DECAN_F2_Service(Eng_Ver1).pdf - 第42页
1-6 Fast & Flexible Chip Shoo ter DECAN F2 Service Manual 1.1.2.5. PCB supported ITEM Sp ecifications Maximum board size Shuttle 2 PCB : L330 X W250 mm 1 PCB : L610 X W460 mm Full Dual 2 PCB : L610 X W250 mm 1 PCB : …
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Specifications
1.1.2.4. Vision Board
Illumination Light source LED
Light adjustment 16 Level
Light control Programmable, 3 Type (Outer light, Side light, Coaxial light)
ITEM
Specifications
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Specifications
Board Fly camera Analog camera grabber : 1360 x 1040
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Fast & Flexible Chip Shooter DECAN F2 Service Manual
1.1.2.5. PCB supported
ITEM
Specifications
Maximum board size Shuttle 2 PCB : L330 X W250 mm
1 PCB : L610 X W460 mm
Full Dual
2 PCB : L610 X W250 mm
1 PCB : L610 X W460 mm
Shuttle Full Dual 2 PCB : L610 X W250 mm
1 PCB : L610 X W460 mm
Single
1 PCB : L740 X W460 mm
Minimum board size L50 X W40 mm
Board thickness 0.38 ~ 4.2 mm
Maximum board weight 2 kg
Board warp limit Upper : 0.5 mm, Lower : 1.5 mm
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Specifications
1.1.2.6. PCB Transport System
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Specifications
Type Dual, 3 staged independent transfer method, flat belt transfer
PCB Fixer Based on external shape: Side edge fixer
Transport speed 0 ~ 0.5 m/sec. variable, static charge prevention belt
Shuttle Move Speed : 0.25 m/sec
Applicability to upper and lower sides of part Upper : 12 mm, Lower 25 mm
Upper : 12 mm, Lower 30 mm
Buffer function Front buffer : 1 Board range
Rear buffer : 1 Board range
Transport direction Left to Right
Right to Left
Transport height 900 ± 20 mm
952.5 ± 12.5 mm
Adjusting Width Automatic, PB Step Motor
Back up pin Movable type