IPC-TM-650 EN 2022 试验方法.pdf - 第116页

1 Scope To determine the effect of chemicals used in printed board fabrication on metal-clad and bare flexible dielectric materials. Caution: This test method uses hazardous chemicals to generate data. The person impleme…

1.0

Scope

This

method evaluates the chemical cleanability

of metal-clad laminate surfaces of oxidation and anti-oxidation

protective coatings.

2.0

Applicable Document

None.

3.0

Test Specimen

The

size of the test specimen shall be

determined by the post etching tests to be performed.

4.0

Apparatus

4.1

Standard

conveyorized spray cleaning modules or suit-

able laboratory equipment.

4.2

Personal

safety equipment needed to perform this test

are as follows: rubber or polyethylene gloves, plastic or coated

apron and safety goggles.

4.3

Chemicals

4.3.1 Method A—Sodium Persulfate

Chemical Concentration Temperature

Cleaner/

Degreaser

Per manufacturer’s

recommended limits

As recommended

Sodium

Persulfate

1.5 lbs/gal

(± 0.5 lb/gal)

100°±5°F

(38°±3°C)

4.3.2 Method B—Ammonium Persulfate

Chemical Concentration Temperature

Cleaner/

Degreaser

Per manufacturer’s

recommended limits

As recommended

Ammonium

Persulfate

Tech Grade

2.0 lbs/gal

(± 0.5 lb/gal)

100°F Max

5.0 Procedure

5.1 Specimen Preparation

Shear the material to the

required specimen size and remove the rough edges from the

specimen by sanding or other suitable means.

5.2

Cleaning

5.2.1 Conveyorized Spray Cleaning

Process

the speci-

men through the conveyorized modules at a speed which will

permit 30 ± 5 seconds of exposure to the micro etching solu-

tion. Rinse specimens with deionized water for 1-2 minutes

after micro etching.

5.2.2

Laboratory Cleaning

Place

the specimen in a

cleaner/degreaser solution and gently agitate for 30 ± 5 sec-

onds. Remove the specimen and flush with tap water. Next

place the specimen in a micro etch solution for 30 ± 5 sec-

onds and vigorously agitate. Remove the specimen and flush

with deionized water for 1-2 minutes.

5.3

Surface Evaluation

The

metal cladding on the test

specimen shall be cleaned to a uniform matte finish. Deionized

or distilled water poured on the metal surface does not bead

or form puddles.

6.0 Notes

6.1

Sodium

persulfate solution shall be replaced if the cop-

per concentration exceeds 3.0 oz/gal (22.5 gal).

6.2

Solution

spray from nozzles should be checked for uni-

formity across the specimen.

The

Institute for Interconnecting and Packaging Electronic Circuits

2215 Sanders Road • Northbrook, IL 60062-6135

IPC-TM-650

TEST

METHODS MANUAL

Number

2.3.1.1

Subject

Chemical

Cleaning of Metal-Clad Laminate

Date

5/86

Revision

Originating Task Group

N/A

Material

in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

age1of1

电子技术应用　　　　　　　ｗｗｗ．ＣｈｉｎａＡＥＴ．ｃｏｍ

1 Scope To determine the effect of chemicals used in

printed board fabrication on metal-clad and bare flexible

dielectric materials. Caution: This test method uses hazardous

chemicals to generate data. The person implementing this test

method should refer to the appropriate Material Safety Data

Sheet or equivalent for each chemical for safe operation.

2 Applicable Documents

IPC-TM-650

Method 2.4.9, Peel Strength, Flexible Printed

Wiring Materials

IPC-TM-650 Method 2.4.18.3, Tensile Strength, Elongation

and Modulus

3 Test Specimens

3.1 Method A - Metal-Clad Dielectric

The test specimen

shall consist of a size commensurate with the peel strength

test fixture and have an etched conductor pattern in accor-

dance with Figure 1.

