IPC-TM-650 EN 2022 试验方法.pdf - 第218页

1 Scope This test method is used to determine the ability of a solder mask to resist degradation by solvents and cleaning agents. 2 Applicable Documents IPC-SM-840 Qualification and Performance of Permanent Solder Mask I…

Analyzing conditions depends on the test devices, test speci-

mens, their composition and environment.

5.3 Calculation of Halogen Content Insert the concentra-

tion of halogen ion (Cl

/Br

) obtained in 5.2 in the following for-

mula to obtain halogen contents in the specimens:

Chlorine (wt%) =

{[Cl

concentration in the test fluid (ppm) x

Dilution ratio in the fluid] -

[Cl

concentration in the reference (ppm) x

Dilution ratio in the reference]} x

{quantity of test solution (ml) /

mass of the test specimen} x 10

-7

Note: For the bromine content, use the same equation but

insert Br

values in the place of Cl

Note: The dilution ratio is the amount of added water as com-

pared to the total amount of solution in the test flask. If the

amounts used were 50 ml each, the dilution ratio would be 2.

6 Report In addition to the general requirements for report-

ing, the report shall include:

a. Test method number and revision.

b. Date of the test.

c. Identification and description of the specimen.

d. Average chloride content of the five (5) specimens in ppm.

e. Average bromide content of the five (5) specimens in ppm.

f. Average total halogen content of the five (5) specimens in

ppm.

g. Any deviation from this test method.

h. Date of the test.

i. Name of the person conducting the test.

IPC-TM-650

Number

2.3.41

Subject

Test Method for Total Halogen Content in Base Materials

Date

04/06

Revision

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1 Scope This test method is used to determine the ability of

a solder mask to resist degradation by solvents and cleaning

agents.

2 Applicable Documents

IPC-SM-840

Qualification and Performance of Permanent

Solder Mask

IPC-A-25A-G-KIT

Multipurpose One-Sided Test Pattern

3 Test Specimens Six (6) IPC-B-25A boards coated with

solder mask on the top side. Five are to be tested and one is

to be held as a control.

The IPC-A-25A-G-KIT artwork package provides the Gerber

files necessary for the fabrication of the standard IPC-B-25A

test board used with this test method.

4 Apparatus and Reagents

4.1

Reagent Grade 2-Propanol (Isopropyl Alcohol)

4.2 Deionized Water (DI Water) with resistivity ≥2MΩ-cm

and ≤10 MΩ-cm

4.3 10% Alkaline Detergent [by volume], which shall be

comprised of

• 5% alkanolamine

• 2.5% 2-butoxyethanol

• 2.5% glycol ether

• 90% DI Water

4.4 Monoethanolamine

4.5 Miscellaneous laboratory-ware (e.g., beakers, funnels,

storage bottles, graduated cylinders) including:

1) A hot plate capable of heating up to 65 °C [149 °F]

2) A thermometer capable of measuring accurately up to 100

°C [212 °F]

3) A vent hood, or performed with adequate ventilation

4.6 Thermometer with measurement uncertainty less than 2

°C [3.6 °F] and precision better than 1 °C [1.8 °F].

5 Procedures

5.1 Chemical Exposure

5.1.1

Prepare the solvents and cleaning agents as outlined

in Section 4 and Table 1.

5.1.2 Completely immerse one test specimen in each of the

solutions shown in Table 1. A new specimen is to be used for

each chemical.

5.1.3 After immersion, hang the specimens to dry for ten

minutes at ambient laboratory conditions.

5.2 Visual Examination

5.2.1

Visually examine each printed board with corrected

20/20 vision without magnification for delamination or surface

degradation such as cracks, tackiness, blisters or swelling of

the solder mask.

6 Notes

6.1 Safety

Operator should be trained and familiar with the

hazards inherent to the chemicals being used and analyzed.

Proper personal safety equipment, such as safety glasses,

gloves and splash apron, and adequate ventilation shall be

used.

1. www.ipc.org/onlinestore

Table 1 Exposure of Solder Mask

to Solvents/Cleaning Agents

Solvent/

Cleaning Agent

Temperature

(°C) [°F]

Time

(Minutes)

Isopropanol

Ambient

Laboratory Conditions

75% isopropanol/

25% deionized water

46±2°C[115 ± 3.6 °F] 15

10% Alkaline detergent 57±2°C[135 ± °F] 2

Monoethanolamine 57±2°C[135 ± °F] 2

Deionized water 60±2°C[140 ± °F] 5

D-Limonene

Ambient

Laboratory Conditions

Note: Record the ambient temperature and temperature measurement

uncertainty in °C.

