DECAN_F2_Service(Eng_Ver1).pdf - 第38页

1-2 Fast & Flexible Chip Shoo ter DECAN F2 Service Manual Non operation Ambient temperature -10 ℃ ~ 60 ℃ Humidity RH 20% ~ RH 90% Vib ration Resistance Characteristics Machine status to b e maintaine d during transpo…

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1-1
Specifications
Chapter1. Specifications
1.1. Specification
1.1.1. Basic Specification
ITEM
Specifications
External size Width(W)
1430mm
Depth(D)
1740mm
Height(H) 1995mm(Including tower lamp)
Environmental Conditions Ambient
temperature
10 ~ 35
Recommendati
on ambient
temperature
24 ±4
Humidity
RH 50% RH 90%
EMI / EMC Based on CE
Place Flat and no vibration during machine operation
Other No harmful gas dust
1-2
Fast & Flexible Chip Shooter DECAN F2 Service Manual
Non operation Ambient
temperature
-10 ~ 60
Humidity
RH 20% RH 90%
Vibration
Resistance
Characteristics
Machine status to be maintained during transportation
Other No harmful gas dust
Air supply Air
consumption
50 NL/min
Air Generator
350 NL/min
Power Supply Voltage 3phase AC
3phase AC 200±10% / 208±10% / 220±10% / 240±10% / 380±10% / 415±10%
Frequency 50/60Hz
Power
consumption
5.0kVA(Max)
Weight Standard
equipment
1850 ~ 1910kg
Docking
Option
1820 ~ 1880kg
ITEM
Specifications
1-3
Specifications
1.1.2. Detail Specification
1.1.2.1. General
ITEM
Specifications
Tack time Under optimum condition 79,000 cph, chip1608
(0.046 seconds/component)
Miss pick ratio
Less than 1000 ppm, Chip1005
Less than 2000 ppm, Chip0603
Less than 4000 ppm, Chip0402
Flying vision MEGA FOV 24mm Chip : 0402~16mm
IC, Connector : 16 mm and smaller, Lead pitch of more than 0.4 mm
BGA, CSP : 16 mm and smaller, Ball pitch of more than 0.5 mm
Maximum height 12mm
Placement Accuracy Chip 0402 : X,Y : ±0.05 mm, θ : ±5.00 °, Cpk1.0
Chip 0603 : X,Y : ±0.08 mm, θ : ±5.00 °, Cpk1.0
Chip 1005 : X,Y : ±0.10 mm, θ : ±5.00 °, Cpk1.0
Lead IC 0.4 P : X,Y : ±0.05 mm, θ : ±0.20 °, Cpk1.0
CSP Ball 0.4 Pitch : X,Y : ±0.05 mm, θ : ±0.30 °, Cpk1.0