IPC-TM-650 EN 2022 试验方法.pdf - 第695页

7 Notes 7.1 The design of the thermal cycling system must be flex- ible enough to allow for an extremely high rate of temperature change and for the rate of temperature change to be deter- mined. Some issues to consider …

• -40 °C

• -55 °C (default)

• -65 °C

6.5.1.3 Tolerances The tolerance associated with the hot

cycle is +/-5 °C. The tolerance associated with the cold cycle

is +/-5 °C.

6.5.1.4 Dwell Time at Extremes During each cycle, the

test specimen(s) shall be subjected to each temperature

extreme for the time required for stabilization plus time

required to record all measurements (up to 15 minutes when

a dual chamber is used).

6.5.2 Temperature Change Rate The rate of change

between temperature extremes, both high to low and low to

high, shall be as high as possible. The temperature change

shall be at least 1 °C per second for at least the center 60%

of each transition period, hot to cold and cold to hot. Note

that for thicker coupons greater than 2.5 mm [0.100 in], this

change rate may not be achievable.

6.5.2.1 Temperature Documentation

6.5.2.1.1

The temperature of a representative test speci-

men shall be recorded at the end of the dwell at each tem-

perature extreme, for every cycle.

6.5.2.1.2 A temperature profile from at least one complete

cycle shall be recorded during each test and included in the

test report. This shall include the temperatures of a

representative test specimen and the hot/cold media. The

temperatures shall be taken at sufficient frequency to show

compliance to 5.5.1 and 6.5.1.3. Recording data every sec-

ond for this purpose is recommended.

6.6 Testing Summary

A summary of Qualification and Quality Conformance testing

is listed below in Table 6-2.

6.7 Evaluation

6.7.1 Resistance Change

The change in resistance

between the first and each succeeding temperature cycle

shall be determined. The maximum allowable percent change

in resistance between the first and any subsequent cycle

shall be 5% unless otherwise specified.

6.7.2 Results Test results including cycles to failure, corre-

sponding percent change of the failure, and the percent

change of the final cycle shall be documented.

6.8 Deviations Deviations to the stated requirements or

additional requirements defined here shall be AABUS.

Table 6-2 Comparison of Qualiﬁcation and Quality Conformance Testing

Item Qualiﬁcation Quality Conformance / Acceptance Testing

Conditioning 6 hours minimum, 105 - 125 °C

Reflow Simulation 6 cycles, 230, 245 or 260 °C profile

Temperature Min AABUS -40 °C, -55 °C (default), -65 °C

Temperature Max AABUS min. of:

-10 °C

Reflow peak -25 °C

210 °C

Sample Change Rate

> 10 °C/min for both hot and

cold

> 1 °C/sec for both hot and cold

Number of Cycles AABUS 100

Failure Threshold AABUS 5%

Resistance Data 1 reading/cycle near the end of the high temperature dwell

Temperature Data

1 reading/cycle near the end of the high and low temperature dwells (sample)

1 reading/sec through 1 complete cycle (sample and media)

Note 1. Acceptance testing and quality conformance testing as described in IPC-6010 series printed board performance specifications.

IPC-TM-650

Number

2.6.7.2

Subject

Thermal Shock, Thermal Cycle and Continuity

Date

3/2020

Revision

Page4of5

7 Notes

7.1

The design of the thermal cycling system must be flex-

ible enough to allow for an extremely high rate of temperature

change and for the rate of temperature change to be deter-

mined. Some issues to consider are as follows:

• Thermal mass compensation capability (energy vs. time)

• Environmental control capability (heating and cooling)

• Reproducibility of parameters

• Transfer speed (if applicable)

• Heating ramp rate

• Cool down rate

• Programming capability

• Profile memory

7.2 Suggested Drawing Note As this method addresses

assembly issues with printed boards, it is recommended that

the user of the printed board establish a drawing note in the

procurement documentation to provide the printed board fab-

ricators with guidance relative to the intended reflow process

of the printed board. An example of such a drawing note is

provided as follows:

XX. IPC D COUPON TESTING

A. COUPONS SHALL INCLUDE COMPONENT (A), VIA (B)

AND ALL PROPAGATED B STRUCTURES IAW IPC-

2221B APPENDIX A. 2 OF EACH COUPON DESIGN

SHALL BE TESTED PER MANUFACTURING PANEL.