3000 Lakeside Drive, Suite 309S

Bannockburn, IL 60015-1219

IPC-TM-650

TEST METHODS MANUAL

Number

2.3.42

Subject

Solder Mask - Resistance to Solvents and

Cleaning Agents

Date

03/07

Revision

Originating Task Group

Solder Mask Performance Task Group (5-33b)

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

Page1of1

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

1 Scope The purpose of this test method is to measure the

thickness and phosphorous (P) concentration of chemically

(electroless) deposited nickel (Ni) coatings by (energy disper-

sive) X-ray fluorescence (XRF) analysis.

The measurement is nondestructive and noncontact, and can

be performed either in ambient atmosphere or under vacuum.

Measurements shall be made on a defined feature (equi-

valent to a typical SMT pad) of 1.5 mm x 1.5 mm [0.060 in x

0.060 in] or equivalent area, using a 0.6 mm diameter collima-

tor. This equates to a measuring spot size (analysis area) of

1 mm diameter.

This test method is designed primarily for failure analysis, pro-

cess qualification and process auditing. It is not intended for

daily production control, due to the complexity and cost of the

equipment required.

2 Applicable Documents

IPC-4556

Specification for Electroless Nickel/Electroless

Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit

Boards

IPC-4552 Specification for Electroless Nickel/Immersion

Gold (ENIG) Plating for Printed Circuit Boards

3 Test Specimen This test method is primarily designed

for measurement of the phosphorus content in ‘‘as plated’’

ENIG PWBs. Other ENIG or electroless nickel (EN) plated sub-

strate materials may also be tested using this method, includ-

ing flexible circuits, silicon wafers, aluminum or steel. The typi-

cal thickness range of the NiP layer on PWB substrates is 3 to

6 µm [118.1 to 236.2 µin]. The Phosphorous content can

range from0%to14%byweight. Minimum and maximum

thickness for single layers of electroless nickel required for

accurate determination of the P content is 0.5 µm to 25 µm

[19.7 µin to 984 µin]. The maximum thickness of gold present

on the surface of the specimen when tested shall be less

than 0.10 µm [0.004 µin]. For samples with thicker gold, the

gold must be removed by chemical stripping or Ion milling

prior to evaluation.

While this test method is also suitable for evaluating phospho-

rus content in ENEPIG samples, the thickness of both the

gold (Au) and palladium (Pd) layers needs to be considered.

The maximum thicknesses of the layers over the electroless

nickel on ENEPIG specimens when tested shall not exceed

0.05 µm [0.002 µin] of Au and 0.10 µm [0.004 µin] of Pd on

top of the EN layer. This constraint will impact measurement

of ENEPIG samples plated on the higher side of the current

IPC-4556 specification. For samples with gold thicknesses

above 0.05 µm [0.002 µin], chemical or Ion milling stripping

may be carried out prior to evaluation. With the gold removed,

the maximum thickness of palladium on a specimen when

tested shall be 0.25 µm [0.0098 µin].

Note: Electroless palladium deposits may also contain phos-

phorus and its contribution to the total phosphorus content

must be taken into account when reporting the phosphorus

content of the deposit.

The sample to be tested should be flat and ideally not popu-

lated with components in the area of measurement. If testing

is done on populated boards, consideration has to be given to

measurement location, such that none of the electronic com-

ponents block the fluorescent radiation from reaching the

detector, as described in Section 5.4.

The test specimen requires no other sample preparation.

4 Apparatus An X-ray fluorescence spectrometer consist-

ing of the following:

• A radiation source (X-ray tube with adjustable HV power

supply from 10 kV to 50 kV).

• A primary beam filter and safety shutter assembly.

• A video camera.

• An X-ray collimator or a polycapillary X-ray optic.

• An energy dispersive Silicon Drift Detector SDD (a device in

which charge carriers created by the incidence of X-ray pho-

tons on a high purity silicon substrate are directed to a mea-

suring electrode by an applied transverse electric field),

including electronics.

• Evaluation software capable of simultaneously measuring

coating thickness and composition of multiple layers. The

software of the instrument shall have the capability of mul-

tiple excitation modes. It is necessary to apply different exci-

tation conditions; a soft excitation for the excitation of P-K at

10 kV and a hard excitation for Ni-K at 50 kV.

• A programmable X-Y positioning stage (accurate positioning

is required especially if small areas are to be analyzed).

• The instrument must be able to record the Intensities of the

individual radiation components of the Phosphorous K

energy line (I

P-K

) and the Nickel K energy line (I

Ni-K

) with suf-

ficient precision.

3000 Lakeside Drive, Suite 105N

Bannockburn, IL 60015-1249

IPC-TM-650

TEST METHODS MANUAL

Number

2.3.44

Subject

Determination of Thickness and Phosphorus

Content in Electroless Nickel (EN) Layers by X-Ray

Fluorescence (XRF) Spectrometry

Date

03/16

Revision

Originating Task Group

Plating Processes Subcommittee (4-14)

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

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