Operating Instructions_VF335_en.pdf - 第10页
Table of contents 8.11.9.8 Completing the DIP solder pot replacement process ................................................... 438 8.11.10 Board fixation: Clean and lubricate slide surfaces ...........................…
Table of contents
8.6.7 Check the nitrogen flow rate to the solder nozzle .........................................................................329
8.6.8 Solder level monitoring Checking input pressure...........................................................................330
8.6.9 Checking the nitrogen flow to the solder level monitoring............................................................332
8.6.10 Solder level monitoring: Check for proper operation.....................................................................333
8.6.11 Conveyor system: visual inspection................................................................................................334
8.6.12 Flux reserve: Visual inspection, cleaning ........................................................................................335
8.6.13 Spray fluxer: Cleaning the whole fluxer area..................................................................................336
8.6.14 Cleaning the selective soldering module .......................................................................................338
8.6.15 Visual inspection of the axis system (mechanics)...........................................................................339
8.7 Maintenance work to be performed monthly ..............................................................................................341
8.7.1 Cleaning the machine outside ........................................................................................................342
8.7.2 Switch cabinets and PC Visual inspection.......................................................................................343
8.7.3 Visual inspection of the differential pressure switches..................................................................344
8.7.4 Checking the pneumatic system (in general)..................................................................................345
8.7.5 Checking the nitrogen system (in general) .....................................................................................346
8.7.6 Selective soldering module: Visual inspection................................................................................347
8.7.7 Visual inspection of the axis system (electrics) ..............................................................................348
8.7.8 Visual inspection of the axis system (sensors)................................................................................350
8.7.9 Check the entire conveyor system .................................................................................................351
8.8 Maintenance work to be performed quarterly.............................................................................................352
8.8.1 Lubrication of the conveyor system, visual inspection of the round belts.....................................352
8.8.2 Backing up all data on the machine................................................................................................353
8.8.3 Spray fluxer: Visual inspection of the flux material filter ...............................................................354
8.8.4 Lubricating the Z-axis of the selective soldering module ...............................................................355
8.8.5 Lubricating the DIP soldering unit Z-axis ........................................................................................357
8.9 Service work to be performed semi-annually...............................................................................................359
8.9.1 Whole machine (calibration) ..........................................................................................................359
8.9.2 The whole machine (electrics)........................................................................................................359
8.9.3 Visual inspection, lubrication of the width adjustment..................................................................360
8.9.4 Solder sample .................................................................................................................................361
8.10 Service work to be performed annually........................................................................................................ 362
8.10.1 The whole machine (mechanics) ....................................................................................................362
8.10.2 Total electrical equipment in the switchgear cabinet ....................................................................363
8.10.3 Disassembling and cleaning the flux material storage tank. ..........................................................364
8.10.4 Turret bar container (option) Visual inspection, cleaning ..............................................................370
8.11 Service work to be performed when required.............................................................................................. 372
8.11.1 Supplementing flux material storage .............................................................................................372
8.11.2 Clean the spray head .....................................................................................................................377
8.11.3 Z-axis lubrication after 400 hours of operation..............................................................................377
8.11.4 Preparing solder nozzles.................................................................................................................378
8.11.5 Cleaning the gassing cap.................................................................................................................380
8.11.6 Gassing ring replacement ...............................................................................................................383
8.11.7 DIP soldering module (multiwave) with induction pump: Clean the solder pot ............................386
8.11.8 DIP soldering module (multiwave) with induction pump: Pump riser tube cleaning.....................400
8.11.9 DIP soldering module (multiwave) with induction pump: Solder pot replacement (optional) ......419
8.11.9.1 Preparation for solder pot replacement.......................................................................421
8.11.9.2 Mounting the traction aid on the machine ..................................................................422
8.11.9.3 Operating the lifting cart with the replacement rack...................................................423
8.11.9.4 Connecting the cold solder pot to the (optional) heating station and preheating it....425
8.11.9.5 Removing the cooled DIP solder pot from the machine...............................................427
8.11.9.6 Inserting the (optionally pre-heated) DIP solder pot into the machine .......................432
8.11.9.7 Changing the solder of the automatic solder supply (optional) ...................................437
Ersa GmbH Operating Instructions_VF335_en|Rev. 14|30/11/2017 ix/695
