IPC-TM-650 EN 2022 试验方法.pdf - 第160页

IPC-23172-fig1 Figure 1 IPC-TM-650 Number 2.3.17.2 Subject Resin Flow of ‘‘No Flow’’ Prepreg Date 8/97 Revision B P a g e3o f3 电子技术应用ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ

lay

flat to one another. Using a 25.4 mm [1.0 in] diameter hole

punch, cut 2 holes at least 25.4 mm [1.0 in] apart (See Figure

1) in approximately the middle of the specimen. Caution

should be taken during cutting in order to prevent any loose

fibers from protruding into the clearance hole. Measure the

diameter of each hole in 3 places, each approximately 60°

radial angle from the others and determine the average diam-

eter of the holes.

5.2.2

Place

the stack onto and in the middle of a 152 mm x

152 mm [6.0 in x 6.0 in] copper clad laminate of thickness

between 0.25 mm [0.010 in] and 0.38 mm [0.015 in] thick and

cover the stack with a sheet of release film. Over the release

film place 2 pieces press pad material. For referee purposes,

the surface of the copper cladding shall be cleaned immedi-

ately prior to lay-up using the procedure in paragraph 5.1.3.

(The cleaning is to standardize the surface against which the

resin will flow.)

5.2.3

Place

the stack (specimen plus laminate, release, and

padding) between the two caul plates. Load the stack into the

laminating press maintained at 171°±2.8°C [340°±5°F] and

close immediately to 1380 ± 70 kPa [200 ± 10 psi]. After

holding at full pressure for 20 minutes, minimum, release the

pressure and remove the package.

5.3

Evaluation

After

the package has cooled to room

temp, measure the diameter of the punched holes at the point

of maximum and minimum diameter as formed by the resin

flow. Subtract the average diameter of holes obtained in 5.2.1

from the maximum and minimum diameters.

5.4

Report

The results shall be reported including the fol-

lowing:

1. Identification of specimens tested.

2. Resin flow, for each specimen tested in terms of the maxi-

mum flow and minimum flow in millimeters (thousands of

an inch) for both die-cut holes.

6.0

Notes

6.1

Agreement

between supplier and user other than that

specified in 4.1 may be necessary for specific resin

chemistries.

6.2

Desiccator Conditions

The

Test Methods Task Group

determined that a great majority of test laboratories are unable

to consistently hold the Relative Humidity in a desiccator to

less than 20%. Based on data from participating company lab

management, the lowest practically feasible RH for use with

the affected IPC Test Methods is 30% maximum.

IPC-TM-650

Number

2.3.17.2

Subject

Resin

Flow of ‘‘No Flow’’ Prepreg

Date

8/97

Revision

age2of3

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IPC-23172-fig1

Figure

IPC-TM-650

Number

2.3.17.2

Subject

Resin

Flow of ‘‘No Flow’’ Prepreg

Date

8/97

Revision

age3of3

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1.0

Scope

1.1

The purpose of this test method is to provide a proce-

dure for determining the gel time of resin preimpregnated ‘‘B’’

Stage glass fabric.

2.0

Applicable Documents

None.

3.0

Test Specimen

3.1

Sufficient

quantity of prepreg to yield approximately

1000 milligrams of dry resin powder.

4.0

Equipment/Apparatus

4.1

Platen,

hot plate or melting point apparatus capable of

maintaining a temperature of 171°±0.5°C (340°F ± 0.9°F).

4.2

Timer,

capable of determining time within ± 1 second.

4.3

Toothpicks.

4.4

Plastic/polyethylene

bags or suitable container.

4.5

Analytical

balance capable of weighing within ± 20 milli-

grams.

4.6

Wire

Mesh—60 mesh.

4.7

Montan

Wax.

5.0

Procedure

5.1

Place

the prepreg (B-Stage) in a plastic bag or other

suitable container, and extract the dry resin from the B-Stage

by folding or crushing.

5.2

Allow

the B-Stage resin to collect in the bottom of the

plastic bag.

5.3

Pour

the collected resin into a container through 60 wire

mesh, to remove any fiber glass particles.

5.4

Set

the melting point apparatus at 171°±0.5°C (340°±

0.9°F) and allow to stabilize at that temperature.

5.5

Using

the analytical balance weigh out 200 ± 20 milli-

grams of resin on to 3 in. x 3 in. sheet of wax paper or a suit-

able container.

5.6 Make

sure that the melting point apparatus is clean;

mold released with montan wax or equivalent; and wiped free

of any visible mold release.

5.7 Pour

200 milligram sample of resin on the center of the

melting point apparatus and start the timing device immedi-

ately.

5.8

Place

the tapered end of a round toothpick against the

surface of the cure plate (end of the toothpick not in contact

with surface of the cure plate will have to be elevated slightly).

5.9

Roll

toothpick back and forth, maintaining contact with

the surface of the cure plate until 20 seconds have elapsed.

5.10

this time start stroking the resin immediately, using

a circular motion 3/8 in. to 1/2 in. in diameter. Stroke in such

a manner that every circle moves part of the resin from the

center of the pool to the outside, and part of the resin from the

outside of the pool toward the center. Care should be taken

to limit the pool size to an area 3/4 in. to 7/8 in. in diameter.

5.11

Keep

the toothpick in contact with resin and surface of

the cure plate at all times. As the resin becomes stiff, it will not

be possible to continue exchanging outside resin with inside

resin, but continue stroking with as much exchange as pos-

sible without breaking the toothpick.

5.12

the resin breaks up, continue stroking the largest

piece. If this piece breaks up, continue stroking the largest

remaining piece of this portion even though now a larger piece

of the original pool may be present at some other place on the

hot plate.

5.13

When

the stroked piece separates from the hot plate,

stop the watch. This is the end point, and the total elapsed

time in the gel time.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.3.18

Subject

Gel

Time, Prepreg Materials

Date

4/86

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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