DECAN_F2_Service(Eng_Ver1).pdf - 第44页
1-8 Fast & Flexible Chip Shoo ter DECAN F2 Service Manual 1.1.2.7. Head T ype Shuttle Left & Right Full Dual Single ITEM Sp ecifications ITEM Sp ecifications Number of spindles 10 spindles * 2 Gantry Head pitch 1…
1-7
Specifications
1.1.2.6. PCB Transport System
ITEM
Specifications
Type Dual, 3 staged independent transfer method, flat belt transfer
PCB Fixer Based on external shape: Side edge fixer
Transport speed 0 ~ 0.5 m/sec. variable, static charge prevention belt
Shuttle Move Speed : 0.25 m/sec
Applicability to upper and lower sides of part Upper : 12 mm, Lower 25 mm
Upper : 12 mm, Lower 30 mm
Buffer function Front buffer : 1 Board range
Rear buffer : 1 Board range
Transport direction Left to Right
Right to Left
Transport height 900 ± 20 mm
952.5 ± 12.5 mm
Adjusting Width Automatic, PB Step Motor
Back up pin Movable type
1-8
Fast & Flexible Chip Shooter DECAN F2 Service Manual
1.1.2.7. Head
Type Shuttle Left & Right
Full Dual
Single
ITEM
Specifications
ITEM
Specifications
Number of spindles 10 spindles * 2 Gantry
Head pitch 15 mm
Component centering method Flying vision
Upward vision
Z axis Mechanism : AC Servo motor + Belt & LM guide
Travel range : Max. 88mm
Resolution : 0.003mm/pulse
Repeatability : ±0.01mm
1-9
Specifications
θ axis Mechanism : Micro Step motor + Belt & Pulley
Travel range : Unlimited
Resolution : 0.018˚/pulse
Repeatability : ±0.05˚
Swing mirror Mechanism : AC servo motor + Belt & Cam
Resolution : 0.018˚/pulse
Repeatability : ±0.02˚
Nozzle holder Clamping method : Taper clamp + Ball
No. of clamping ball : 3 EA
Cushion : Cushion None
ITEM
Specifications