DECAN_F2_Service(Eng_Ver1).pdf - 第43页

1-7 Specifications 1.1.2.6. PCB Transport System ITEM Sp ecifications T ype Dual, 3 staged independent transfer method, flat belt transfer PCB Fixer Based on external shape: Side edge fixer T ransport speed 0 ~ 0.5 m/sec…

100%1 / 604
1-6
Fast & Flexible Chip Shooter DECAN F2 Service Manual
1.1.2.5. PCB supported
ITEM
Specifications
Maximum board size Shuttle 2 PCB : L330 X W250 mm
1 PCB : L610 X W460 mm
Full Dual
2 PCB : L610 X W250 mm
1 PCB : L610 X W460 mm
Shuttle Full Dual 2 PCB : L610 X W250 mm
1 PCB : L610 X W460 mm
Single
1 PCB : L740 X W460 mm
Minimum board size L50 X W40 mm
Board thickness 0.38 ~ 4.2 mm
Maximum board weight 2 kg
Board warp limit Upper : 0.5 mm, Lower : 1.5 mm
1-7
Specifications
1.1.2.6. PCB Transport System
ITEM
Specifications
Type Dual, 3 staged independent transfer method, flat belt transfer
PCB Fixer Based on external shape: Side edge fixer
Transport speed 0 ~ 0.5 m/sec. variable, static charge prevention belt
Shuttle Move Speed : 0.25 m/sec
Applicability to upper and lower sides of part Upper : 12 mm, Lower 25 mm
Upper : 12 mm, Lower 30 mm
Buffer function Front buffer : 1 Board range
Rear buffer : 1 Board range
Transport direction Left to Right
Right to Left
Transport height 900 ± 20 mm
952.5 ± 12.5 mm
Adjusting Width Automatic, PB Step Motor
Back up pin Movable type
1-8
Fast & Flexible Chip Shooter DECAN F2 Service Manual
1.1.2.7. Head
Type Shuttle Left & Right
Full Dual
Single
ITEM
Specifications
ITEM
Specifications
Number of spindles 10 spindles * 2 Gantry
Head pitch 15 mm
Component centering method Flying vision
Upward vision
Z axis Mechanism : AC Servo motor + Belt & LM guide
Travel range : Max. 88mm
Resolution : 0.003mm/pulse
Repeatability : ±0.01mm