3.2 Method B - Bare Dielectric The test specimens shall

consist of nominal 12.7 mm ± 0.25 mm) x 200 mm [approxi-

mately 0.5 in x 8 in] strips of bare dielectric.

4 Test Equipment and Chemicals

4.1

Necessary equipment to produce printed wiring by the

etched foil process using good commercial practices.

4.2 Timing Device A watch or other suitable device that is

accurate to within ± 1 second per hour and capable of dis-

cerning increments of 1 second.

4.3 Dimension Measuring Device A micro-rule or equiva-

lent optical system capable of measuring a dimension of 225

mm [approximately 9 inches], accurate and precise to 25 µm

[0.0010 in].

4.4 Thickness Measuring Device A micrometer or

equivalent capable of measuring up to 25 mm [approximately

1 in] thickness, accurate and precise to 10 µm [0.0004 in].

4.5 Test Specimen Cutter Thwing-Albert JDC Precision

Cutter or equivalent. The test specimen cutting device shall

be capable of cutting a film strip 12.7 mm ± 0.25 mm [0.500

in ± 0.010 in] wide over the length of the test specimen. It is

imperative that the cutting edges be kept sharp and free from

visible scratches or nicks. The use of striking dies is not rec-

ommended because of poor and inconsistent test specimen

edges. (This detail is copied from TM-650, Method 2.4.18.3,

Section 4.3. For further information, contact the manufacturer

of the cutting equipment chosen.)

4.6 Tensile Tester Instron Model 4501 Tensile Tester with

a 0.2 kN load cell (or equivalent tensile tester). The testing

machine shall be equipped with a load cell whose compli-

ance is a maximum of 2% of the test specimen extension

within the range being measured. Digital, as opposed to ana-

log, self-calibrating load cells are preferred, since they elimi-

nate the need for calibration and potential error associated

with calibrating analog load cells using external weights. The

testing machine must be equipped with a device for continu-

ously recording the tensile load and the amount of the sepa-

ration of the grips; both of these measuring systems should

be accurate to ± 2%. The rate of separation of the grips shall

be accurate to ± 0.1% and capable of adjustment from

approximately 0 to 50 mm/minute [approximately 0 to 2

in/minute] (for more detail on tensile and elongation testing,

see IPC-TM-650, Method 2.4.18.3).

4.7 Test Chemicals The following chemicals are to be

used. After immersion in each chemical, the specimen shall

IPC-232g-1

Figure 1 Chemical Resistance Test Pattern

(A) Overall size: nominally 25 mm x 200 mm [approximately 1 inx8in]

(B) Conductor width and length: 0.5 mm* x 190 mm [approximately

0.02 in x 7.5 in]

[approximately 0.5 in x 0.25 in]

*NOTE: It is critical that the widths of the immersed and non-immersed

segments of the copper trace be within ± 0.03 mm [± 0.0012 in]

of each other.

3000 Lakeside Drive, Suite 309S

Bannockburn, IL 60015-1249

IPC-TM-650

TEST METHODS MANUAL

Number

2.3.2

Subject

Chemical Resistance of Flexible Printed Board

Materials

Date

12/07

Revision

Originating Task Group

Flexible Circuits Test Methods Subcommittee

(D-15)

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only

and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this

material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.

Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.

Page1of3

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

be rinsed for one (1) minute minimum to five (5) minutes maxi-

mum in its own dedicated deionized (DI) water rinse which is

maintained at 55 °C ± 5 °C [131 °F ± 9 °F].

a) Etchant Solution: An aqueous solution of 450 grams ± 4.5

grams Cupric Chloride Dihydrate [CuCl

.2H

0] (CAS

10125-13-0) and 150 ml±2mlReagent Grade (36.5-

38%) Hydrochloric Acid [HCl] (CAS 7647-01-0) with a spe-

cific gravity of 1.155 - 1.164 [19° - 21° Baum?] diluted in

one liter of water, 55 °C ± 5 °C [131 °F ± 9 °F].