B. THE IPC D COUPONS SHALL BE SUBJECTED TO 6

REFLOW SIMULATIONS IAW IPC-TM-650, METHOD

2.6.27 USING THE [230 °C, OR 245 °C, OR 260 °C]

PROFILE. ACCEPTANCE CRITERIA SHALL BE<5%

CHANGE IN RESISTANCE.

C. AFTER REFLOW SIMULATION TESTING, THE IPC D

COUPONS SHALL BE SUBJECTED TO 100 THERMAL

SHOCKS IAW IPC-TM-650, METHOD 2.6.7.2 FROM

-55C TO [MINIMUM OF (LAMINATE T

–10°C), OR

(REFLOW PEAK TEMPERATURE – 25 °C), OR

210 °C]. ACCEPTANCE CRITERIA SHALL BE<5%

CHANGE IN RESISTANCE.

Note: Parameters in bold should be tailored to each

application.

IPC-TM-650

Number

2.6.7.2

Subject

Thermal Shock, Thermal Cycle and Continuity

Date

3/2020

Revision

Page5of5

Scope

This

test method is to determine the physical

endurance of applied polymer solder mask to sudden

changes of high and low temperature excursions to cause

physical fatigue.

Applicable Documents

IPC-CC-830

Qualification

and Performance of Electrical

Insulating Compounds for Printed Board Assemblies

IPC-SM-840

Qualification

and Performance of Permanent

Coating (Solder Mask) for Printed Boards

Test Specimens

3.1 Qualification Testing

Six

IPC-B-25A test boards (see

Figure 1) coated with solder mask and cured in accordance

with solder mask supplier’s recommendations.

3.2

Conformance Testing

Six

IPC-B-25A boards (see Fig-

ure 1) containing the C pattern (‘‘Y’’ pattern) with 0.635 mm

lines/0.635 mm spacing [25.00 mil lines/25.00 mil spacing] or

minimum spacing on the production board, whichever is

smaller, coated with solder mask according to the coating

supplier’s recommendations.

Apparatus

4.1 Chamber

Automatically

controlled dual temperature

environmental test equipment or two separate chambers

capable of maintaining -65° ± 5°C [-85° ± 9°F] and +125° ±

5°C [+257° ± 9°F].

Procedure

5.1 Specimen Preparation

order to test the compatibil-

ity of solder mask with conformal coating, conformal coat

three of the above test specimens with a coating in accor-

dance with IPC-CC-830 and cure in accordance with the

coating supplier’s recommendations

5.2

Test

5.2.1

Place

the test specimens into the test chamber, so that

they do not touch one another, and set the parameters as fol-

lows:

a. Temperature Extremes: as specified in IPC-SM-840 ± 5°C

[± 9°F].

b. Dwell Time at Temperature Extremes: 15 minutes

c. Transfer Time: Less than two minutes

d. Number of Cycles: 100

5.2.2

Activate

the test chamber and begin testing.

5.2.3

One

thermal cycle consists of the following:

a. Expose the specimens to the high temperature for 15 min-

utes.

b. Transfer the specimens to the low temperature in less than

two minutes.

c. Expose the specimens to the low temperature for 15 min-

utes.

d. Transfer the specimens to the high temperature in less

than two minutes.

IPC-2673-1

Figure

1 IPC-B-25A Test Board

2215

Sanders Road

Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.6.7.3

(Supersedes

2.6.7.1 for Solder Mask Test)

Subject

Thermal Shock - Solder Mask

Date

07/00

Revision

Originating Task Group

Solder Mask Performance Task Group (5-33b)

Material

in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

age1of2

ASSOCIA

TION CONNECTING

ELECTRONICS INDUSTRIES

电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