IPC-TM-650 EN 2022 试验方法.pdf - 第309页

5.3.1 Clean the metal clad specimen by light abrasion or other suitable method, then flux the metal surface with a rosin flux conforming to MIL-F-14256. 5.3.2 Clean the unclad specimens by standard production techniques,…

Scope

This

test method is used to determine the resis-

tance of laminate materials (both unclad and etched surfaces)

to the thermal abuse of a solder dip. Resistance to softening,

loss of surface resin, scorching, delamination, blistering and

measling are considered in the evaluation.

Applicable Documents

IPC-TM-650

Test

Methods Manual

2.4.1 Adhesion, Tape Testing

2.4.12 Solderability, Edge Dip Method

MIL-F-14256

Flux

Test Specimen

Each

specimen must be 3.18 cm x 3.18

cm thickness. A separate specimen is required for the unclad,

etched, fluxed, and unfluxed tests. Three samples are

required from each sheet.

Equipment/Apparatus

4.1

electrically heated, thermostatically controlled pot of

sufficient size to accommodate the specimen and containing

no less than 2.25 kg of Sn6O or Sn63

4.2

device, as shown in Figure 1, or some other similar

device may be used, if:

• The rate of immersion, dwell time, and withdrawal are within

the test limits described in the procedure

• The specimen and solder surface remain perpendicular

within 5°

• Wobble, vibrations, and other extraneous movements are

eliminated

4.3

Warnow

2-710 black acid resisting ink, or equivalent

4.4

NAZ-DAR

ER-111 black epoxy ink, or equivalent

4.5

convection drying oven capable of attaining at least

149°C

Procedure

5.1 Etched and Unetched Specimen

5.1.1

Expose:

•

One specimen having a surface upon which no metal clad-

ding was ever applied

• One specimen on which the metal cladding has been

removed by standard etching processes

• One specimen with metal cladding remaining to the Solder-

ability Edge Dip Method in IPC-TM-650, Method 2.4.12

5.1.2

Examine

the specimens for evidence of discoloration

or surface contaminants, loss of surface resin, softness,

delamination, interlaminar blistering, or measles. The speci-

men having metal cladding must also be examined for blister-

ing or delamination of the metal foil from the laminate material.

5.2

Plastic Surface Tape Test

5.2.1

Screen

print one of the test inks to the surfaces of an

unclad specimen and an etched specimen.

5.2.2

Treat

test inks as follows:

1. Warnow 2-710: Cure for a minimum of 30 minutes in air or

oven. The dry film must be hard and dull in finish.

2. NAZ-DAR ER-111: Cure for a minimum of 8 minutes at

135°C. The cured ink must have a hard glossy finish.

5.2.3

After

the specimens have cured properly, perform the

plating adhesion test on the inked surfaces, as defined in IPC-

TM-650, Method 2.4.1. Use type I class A tape.

5.2.4

Carefully

examine specimens for the items discussed

in 5.1.2.

5.2.5

Examine

for evidence of mold release agents, indi-

cated by particles of ink adhering to the tape, or by the

absence of ink from the laminate surface, or both.

5.3

Fluxed and Unfluxed Specimens

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.23

Subject

Soldering

Resistance of Laminate Materials

Date

3/79

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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5.3.1

Clean

the metal clad specimen by light abrasion or

other suitable method, then flux the metal surface with a rosin

flux conforming to MIL-F-14256.

5.3.2

Clean

the unclad specimens by standard production

techniques, then flux the laminate material with a rosin flux

conforming to MIL-F-14256.

5.3.3

Carefully

examine all specimens, then perform the

tests described in 5.1.1 through 5.2.5.

IPC-2412-1

Figure

1 Suggested Dipping Device

IPC-TM-650

Number

2.4.23

Subject

Soldering

Resistance of Laminate Materials

Date

3/79

Revision

age2of2

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1.0

Scope

This

test is designed to determine the Glass

Transition Temperature (T

)

and the Thermal Expansion in the

Z-Axis of dielectric materials used in printed boards by the use

of thermal mechanical analysis (TMA).

Thermal Expansion (TE) is expressed in Coefficient of Thermal

Expansion (CTE) or Percent of Thermal Expansion (PTE).

2.0

Applicable Documents

None

3.0

Test Specimens

3.1 Size

Specimens

shall be approximately 6.35 mm x

6.35 mm [0.25 in x 0.25 in]. The thickness shall be a minimum

of 0.51 mm [0.020 in]; for thicknesses less than 0.51 mm

[0.020 in], or to increase the accuracy of the test, see 6.4.

3.2

Quantity and Sampling

Unless

otherwise specified,

two specimens shall be tested, to be taken from random loca-

tions of the material in question.

4.0

Apparatus or Material

4.1

Thermomechanical

analyzer (TMA) capable of determi-

nation of dimensional change to within 0.0025 mm [0.0001 in]

over the specified temperature range.

4.2

Diamond

blade or wheel, sanding equipment, or equiva-

lent, to provide a specimen of the size and edge quality speci-

fied.

4.3

Desiccator

capable of an atmosphere less than 30%

R.H. at 23°C [73.4°F].

4.4

Etching

system capable of complete removal of metallic

cladding.

4.5 Air

circulating oven capable of maintaining 105 ± 2°C

[221 ± 3.6°F].

4.6

Micrometer

capable of thickness measurements to

within 0.00025 mm [0.0001 in].

5.0

Procedure

5.1 Specimen Preparation

5.1.1

Metallic

clad laminate shall be tested without the clad-

ding. Specimens taken from multilayer boards shall have no

internal metal layers, if possible. Exterior metallic cladding shall

be removed by etching using standard industry practices.

5.1.2

Specimens

shall be cut to the specified size using

appropriate procedures and equipment to minimize mechani-

cal stress or thermal shock.

5.1.3

The

edges shall be smooth and burr-free by means of

sanding or equivalent (to allow the specimen to rest com-

pletely flat on the mounting stage). Use care to minimize

stress or heat on the specimen.

5.1.4

Specimens

shall be preconditioned by baking for 2 ±

0.25 hours, at 105 ± 2°C [221 ± 3.6°F], then cooled to room

temperature in a desiccator.

5.1.5

applicable, determine the thickness of the specimen

(for determination of Percent of Thermal Expansion) and

record as T

5.2

Measurement

5.2.1

Mount

the specimen on the stage of the TMA and

apply a load between 0.1 g and 10.0 g (see note 6.5 for

explanation of the load selection criteria).

5.2.2

Initial Temperature for Startup

For T

determination,

start the scan at a temperature no

higher than 35°C [95°F]. An initial temperature of 23°C

[73°F] is recommended.

b. For TE determination start the scan at a temperature suf-

ficiently lower than the specified temperature range such

that the specified heat rate is stabilized (see 6.6).

5.2.3

Unless

otherwise specified, maintain the scan rate at

10°C [18°F] per minute.

5.2.4

Temperature Excursion

For Tg determination, continue the temperature ramp to

at least 30°C [54°F] above the anticipated transition

region.

b. For TE determination, continue the temperature ramp to

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.4.24

Subject

Glass

Transition Temperature and Z-Axis Thermal

Expansion by TMA

Date

12/94

Revision

Originating Task Group

MIL-P-13949 Test Methods Task Group (7-11b)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

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