IPC-TM-650 EN 2022 试验方法.pdf - 第799页

1.0 Scope 1.1 To determine the effects of exposing connectors to extremes of high and low temperature and of the mechanical stresses created by rapid transition between the temperature extremes. 2.0 Reference Documents 2…

5.3 The solder bath shall be occasionally stirred with a clean

stainless steel paddle to ensure that it is of uniform composi-

tion and temperature throughout. The surface of the bath shall

be skimmed immediately prior to each test to remove any

dross or residual unburned flux from previous tests.

5.4 The sample shall be affixed to the dipping device shown

in Figure 2 and oriented so that the contact termination will

enter the solder bath to the specified depth.

5.5 The sample shall be immersed in the solder bath at a

rate of 1.00 ± 0.25 inches per second and withdrawn at the

same rate. The dwell time in the solder shall be 5.0 ± 0.5 sec-

onds.

5.6 The sample shall not be removed from the dipping

device or otherwise disturbed until the solder has solidified.

5.7 The sample shall be thoroughly cleaned of residual flux

and examined under 10X magnification for evidence of the

following:

A. Dewetting of areas to be soldered.

B. Pinholes or voids in the solder coat.

C. Incomplete fill of solder well or hole.

6.0 Notes

6.1

Acceptance criteria shall be established in terms of one,

or any combination, of the following:

A. Less than 95% coverage of flat surfaces.

B. Pinholes or small voids or solder surface roughness con-

centrated in any one area of the contact.

C. Poor filleting around wire or incomplete fill of solder well.

IPC-3-10-2

Figure 2 Suggested Dipping Device for Solderability Test

IPC-TM-650

Number

3.10

Subject

Solderability, Connectors

Date

7/75

Revision

Page2of2

1.0 Scope

1.1

To determine the effects of exposing connectors to

extremes of high and low temperature and of the mechanical

stresses created by rapid transition between the temperature

extremes.

2.0 Reference Documents

2.1

Information in this section is intended to parallel the test

method described in EIA-RS-364/TP-32.

3.0 Test Specimen

3.1

A connector (plug and receptacle) complete with all

applicable guide, keying and engaging hardware or a card-

edge receptacle.

3.2 The plug and receptacle shall be tested in a configura-

tion normal to its functional capacity including mounting, ter-

mination, and mating.

3.3 The plug and receptacle or the card-edge receptacle

and a nominal thickness printed circuit board shall be mated

during this test, except as otherwise specified.

4.0 Apparatus

4.1

A dual chamber (or two separate chambers) capable of

maintaining the applicable temperature within ± 2°C at the

geometric center under no load conditions, and a thermal dis-

tribution not greater than ± 5°C of the temperature at the

geometrical center.

5.0 Procedure

5.1

The chamber(s) shall be adjusted to, and maintained at,

the high and low extremes specified in the individual connec-

tor specification. Thermal equilibrium shall be attained prior to

the start of the test. (See 6.3)

5.2 The mated test specimen shall be suspended within the

low temperature chamber and subjected to the number of

continuous thermal shock cycles specified in the individual

connector specification. One complete cycle of thermal shock

is defined by Table 1. (See 6.4)

Table 1 Thermal Shock Test Conditions (One Cycle)

Step Temperature, °C Time

1 Low extreme (+0, -5°C) 30 min. (min.)

2 25°C (+10, -5°C) 2 min. (max.)

3 High extreme (+5, -0°C) 30 Min. (min.)

4 25°C (+10, -5°C) 2 min. (max.)

WARNING:

BOTH THE HIGH AND LOW TEMPERATURE

EXTREMES USED DURING THIS TEST WILL CAUSE

SEVERE BURNS. USE INSULATED GLOVES WHEN HAN-

DLING THE TEST SPECIMEN.

5.3 After completion of the specified number of cycles and

attaining room ambient temperature, the sample shall be visu-

ally examined for evidence of the following:

A. Excessive permanent dimensional changes (distortion).

B. Cracking or delamination of finishes or dielectric materials.

C. Opening of seals or seams.

D. Hardening or softening of dielectric materials.

5.4 Unless otherwise specified in the individual connector

specification, the test specimen shall be subjected to the with-

standing voltage test, (3.13).

6.0

Notes

6.1 Acceptance criteria shall be established in terms of one,

or any combination, of the following:

A. Visible evidence of damage or significant material change.

B. A deterioration in withstanding voltage occasioned by

internal fissures in the dielectric with or without the

accompanying entrapment, of moisture.

6.2 The test chambers shall be of the forced (circulating) air

type to insure even temperature distribution.

2215 Sanders Road

Northbrook, IL 60062-6135

IPC-TM-650

TEST METHODS MANUAL

Number

3.11

Subject

Thermal Shock, Connectors

Date

7/75

Revision

Originating Task Group

N/A

Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

Page1of2

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

6.3 Thermal equilibrium shall be assumed to have been

attained when three successive temperature readings taken at

five-minute intervals show a variation not greater than 3°C.

6.4 The exposure and transfer times specified in Table 1 are

based on an assumed sample weight less than 0.5 pound

(226 GMS). Appropriate increases in these periods shall be

made for larger samples to ensure that the designated test

temperature is attained.

IPC-TM-650

Number

3.11

Subject

Thermal Shock, Connectors

Date

7/75

Revision

Page2of2