b) Stripper Solution: An aqueous solution of 5.0% Potassium

Hydroxide [KOH] (CAS 1310-58-3) with the equivalent

of 0.5% Monoethanolamine [HO(CH

)

] (CAS 141-

43-5) and 0.5% Propylene Glycol Monobutyl Ether

[CH

CH(OH)CH

O(CH

)

] (CAS 5131-66-8), 55 °C ±

5 °C [131 °F ± 9 °F] or an equivalent commercial stripper

solution.

c) Acid Cleaner: 2N Sulfuric Acid [H

SO4] (CAS 7664-93-9),

23 °C ± 2 °C [73.4 °F ± 3.6 °F]

d) Organic Cleaner: 70% ± 5% Isopropanol [(CH

)

CHOH]

(CAS 67-63-0), 23 °C ± 2 °C [73.4 °F ± 3.6 °F]

4.7.1 Other Chemicals Other specified chemicals may be

added where the customer/supplier have specific process

requirements. A list of fluids or chemicals may be specified

where the end product circuit will be subjected to specific

environments, such as: fuels, cleaning solvents, etc.

5 Procedures

5.1 Method A – Metal-Clad Dielectric

5.1.1 Test Specimen Preparation

Prepare a minimum of

six (6) test specimens [twice as many minimum as required for

one set of tests, allowing for at least one repetition, if needed]

in accordance with Figure 1 using standard commercial prac-

tices. Do not remove the etch resist. Measure the conductor

width of the test specimen to ensure compliance with width

requirements. Mark the halfway line for the subsequent dip-

ping tests with a piece of platers tape or similar method on the

nonpatterned side (back side) of each test specimen, in

accordance with Figure 2.

5.1.2 Conditioning Condition each test specimen for 24

hours +1/-0 hours at 23 °C±2°C[73.4 °F ± 93.6 °F] and

50% ± 5% relative humidity prior to testing.

5.1.3 Test Procedure

5.1.3.1 Sequential Chemical Exposure Test

Immerse

three (3) test specimens for one minute [+10 seconds/-0 sec-

onds] halfway into each of the specified chemicals. After

immersion in each chemical, rinse each test specimen in the

appropriate dedicated immersion DI water rinse which is

maintained at 55 °C±5°C[131 °F ± 9 °F] for one (1) minute

minimum and five (5) minutes maximum. Use the sequence as

follows:

1. Etchant Solution

2. Dedicated Etchant DI Immersion Rinse

3. Stripper Solution

4. Dedicated Stripper DI Immersion Rinse

5. Acid Cleaner

6. Dedicated Acid Cleaner DI Immersion Rinse

7. Organic Cleaner

8. Dedicated Organic Cleaner DI Immersion Rinse

Within fifteen (15) to thirty (30) minutes after completion of the

sequential chemical exposure, observe for tackiness, blister-

ing, bubbles, delamination, or swelling within the dielectric,

blistering or delamination of the copper and dielectric, or

change in color of dielectric. After sixteen (16) to twenty-four

(24) hours, repeat the observations and peel the conductors

for the immersed and non-immersed specimens, using the

following procedure [see IPC-TM-650, Method 2.4.9 (Method

A)].

Attach the test specimen to the free wheeling rotary drum test

fixture with double-sided tape, cement and/or mechanical

clamps. The referee attachment technique will be double-

sided adhesive tape. Peel the conductor at a rate (crosshead

speed) of 50.8 mm/minute [2.0 in/minute]. The peel load shall

be between 15 - 85 percent of the range of the scale used on

the testing machine.

5.1.4 Data Evaluation Record and report all discrepancies

noted during the observation periods The peel load shall be

IPC-232g-2

Figure 2 Chemical Resistance Test Pattern with Halfway

Line Marking Example

Immersion Line

Tab end Immerse this end

IPC-TM-650

Number

2.3.2

Subject

Chemical Resistance of Flexible Printed Board Materials

Date

12/07

Revision

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