Operating Instructions_VF335_en.pdf - 第395页
8|Service and maintenance Cleaning the solder level monitoring 2 5 1 3 4 5 Fig.145: Cleaning the solder level monitoring ü To clean the solder level monitoring: ü Note: The parts coming into contact with solder are ea…
8|Service and maintenance
a) Loosen the three hexagonal screws (1) of the lid (2) just enough to easily rotate
the lid.
b) Turn the lid (2) clockwise and remove it.
c) Clean the probe (3) with a stainless steel brush. In doing so, do not loosen the
screw connection of the probe!
d) Clean both filter made of sintered metal (12) with a stainless steel brush.
ð In case of damage or very heavy soiling:
e) Have both filters replaced by specialist staff. In this case, have also connection
screws (13) disassembled, and clean the bores in the connection screws (11).
f) Carefully remove the lid after assembly in the maintenance tray.
ð The process has now been completed.
ü To clean the nozzle components:
a) Remove the cup (4) and clean the inside and outside.
b) Clean the sight glass (5) inside and outside.
c) Clean the nozzle (7) inside and outside.
d) Remove dross from the solder surface in the nozzle area using a solder scraper.
e) Visual inspection of the seals (6).
ð If the seals (6) are damaged:
f) Replace both seals. Carefully determine the correct installation position of the
seals!
g) Re-install the cup (4).
ð The process has now been completed.
ü To reassemble the wave height measurement:
a) Put the lid (2) on, turn anti clockwise and tighten the hexagonal screws (1)
again.
b) Visually inspect the hoses (8), the connection (9) and the line (10).
ð Firm fit must be guaranteed.
c) Visual inspection of the probe screwing.
ð If the screwing has come loose:
d) Have the probe readjusted by qualified staff.
ð Note: After assembly, have the nitrogen atmosphere in the measuring
chamber checked by qualified staff. This test must be carried out with on-
going solder wave and active nitrogen gassing.
ð The process has now been completed.
Ersa GmbH Operating Instructions_VF335_en|Rev. 14|30/11/2017 394/695
8|Service and maintenance
Cleaning the solder level monitoring
2
5
1
3
4 5
Fig.145: Cleaning the solder level monitoring
ü To clean the solder level monitoring:
ü Note: The parts coming into contact with solder are easier to clean while they
are still hot!
a) Perform a visual inspection of the thermocouple (1).
ð The connection line must not be porous or hardened.
b) Have the damaged thermocouple replaced by specialist staff.
c) Performing a visual inspection of the hose (3). Tightness and firm fit must be
guaranteed. Have qualified staff replace any heavily discoloured, porous or
hardened hose.
d) Loosen the nut (4).
e) Note: Do not loosen the knurled screw (2)!
f) Turn the probe unit (5) clockwise, pull it out upwards, and clean inside and out-
side.
ð In the rising pipe of the probe unit there is a bore.
g) Clean the bore - it must be clean and free of dirt.
h) Reinstall the solder level monitoring.
ð The process has now been completed.
Ersa GmbH Operating Instructions_VF335_en|Rev. 14|30/11/2017 395/695
8|Service and maintenance
Cleaning the solder surface
4
5 5
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1
2
Fig.146: Cleaning the solder surface
ü To clean the solder surface:
a) Remove dross from the entire solder surface (1) using a solder scraper (2) or a
silicone scraper.
b) Collect the dross in a corner of the solder pot.
ð Note: Work carefully exerting little pressure so as not to damage the
coated surfaces!
c) Carefully clean the area around the encoding pins (5).
d) Carefully clean the contact points of the encoding pins and pressure chamber.
ð Note: This cleaning process is particularly important. The area around the
contact points must be free of oxides and dross. After installing the nozzle
plate, adhering dirt can lead to leaks!
e) Remove the dross (7) with a perforated ladle (6).
f) If necessary, refill some solder so as to obtain the original solder level again.
ð The process has now been completed.
Ersa GmbH Operating Instructions_VF335_en|Rev. 14|30/11/2017 396/695