IPC-TM-650 EN 2022 试验方法.pdf - 第146页

1 Scope This test method provides a standard method for evaluating the effect of established processing operations used in the manufacture of PWBs on materials that are con- sidered for use in the manufacture of PWBs. Sp…

Where:

is the volume, in ml, of alkali used (tetrabutyl ammonium

hydroxide for Method A, potassium hydroxide for Method B).

M is the molarity of the alkali used.

m is the mass, in grams, of the sample taken.

S is the percentage nonvolatile matter, expressed as a frac-

tion, determined as described in IPC-TM-650, Test Method

2.3.34.

5.3.2

The

acid value of the flux under test is calculated as

the mean of the results obtained on each of the three test

samples.

Notes

6.1 Safety

Observe

all appropriate precautions on MSDS

for chemicals involved in this test method.

IPC-TM-650

Number

2.3.13

Subject

Determination

of Acid Value of Liquid Solder Flux -

Potentiometric and Visual Titration Methods

Date

06/04

Revision

age3of3

电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ

Scope

This

test method provides a standard method for

evaluating the effect of established processing operations

used in the manufacture of PWBs on materials that are con-

sidered for use in the manufacture of PWBs. Specific criteria

for the acceptability are based on copper foil adhesion and

visual surface condition of the base laminate.

Applicable Documents

IPC-TM-650 Test Methods Manual

2.4.8

Peel Strength of Metallic Clad Laminates

MIL-P-13949

Test Specimens

3.1

Copper-clad

epoxy glass laminate materials ranging

from 0.8 mm to 6.5 mm thick, clad on one or both sides.

3.2

Three

specimens shall be tested from each material,

except in the case where the material is clad on both sides,

and then six specimens shall be processed for each material.

Each specimen will have four readings for peel strength (see

IPC-TM-650, Method 2.4.8).

Equipment/Apparatus

4.1 Etching

Typical

production printing, etching, and plat-

ing equipment and materials

4.2

Tester

For

peel strength equipment (see IPC-TM-650,

Method 2.4.8)

Procedure

5.1 Print and Etch

5.1.1

Sand

the edges of the test specimens to remove

burrs, allowing close contact between the specimen, nega-

tive, and frame glass, resulting in a better defined etched pat-

tern.

5.1.2 Scrub

the copper surface(s) with FFF pumice and a

brush to remove any contamination on the surface of the

specimen until it passes a water break test.

5.1.3

Dry

the specimens using compressed filtered air.

5.1.4

Dip

the specimens in the following photoresist solution

at room temperature:

One part by volume KPR III

One part by volume toluene

One part by volume acetone

The specific gravity of the solution is 0.920.

5.1.5

Hold

the specimen by one corner when dipping. Allow

excess solution to drain until dripping stops.

5.1.6

Put

the specimens on rack (after draining) into 80°C

oven from three to five minutes to dry and harden KPR.

5.1.7

Remove

the rack from the oven and allow the speci-

mens to cool to room temperature.

5.1.8

Place

the specimens upon the negative in the printing

frame with the copper side against the negative.

5.1.9

Expose

the mounted specimen 76 mm from the fluo-

rescent black light for seven minutes.

5.1.10

Develop

in trichlorethylene vapor for 15 seconds. It

may require two to six cycles until the pattern is clear. Air-dry

the specimen after developing.

Note: Use the test pattern in Method 2.4.8.

5.2

Etching Process and Etchant Removal

5.2.1 Method A

5.2.1.1

Etch

the specimens with vigorous aeration for the

minimum time (the time to produce a clean pattern with a

minimum of undercutting is approximately seven minutes for

34 mm and 15 minutes for 69 mm copper, using fresh ferric

chloride solution) in 42° Baume (be) ferric chloride solution

maintained at 24°C to 38°C. The etching solution shall be

renewed when the etching time exceeds 15 minutes for 34

mm copper or 30 minutes for 69 mm copper.

5.2.1.2

After

removal of the copper, immediately wash the

specimens with running tap water at 16°C to 32°C for two to

five minutes. Thereafter, keep the specimens from drying until

reaching step 5.2.1.7.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.3.14

Subject

Print,

Etch, and Plate Test

Date

4/73

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

age1of2

电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ

5.2.1.3

Immerse

the specimens in a 10% solution of oxalic

acid in water at 16°C to 32°C for 15 to 20 minutes. Provide

gentle circulation of the oxalic acid solution during this period.

Flush the specimens with running tap water at 16°C to 32°C.

Caution: Oxalic acid is toxic.

5.2.1.4

Scrub

the specimens with Grade FFF pumice to

remove resist, or wipe off the resist with a lint-free cloth moist-

ened with a suitable solvent (i.e., methylethyl ketone, trichlor-

ethylene, or toluol). In cleaning the specimens, care must be

exercised to avoid abrading the adhesive layer with the pum-

ice or attacking the adhesive or laminate with the solvent.

Specimens not involving the use of resist need not be

scrubbed.

5.2.1.5

Scrub

the specimens with a plastic-bristled brush

under running tap water at 16°C to 32°C and rinse for 30

minutes.

5.2.1.6

Rinse

the specimen in distilled water.

5.2.1.7

Dry

the specimens for one hour in an oven at 80°C

± 3°C. If specimens are for electrical tests, handle only with

rubber or polyethylene gloves.

5.2.2

Method B

5.2.2.1

Remove

foil from the specimen using a solution

containing 298g±10perliter of ammonium persulfate and

15.5 mL ± 1.0 per liter of sulfuric acid, specific gravity 1.836

(66°Be). The temperature shall be 43°C ± 3°C.

5.2.2.2

Rinse

the specimens thoroughly in running water

and dry with a clean air blast.

5.2.2.3

Dry

the specimens in an oven at 80°C ± 3°C for one

hour and allow the specimens to cool.

5.3

Petrolatum Evaluation

5.3.1

Drill

1.5 mm holes in the pads of the 3 mm lines with

good fabricating practice.

5.3.2

Remove

the developed KPR by rubbing the pattern

lightly with cold trichlorethylene liquid. Rinse in water. Scrub

the specimens with FFF pumice and water with a strong

bristle brush.

5.3.3

Plate

per MIL-P-13949. Deoxidize by dipping in 10%

hydrochloric acid for two minutes and wash in running water

for five minutes. Dry 30 minutes, minimum, at 105°C to

110°C.

5.3.4 Coat

the etched copper surface with white petrola-

tum. Specimens shall be immersed horizontally in solder

6.5mm below the surface for 20 ± 1 seconds at 260°C +5°C/-

0°C) measured 25 mm below the surface.

5.3.5

Remove

the petrolatum from the surface of the speci-

men with a two minute scrub in cold trichlorethylene, followed

by a one minute rinse in hot trichlorethylene.

5.3.6

Inspect

the surface for weave exposure, measling,

crazing, resin loss, delamination and blistering.

5.3.7

Test

four 0.8 mm lines on the specimen for peel

strength and report the average value for the four lines. This

test shall be performed in accordance with Method 2.4.8.

5.4

Report

5.4.1

The

results of the testing by this test method shall be

reported in a written report, which contains the following as a

minimum:

1. Certification that the test was performed in accordance

with this test method

2. Identification of specimens tested

3. Test results for each of the specimens tested, including the

results of the visual inspections and peel tests

IPC-TM-650

Number

2.3.14

Subject

Print,

Etch, and Plate Test

Date

4/73

Revision

age2of2

电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