IPC-TM-650 EN 2022 试验方法.pdf - 第712页

Parallax displacement distortion will be indicated when round holes appear oval or ‘‘cats eyed’’ on the X-ray image. For a hole drilled through a panel of thickness, t, and offset from the center of the X-ray beam axis b…

1.0

Scope

This

non-destructive inspection method is

needed to ascertain the following conditions:

a. Innerlayer shift is within acceptable tolerances.

b. One or more inner layers have not been reversed.

c. Drilled holes are aligned with pads to the extent that any

break-out is within acceptable tolerances.

d. The minimum distance between a drilled hole and a

ground plane clearance is within acceptable tolerances.

The test method will entail passing X-rays through the test

specimen and converting the transmitted X-ray image into a

visual image through the use of either X-ray film or a flouro-

scopic (real time) device.

Cautionary notes:

The construction of the multilayer with respect to; number of

layers, thickness of copper and presence other metals such

as heat sinks (e.g. Invar), will determine the power and sensi-

tivity of the X-ray apparatus which can be used. All X-ray

apparatus should be registered with the appropriate state or

regional Radiation Control agency.

A radiation safety program should be implemented.

2.0

Applicable Documents

MIL-STD-883

Method

2012.5, Radiography

3.0

Test Specimen

The

Test specimen shall be a multi-

layer printed wiring board having a maximum size of 20 x 24

inches.

4.0

Apparatus or Material

(Ref.

MIL-STD-883C).

The apparatus and materials for this test shall include:

4.1

radiographic (X-ray) source for generating X-rays of

sufficient voltage and power to penetrate the test specimen.

The focal distance and focal spot size of the source shall be

adequate to produce a well defined image of a 0.001 inch

copper wire.

4.2

If film is the imaging medium

The

film used is to be

a fine grain single emulsion X-ray film with resolution capable

of resolving a 0.001 copper wire and fray scale capable of

detecting the shift of a single layer.

4.3

Film holder

lead backed film holder to prevent back

scatter of radiation.

4.4

Radiographic Viewer

Capable

of 0.001 inches resolu-

tion.

4.5

Radiographic quality standards

Suitable

Image Qual-

ity Indicator capable of verifying the ability to detect all speci-

fied defects.

4.6

Film processing means

Manual

tray development or a

film processor is to be used. If the film processor has a glove

box and suitable film holders, a dark room is not required. If

manual tray development is used, a dark room is required.

4.7

Silver film densitometer

Capable

of measuring silver

film density up to 3.0.

4.8 If

a fluoroscopic (real time) X-ray inspection system is

used, the X-ray image detecting device or x-ray camera

should be capable of resolving a 0.001 copper wire and a

gray scale capable of detecting the shift of a single layer of the

specimen.

4.8.1

A means is to be provided for recording or making a

hard copy of the fluoroscopic (real time) X-ray image.

4.9

Image Identification

Each

radiographic image (film or

real time) shall be identified with the following information:

• Manufacturer’s name

• Part number

• Serial number (when applicable)

• Date code (if marked on specimen)

• View number

• Reference code for x-ray procedures used.

5.0

Procedure

5.1 Preparation

Alignment

of the X-ray beam center line,

specimen inspection area and image detector field of view

must be insured so that parallax distortion does not adversely

effect the interpretation of the result. (See reference)

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.6.10

Subject

X-Ray

(Radiography), Multilayer Printed Wiring

Printed Board Test Methods

Date

8/97

Revision

Originating Task Group

Board T.M. Task Group, 7-11d

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

age1of2

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Parallax

displacement distortion will be indicated when round

holes appear oval or ‘‘cats eyed’’ on the X-ray image. For a

hole drilled through a panel of thickness, t, and offset from the

center of the X-ray beam axis by the angle A, the parallax dis-

placement between the top and bottom of the hole will be

equal to

txT

ran A.

5.2

Radiographic Quality Standard

radiographic qual-

ity standard such as an ASTM Image Quality Indicator or other

agreeable indicator shall be used on all radiographic studies.

