Operating Instructions_VF335_en.pdf - 第29页
2|Technical data 2.2.4 Point and path soldering module Description Module type Point and path soldering module Heating output (kW) 1.15 Solder content approx. (Kg) 13 Heat-up time to 280°C (h) 1.25 Maximum solder tempe…
2|Technical data
2.2.2 Bottom pre-heater, dynamic emitter cartridge with glass plate
Description
Type of heating Dynamic emitter cartridge
Rated power (kW) at 400V 12 ( = 8 x 1.5)
Dimensions of the emitter cartridge L x
W (mm)
500 x 765
Maximum PCB size L x W (mm) 508 x 508
* Depending on the development stage, several preheaters can be installed.
2.2.3 Top pre-heating, compressed air heater (option)
Description
Type of heating Medium wave emitters, convection
Rated power (kW) at 230V 4 ( = 2 x 2.0)
Dimensions of the radiator cassette L x
W (mm)
665 x 400
Pneumatics stand-by pressure (MPa) 0.03
Pneumatics working pressure (MPa) 0.3
Ersa GmbH Operating Instructions_VF335_en|Rev. 14|30/11/2017 28/695
2|Technical data
2.2.4 Point and path soldering module
Description
Module type Point and path soldering module
Heating output (kW) 1.15
Solder content approx. (Kg) 13
Heat-up time to 280°C (h) 1.25
Maximum solder temperature (°C) 330
Minimum inside diameter of the solder
nozzle (mm)
3
Smallest outer diameter of the solder
nozzle (mm)
6
Maximum solder wave height (mm) 5
Minimum side clearance (mm) 3
Soldering speed X/Y axis (mm/sec) 10
X/Y axis positioning speed (mm/sec) 0.5…200
Positioning speed Z axis (mm/sec) 0.5…100
Positioning accuracy (mm) ± 0.15
Handling system 3-axis system with servo drives
Depending on the development stage, several soldering modules can be installed.
2.2.5 Solder feeding: Point and path soldering module
Description
Type of solder lead Solder wire
Maximum wire diameter (mm) 2
Maximum coil diameter (mm) 125
Maximum coil height (mm) 125
Maximum roller weight (Kg) 4
2.2.6 DIP soldering unit with impeller pump
Designation
Unit type DIP soldering unit with impeller pump,
motor-driven
Heating power (kW) 10.2
Solder content approx. (kg)
Heat up time to 280°C (min)
Maximum solder temperature (°C) 300
Maximum solder wave height (mm)
Minimum edge clearance (mm)
Maximum board length (mm)
Maximum board width (mm)
Z-axis positioning speed (mm/sec)
Positioning accuracy (mm) ± 0.25
Handling system Motorized with tooth belt drive
Ersa GmbH Operating Instructions_VF335_en|Rev. 14|30/11/2017 29/695
2|Technical data
2.2.7 DIP soldering module (standard ) with induction pump
Description
Module type DIP soldering module with induction
pump
Heating output (kW) 6.05
Solder content approx. (kg) 230
Heat-up time to 280°C (min) 210
Maximum solder temperature (°C) 300
Maximum PCB height (mm) 450
Maximum PCB width (mm) 350
Positioning speed Z axis (mm/sec) 20
Positioning accuracy ± 0.25
Handling system Motor-driven by threaded spindle
2.2.8 DIP soldering module XL with induction pump
Description
Module type DIP soldering module with induction
pump
Heating output (kW) 6.05
Solder content approx. (kg) 300
Heat-up time to 280°C (min) 240
Maximum solder temperature (°C) 300
Maximum PCB height (mm) 500
Maximum PCB width (mm) 360
Positioning speed Z axis (mm/sec) 20
Positioning accuracy ± 0.25
Handling system Motor-driven by threaded spindle
2.2.9 Solder supply: DIP soldering unit
Designation
Solder bar dimensions (mm) 255 x 55 x 40
Maximum weight (kg) 8.7
2.2.10 Single-track conveyor system
Designation
Type Frameless conveyor system
Transport system Segmented single conveyors
Conveyor speed (m/min) 0.2…10
Standard conveyor width (mm) 60…406
Type of conveyor width adjustment Motorized, front fixed rail conveyor
Conveyor angle (°), not adjustable 0
Board length (mm) 120…508
Board width (mm) 63.5…406
Max. board weight (kg) 8
Ersa GmbH Operating Instructions_VF335_en|Rev. 14|30/11/2017 30/695