IPC-TM-650 EN 2022 试验方法.pdf - 第340页

1 Scope This test method is used to determine the adhe- sion quality of solder masks used on flexible circuits. 2 Applicable Documents IPC-A-42-G-KIT 1 Double-Sided Artwork 3 Test Specimen The IPC-A-42-G-KIT artwork pack…

5.1.2 For preproduction qualification, test specimens are to

be cleaned using cleaning methods as recommended by the

solder resist manufacturer and standard production methods

for comparison purposes prior to solder resist application.

5.1.3 Test specimens are to be coated and cured by the

standard production method.

5.1.4 Testing is to be conducted on specimens before and

after soldering in accordance with J-STD-003, Methods A, B,

C, or D with no accelerated aging.

5.2 Test

5.2.1

Press a strip of pressure sensitive tape, 50 mm

[1.97 in] minimum in length, firmly across the surface of the

test area removing all air entrapment. The time between appli-

cation and removal of tape shall be less than one minute.

Remove the tape by a rapid pull force applied approximately

perpendicular (right angle) to the test area. An unused strip of

tape must be used for each test.

5.3 Evaluation

5.3.1

Visually examine the tape and test area for evidence of

any portion of the material tested having been removed from

the specimen.

5.3.2 The report should note any evidence of material

removed by this test.

6 Notes

6.1

Figure 1 illustrates the coupon that is used for testing.

The black squares indicate metal. The white squares indicate

the base material. Solder mask is applied over the entire con-

ductor pattern.

6.2 If foreign material (oil, grease, etc.) is present on the test

surface the results may be affected.

6.3 Certification of 3M Brand 600 1/2 inch tape to CID-A-A-

113 is not required. The 3M Brand 600 1/2 inch tape is avail-

able through most office supply stores.

IPC-TM-650

Number

2.4.28.1

Subject

Solder Mask Adhesion - Tape Test Method

Date

03/07

Revision

Page2of2

1 Scope This test method is used to determine the adhe-

sion quality of solder masks used on flexible circuits.

2 Applicable Documents

IPC-A-42-G-KIT

Double-Sided Artwork

3 Test Specimen The IPC-A-42-G-KIT artwork package

provides the electronic Gerber information necessary for the

fabrication of the IPC B-42 test board. IPC-B-42 flexible test

patterns H1, H2, and/or H3, or production test samples with

solder mask coating. Each flexible section shall be separated

and tested independently.

4 Apparatus 3.18 ± 0.1 mm [0.125 ± 0.004 in] diameter

mandrel (metal rod).

5 Procedures

5.1 Test

5.1.1

Bend the test specimen around the mandrel so that

the ends of the test specimens are on the same side of the

mandrel and nominally parallel to each other. (The test speci-

men forms a ‘‘U’’ shape around the mandrel.) Each cycle

must be at the same point on the flexible circuit.

5.1.2 Flip the test specimen so that its opposite surface is

against the metal rod and repeat 5.1.1.

5.1.3 Repeat 5.1.1 and 5.1.2 nine times (ten cycles total) for

each of the test specimens.

5.2 Evaluation Visually examine the flexible circuit test pat-

tern with corrected 20/20 vision without magnification for sol-

der mask delamination or cracks.

1. www.ipc.org/onlinestore

3000 Lakeside Drive, Suite 309S

Bannockburn, IL 60015-1249

IPC-TM-650

TEST METHODS MANUAL

Number

2.4.29

Subject

Solder Mask - Adhesion to Flexible Circuits

Date

03/07

Revision

Originating Task Group

Solder Mask Performance Task Group (5-33b)

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

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ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

Scope

This

test method is to determine the impact resis-

tance of polymer film circuitry when exposed to a series of

falling ball impingements. The method is used to evaluate the

resistance to chipping, flaking, convolution or other forms of

separation of the polymer film from either the conductor or

base laminate material surfaces.

Applicable documents

None

Test specimen

IPC-B-25

Multi-Purpose Test Board

Equipment/Apparatus

4.1

suitable electromagnetic apparatus to precisely con-

trol the height and the point of impact of the falling ball (see

Figure 1)

4.2

The

test ball shall be 25 mm diameter, 67 gram preci-

sion steel ball.

4.3

When

testing flexible circuits, the test specimen shall be

placed on a hard smooth surface. Use of at least 0.6 cm cold

rolled steel sheet stock.

Procedure

5.1 Preparation

5.1.1

Adjust

the fall height by setting the solenoid core at 53

cm ± 0.3 cm from the top surface of the test specimen.

5.2

Test

5.2.1

Place

the steel ball on the underside of the solenoid

core with the solenoid energized.

5.2.2

Place

the test specimen below the falling ball in such

a manner as to strike the center of feature (L) on test speci-

men IPC-B-25.

5.2.3

Release

the falling ball by de-energizing the solenoid

magnet.

5.2.4

is necessary to catch the ball immediately after

impact so as not to permit more than one blow at a time.

5.2.5

Repeat

this procedure for 10 cycles and observe the

test specimen after each blow.

5.2.6

Perform

the same test (also for l0 cycles)on any area

of the test specimen having no circuitry.

5.2.7

Repeat

the same test in such a manner as to strike

the edge of the feature (L) 10 times.

5.3

Evaluation

Visually

examine the test specimen for

chipping, flaking, convolution, or other forms of separation of

the polymer film.

6 Notes

6.1 The

test apparatus shown in Figure 1 can easily be

assembled using a standard laboratory stand and clamps, a

12 volt DC Solenoid, and a 12 Volt battery.

IPC-2-4-30-1

Figure

1 Falling Ball Impact Test Apparatus

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.30

Subject

Impact

Resistance, Polymer Film

Date

10/86

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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