5.3

Exposure when film is used

The

necessary X-ray

penetration exposure will depend on the construction of the

multilayer, X-ray source anode voltage, the anode current, the

distance from the source to the film plane and the speed or

sensitivity of the film. The exposure should be sufficient to

produce an optical density of at least 2.0 at those portions of

the film receiving the highest X-ray exposure, such as, holes

or unattenuated areas. In addition the conditions of paragraph

1.0 with respect to resolution and gray scale must be met.

The exposure apparatus for film can consist of an industrial

shielded X-ray cabinet with a nominal anode voltage of 80

kilovolts, nominal anode current of

millgrams

and

a focal

spot to film distance adequate to avoid parallax distortion of

the X-ray film image.

5.4

Exposure for realtime systems

The

X-ray source

operating parameters must be matched to the X-ray camera

sensitivity of the system to produce an X-ray image of suffi-

cient quality to comply with the conditions of paragraph 1.0.

6.0 Notes

None

IPC-TM-650

Number

2.6.10

Subject

X-Ray

(Radiography), Multilayer Printed Wiring Printed Board

Test Methods

Date

8/97

Revision

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1 Scope This test method is used to determine the resis-

tance of the applied solder mask to reverting to liquid when

exposed to high humidity at a specific time and temperature

condition. This test method evaluates the stability of a cured

solder mask that has been applied to a printed board under

storage (nonoperating) conditions.

2 Applicable Documents

IPC-SM-840

Qualification and Performance of Permanent

Solder Mask

3 Test Specimens Three copper clad laminates, approxi-

mately 10 cm x 10 cm [3.94 in x 3.94 in], coated with solder

mask and cured according to the supplier’s recommenda-

tions.

4 Equipment

4.1 Desiccator

At least 25 cm [9.84 in] in diameter

4.2 Potassium Sulfate Reagent grade potassium sulfate

4.3 Cotton Swabs

4.4 Oven

Capable of maintaining temperature up to 100 °C

[212 °F]

4.5 Test Chamber Capable of maintaining a constant tem-

perature of 97±2°C[206.6 ± 3.6 °F] with 94 ± 4% relative

humidity.

4.6 High Temperature Silicone Grease

5 Procedures

5.1 Desiccator Method

5.1.1

Prepare a saturated solution of distilled or deionized

water and potassium sulfate [35 grams per 100 mL] at a tem-

perature of 97±2°C[206.6 ± 3.6 °F]. Pour the solution into

the desiccator just below the ceramic plate. Crystals of potas-

sium sulfate should remain visible in the saturated solution

during testing.

Note: Relative humidity is not to exceed 98%.

5.1.2 Place the three test specimens on the ceramic plate in

the desiccator so that they are not touching each other.

5.1.3 Seal the desiccator with high temperature silicone

grease and close the desiccator.

5.1.4 Place the desiccator in the oven maintained at 97 ± 2

°C [206.6 ± 3.6 °F].

5.1.5 Allow the desiccator, containing the test specimens,

to remain in the oven for 28 days (672 hours).

5.2 Chamber Method

5.2.1

Place the three test specimens in a rack so they do

not touch each other and place the rack into the test cham-

ber. Close the chamber door.

5.2.2 Set the chamber’s parameters at 97±2°C[206.6 ±

3.6 °F] and 94 ± 4% relative humidity. Activate the test cham-

ber and begin testing.

5.2.3 Allow the specimens to remain in the test chamber for

28 days (672 hours).

5.3 Evaluation

5.3.1

After the required time exposure remove the test

specimens and visually examine the specimens for evidence

of reversion as indicated by softening, chalking, blisters,

cracks, tackiness, loss of adhesion or liquefaction.

5.3.2 Touch (do not wipe) the surface of the solder mask

coating with a swab of absorbent cotton and observe for par-

ticles of the cotton adhering to the coating.

Note: Examination and testing may be done at intervals

within the required exposure time, if there is suspicion of early

failure and evaluation time is critical.

3000 Lakeside Drive, Suite 309S

Bannockburn, IL 60015-1249

IPC-TM-650

TEST METHODS MANUAL

Number

2.6.11

Subject

Solder Mask - Hydrolytic Stability

Date

03/07

Revision

Originating Task Group

Solder Mask Performance Task Group (5-33b)

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

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