Table of contents
8.11.9.8 Completing the DIP solder pot replacement process...................................................438
8.11.10 Board fixation: Clean and lubricate slide surfaces..........................................................................439
9 Spare and wear parts......................................................................................................................................443
9.1 Read this first!............................................................................................................................................... 446
9.1.1 Nameplate and machine number...................................................................................................446
9.1.2 Target readers, permitted spare parts ...........................................................................................447
9.2 Machine frames ............................................................................................................................................ 448
9.2.1 Base module 150 ............................................................................................................................448
9.2.2 Base module 75 ..............................................................................................................................451
9.2.3 Additional module 150 ...................................................................................................................453
9.2.4 Additional module 75 .....................................................................................................................455
9.2.5 Additional module 1100 DIP...........................................................................................................457
9.2.6 Additional module 1300 DIP XL ......................................................................................................459
9.3 Spray fluxer and options ...............................................................................................................................461
9.3.1 Complete spray fluxer.....................................................................................................................461
9.3.2 Fixed spray head holder (single track)............................................................................................464
9.3.3 Fixed spray head support (dual track) ............................................................................................465
9.3.4 Accommodating the adjustable spray head ...................................................................................466
9.3.5 Spray monitoring (optional) ...........................................................................................................467
9.3.6 Flux material stockage....................................................................................................................468
9.3.7 Spray fluxer fiducial recognition.....................................................................................................469
9.3.8 Area-Spray head (Option)...............................................................................................................471
9.4 Positioning systems....................................................................................................................................... 472
9.4.1 Single pot positioning system (single track) ...................................................................................472
9.4.2 Z-axis single pot ..............................................................................................................................477
9.4.3 Double pot positioning system (dual track)....................................................................................478
9.4.4 Z-axis double pot (dual track) .........................................................................................................483
9.4.5 Z-axis excenter solder pot (fix, single track) ...................................................................................485
9.4.6 Positioning system for double solder pots with eccentric solder pot lids (80mm, fixed, double
stroke, single track) ........................................................................................................................486
9.4.7 Z-axis excenter solder pot (double stroke, single track).................................................................490
9.4.8 Positioning system for double solder pots with eccentric solder pot lids, y-variable ....................492
9.4.9 Z-axis excenter solder pot, y-variable.............................................................................................496
9.5 Transport system .......................................................................................................................................... 499
9.5.1 Fluxer unit conveyor system...........................................................................................................499
9.5.1.1 Fixed rail 1, (single track)..............................................................................................499
9.5.1.2 Flexible rail 1, (single track) ..........................................................................................502
9.5.1.3 Fixed rail 2, (dual track) ................................................................................................508
9.5.1.4 Flexible rail 2, (dual track) ............................................................................................511
9.5.2 Conveyor system preheater module ..............................................................................................514
9.5.2.1 Fixed rail 1, (single track)..............................................................................................514
9.5.2.2 Flexible rail 1, (single track) ..........................................................................................519
9.5.2.3 Fixed rail 2, (dual track) ................................................................................................523
9.5.2.4 Flexible rail 2, (dual track) ............................................................................................526
9.5.2.5 First stopper left, temperature resistant......................................................................528
9.5.2.6 First stopper right, temperature resistant....................................................................529
9.5.2.7 Second stopper left, (segmented preheating)..............................................................530
9.5.2.8 Second stopper right, (segmented preheating)............................................................532
9.5.3 Selective soldering unit conveyor system.......................................................................................534
9.5.3.1 Fixed rail 1, (single track)..............................................................................................534
9.5.3.2 Fixed rail 2, (dual track) ................................................................................................542
9.5.3.3 Flexible rail 1, (single track) ..........................................................................................549
