner, and P. Burton, ‘‘A Study
of the Effect of Ultrasonic Cleaning on Component Quality—
Hybrid Devices,’’ Circuit World. Vol 19, No.1.
6.1.7 Fritz
Ehorn, ‘‘Final Report on the Structural Dynamic
Analysis of Selected PWB Components Under the 400 Khz
Ultrasonic Cleaning Environment,’’ MEL Ref. MS7507, March
6, 1991.
6.1.8
William
Puskas and Gary Ferrell, ‘‘Process Control
Ultrasonic Cleaning,’’ presented at Nepcon West, 1988.
6.1.9
Kenneth
S. Suslick, ‘‘The Chemical Effects of Ultra-
sound,’’ Scientific American, February, 1989
6.1.10
Ismail
Kashkoush, Ahmed Busnaina, Frederick Kern,
Jr. and Robert Kunesh, ‘‘Particle Removal Using Ultrasonic
Cleaning,’’
Institute of Environmental Sciences, 1990
Proceedings.
IPC-TM-650
Number
2.6.9.1
Subject
Test
to Determine Sensitivity of Electronic Assemblies to
Ultrasonic Energy
Date
1/95
Revision
P
age3of5
电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
Figure
1
IPC-TM-650
Number
2.6.9.1
Subject
Test
to Determine Sensitivity of Electronic Assemblies to
Ultrasonic Energy
Date
1/95
Revision
P
age4of5
电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ
Ultrasonic
Test Data Record
Name
of tester
Date
Company
Address
Phone Fax
Make
and model of equipment
T
ank size
Dimensions
(cm cm x cm)
Generator
output power
Frequency
(KHz)
No.
of boards tested per trial
Substrate
Exposure
time
Other
stress testing (pre- or post-)
Describe
Component
tested No. tested Passed Failed Comments
Type Mfgr Part #
Mail
to: IPC Fax to: 847-509-9798
2215 Sanders Road
Northbrook, IL 60062-6135
Attn: Ultrasonic Cleaning Task Group
IPC-TM-650
Number
2.6.9.1
Subject
Test
to Determine Sensitivity of Electronic Assemblies to
Ultrasonic Energy
Date
1/95
Revision
P
age5of5
电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