IPC-TM-650 EN 2022 试验方法.pdf - 第129页
1.0 Scope This method is a means for preparation of test specimens for determination of bare dielectric material quality and properties, using an alkaline etching solution for removal of copper cladding. 2.0 Applicable D…
5.4
Drying
Samples
may be air dryed for subsequent mate-
rial evaluations. For referee testing, an oven bake for 1 hour at
80 ± 5.6°C [176 ± 10°F] is required.
5.5
Evaluation
Determine
and record whether the etching
procedure resulted in any unusual events, such as:
a. Dwell time in etcher necessary for complete copper
removal, if longer than normal.
b. Warpage or distortion of the material.
c. Discoloration or other visual changes to the material.
6.0 Notes
None
IPC-TM-650
Number
2.3.7.1
Subject
Cupric
Chloride Etching Method
Date
12/94
Revision
A
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1.0
Scope
This
method is a means for preparation of test
specimens for determination of bare dielectric material quality
and properties, using an alkaline etching solution for removal
of copper cladding.
2.0
Applicable Documents
IPC-TM-650
Method
2.3.1.1, Chemical Cleaning of Metal Clad Laminate
3.0
Test Specimens
The
size of lot samples or test speci-
mens shall be determined by the inspections or tests to be
performed after etching and the capabilities of the etching
equipment.
4.0
Apparatus or Material
4.1
Standard
chemical etching chamber or laboratory
equipment suitable to the etchant chemistry.
4.2
Air
circulating oven capable of maintaining the specified
temperatures and tolerances.
4.3
Personal
safety equipment shall include: rubber or poly-
ethylene gloves, plastic or coated apron, and safety goggles.
4.4
Chemicals
Chemical
Concentration
Chloride 170 grams per liter
Copper 150 grams per liter
Ammonium Hydroxide 5.5 M
(NH
4
OH)
Specific gravity = 1.20
Reagent grade isopropyl
alcohol (IPA) As required
Distilled/Deionized Water As required
4.5
Pattern Developing Materials
Etch
resist system or
materials capable of producing the applicable conductor pat-
terns.
5.0
Procedure
5.1 Preparation of Specimen
5.1.1
Shear
the material to the appropriate sample or speci-
men size and if necessary remove the rough edges from the
specimen by sanding or other suitable means. Specimens
may be chemically cleaned in accordance with IPC-TM-650,
Method 2.3.1.1. Specimens may also be mechanically
cleaned.
5.1.2
If
a conductor pattern is required, prepare the material
by applying etch resist according to standard industry prac-
tices.
5.2
Etching
5.2.1
Remove
the metal cladding by etching in a convey-
orized spray chamber or other suitable vessel containing 22 to
23 BAUME alkaline etching solution maintained at 51.7
±5.6°C [125 ±10°F]. Etching time shall be minimized to pre-
vent overexposure of the bare laminate material to the etching
solution and yet allow for complete removal of the exposed
metal cladding. if the specimens are etched in a laboratory
environment, vigorous agitation may be required.
5.2.2
Rinse
the specimens thoroughly.
5.3
Cleaning
5.3.1
If
etch resist has been used, samples shall have the
resist or tape removed by standard industry practices.
5.3.2
When
electrical testing is required on the material, do
not allow the etched specimens to dry before they go through
the cleaning process. For general testing, scrubbing with a
soft natural bristle brush under running tap water and rinsing
with distilled water or deionized water may be adequate. For
critical testing and for referee testing, laminates shall be
soaked for 10 ±1 minutes in reagent grade IPA followed
immediately by a 10 minute rinse in flowing 16 megaohm
deionized water.
5.4
Drying
Samples
may be air dryed for subsequent
material evaluations. For referee testing, an oven bake for 1
hour at 80 ±5.6 °C [176 ±10°F] is required.
5.5
Evaluation
Determine
and record whether the etching
procedure resulted in any unusual events, such as:
The
Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST
METHODS MANUAL
Number
2.3.7.2
Subject
Alkaline
Etching Method
Date
12/94
Revision
A
Originating Task Group
MIL-P-13949 Test Methods Task Group (7-11b)
Material
in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
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a
. Dwell time in etcher necessary for complete copper
removal, if longer than normal.
b. Warpage or distortion of the material.
c. Discoloration or other visual changes to the material.
6.0 Notes
6.1
If
the etching time exceeds 15 minutes for 1 oz/sq. ft.
copper or 30 minutes for 2 oz/ sq. ft. copper, renew the etch-
ing solution.
6.2 Alkaline
etchant is toxic and extreme caution should be
exercised.
6.3
The
time to etch a clean pattern with a minimum of
undercutting should be approximately 7 minutes for 1 oz./sq.
ft. copper, and 15 minutes for 2 oz./sq. ft. copper using a
fresh solution.
IPC-TM-650
Number
2.3.7.2
Subject
Alkaline
Etching Method
Date
12/94
Revision
A
P
age2of2
电子技术应用 ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