Ersa GmbH Operating Instructions_VF335_en|Rev. 14|30/11/2017 x/695
Table of contents
9.5.3.4 Flexible rail 2, (dual track) ............................................................................................558
9.5.3.5 Roller conveyor extension, right...................................................................................565
9.5.4 DIP soldering unit conveyor system ...............................................................................................566
9.5.4.1 Fixed rail, DIP pump wheel ...........................................................................................566
9.5.4.2 Flexible rail, DIP pump wheel .......................................................................................568
9.5.4.3 Fixed rail 1, DIP induction (single track) .......................................................................570
9.5.4.4 Flexible rail 1, DIP induction (single track)....................................................................575
9.5.4.5 Fixed rail, DIP XL induction, (single track).....................................................................581
9.5.4.6 Flexible rail, DIP XL induction, (single track).................................................................586
9.6 Drives ............................................................................................................................................................592
9.6.1 Width adjustment drive..................................................................................................................592
9.6.2 Pin chain (single track)....................................................................................................................593
9.6.3 Fluxer conveyor pin chain drive (dual track)...................................................................................594
9.6.4 Preheating conveyor pin chain drive (dual track)...........................................................................596
9.7 Preheaters..................................................................................................................................................... 597
9.7.1 Dynamic IR emitters with glass plate 8 x 1.5 kW ............................................................................597
9.7.2 Upper heating installation kit --> 04.2010......................................................................................598
9.7.3 Top heating installation set 08/2010 -->.........................................................................................600
9.7.4 Compressed air heating..................................................................................................................601
9.8 Selective soldering modules and options...................................................................................................... 603
9.8.1 Solder pot cover, centric.................................................................................................................603
9.8.2 Solder pot lid, centric (dual track) ..................................................................................................606
9.8.3 Solder pot cover, eccentric, with roller conveyor...........................................................................609
9.8.4 Pump pipe (dual track) ...................................................................................................................611
9.8.5 Solder pot, asymmetrical (single track) ..........................................................................................612
9.8.6 Solder pot, symmetrical, dual track................................................................................................614
9.8.7 Deposit tray ....................................................................................................................................616
9.8.8 Storage tray (dual track) .................................................................................................................617
9.8.9 Gassing cap without heating insert ................................................................................................618
9.8.10 Gassing cap with heating insert......................................................................................................619
9.8.11 Wave height measurement ............................................................................................................620
9.8.12 Wave height measurement, dual ...................................................................................................621
9.8.13 Solder level monitoring ..................................................................................................................622
9.8.14 Selective soldering unit feeding......................................................................................................623
9.8.15 Process observation (dual track) --> 09.2011 .................................................................................624
9.8.16 Process observation (dual track) 10.2011 --> .................................................................................625
9.8.17 Process observation (single track)Single pot / Eccentric nozzle, fixed ...........................................626
9.8.18 Process observation (single track) Eccentric nozzle, double travel ................................................627
9.8.19 Process observation (single track) Eccentric nozzle, y-variable......................................................628
9.8.20 Fiducial recognition and deflection measurement.........................................................................629
9.9 DIP_soldering units and options ...................................................................................................................631
9.9.1 DIP soldering module (multiwave) with paddle wheel pump ........................................................631
9.9.1.1 Gassing hood ................................................................................................................631
9.9.1.2 Roll out unit ..................................................................................................................633
9.9.1.3 DIP solder pot ...............................................................................................................635
9.9.1.4 DIP soldering unit pressure plate .................................................................................637
9.9.1.5 DIP solder pot nozzle plate ...........................................................................................638
9.9.1.6 DIP soldering unit lifting system ...................................................................................639
9.9.1.7 DIP soldering unit pump ...............................................................................................641
9.9.2 DIP_soldering module (multiwave) standard with induction pump...............................................642
9.9.2.1 DIP soldering module (multiwave) standard extension unit and Z axis........................642
9.9.2.2 DIP soldering module (multiwave) standard pressure chamber and solder pot..........646
Ersa GmbH Operating Instructions_VF335_en|Rev. 14|30/11/2017 xi/695