00195982-03_SM_SWS_EN.pdf - 第10页
10 Service Manual SIPLACE Wafer System (SWS) 11/2018 18 Appendix .. 477 18.1 Specification: emergency STOP .. 477 18.1.1 Switching elements .. 477 18.1.2 External connection to SIPLACE .. 477 18.1.3 Input/output …
9Service Manual SIPLACE Wafer System (SWS) 11/2018
15.4 Calibration of the complete wafer handling.. 389
15.4.1 Calibrating the wafer lift.. 390
15.4.1.1 Calibrating the magazine lift limit positions.. 390
15.4.1.2 Calibrating the magazine slot scan position.. 391
15.4.1.3 Calibrating the wafer transfer position of the magazine with respect to the wafer table.. 394
15.4.1.4 Calibrating the wafer lift position – magazine change position.. 397
15.4.2 Wafer table calibration menu.. 398
15.4.2.1 Wafer table calibration.. 398
15.4.2.2 Wafer table positions.. 399
15.4.3 Calibration wafer changer menu.. 405
15.5 SWS data backup and restore.. 408
15.5.1 Machine data.. 408
15.5.2 Product data.. 409
16 Software.. 411
16.1 General information.. 411
16.1.1 Brief description.. 411
16.1.2 Scope of delivery.. 411
16.1.2.1 SWS software package.. 411
16.1.2.2 SWS operating system package.. 411
16.2 Installation of operating system.. 412
16.2.1 Backup of installed software.. 412
16.2.1.1 Backup of calibration and product data via GUI.. 412
16.2.1.2 Backup of Halcon license.. 416
16.2.1.3 Backup of Halcon license via Linux console... 416
16.2.1.4 Restoring the Halcon license via the GUI.. 419
16.2.1.5 Backup of installed SWS software via Linux console.. 421
16.2.1.6 Backup via bug report.. 424
16.2.1.7 Creating a recovery DVD for restoring the system.. 427
16.2.1.8 Restoring the system with the recovery DVD.. 432
16.2.1.9 Adding network addresses.. 433
16.2.2 Installation of operating system.. 436
16.2.2.1 Completing backup of the installed version first.. 437
16.2.2.2 Installing the GUI.. 438
16.2.3 Restoring the data.. 442
16.2.3.1 Restoring the Halcon license.. 442
16.2.3.2 Selecting the SWS location.. 444
16.2.3.3 Restoring the network addresses.. 447
16.2.3.4 Restoring the process data via the GUI.. 458
16.2.3.5 Restoring the calibration data via the GUI.. 460
16.2.3.6 Restoring the backup via the Linux console.. 462
16.2.3.7 Restoring the data from a bug report.. 465
16.2.4 Calibrating the touchscreen.. 465
16.3 Installing a new software version (GUI).. 466
16.4 Restoring an old software version (GUI).. 466
17 Tips and tricks.. 471
17.1 Moving the Z axis for die ejector downwards in the switched off and removed
SWS..
471
17.2 Wafer changer calibration problems.. 474
17.3 Wafers are recognized in the wrong slot of the magazine.. 476
10 Service Manual SIPLACE Wafer System (SWS) 11/2018
18 Appendix.. 477
18.1 Specification: emergency STOP.. 477
18.1.1 Switching elements.. 477
18.1.2 External connection to SIPLACE.. 477
18.1.3 Input/output checklist.. 477
18.1.4 Function description.. 478
18.1.4.1 Emergency STOP.. 478
18.1.5 Emergency STOP extension on the SIPLACE.. 480
18.2 Specification: power supply.. 480
18.2.1 Supply and switching elements.. 480
18.2.2 General structure of power supply.. 481
18.2.3 Transformer T1 with rectification and connections.. 481
18.3 Specification: motor control.. 482
18.3.1 Motor control concept.. 482
18.3.1.1 Motor control placement variants.. 482
18.3.2 Motor controller DMC-18x6.. 483
18.3.3 Servo amplifier AMP-19540(20).. 483
18.3.4 Signal tracking motor 1-10.. 484
18.3.5 Motor/encoder specifications:.. 484
18.3.5.1 Motor-1(A) = wafer table X.. 484
18.3.5.2 Motor-2(B) = wafer table Y.. 485
18.3.5.3 Motor-3(C) = die ejector tool changer.. 485
18.3.5.4 Motor-4(D) = die ejector needle.. 485
18.3.5.5 Motor-5(E) = flip-rotate.. 486
18.3.5.6 Motor-6(F) = flip Z (pickup) motor-8(H) = flip X (handover).. 486
18.3.5.7 Motor-7(G) = rotate die attach.. 486
18.3.5.8 Motor-9(A) = wafer magazine lift.. 487
18.3.5.9 Motor-10(B) = wafer handler.. 487
18.3.6 Limit/home sensors with initialization.. 487
18.3.6.1 Initialization sequence for wafer table - X/Y MOT1(A) MOT2(B).. 487
18.3.6.2 Initialization sequence die ejector needle MOT4(D).. 488
18.3.6.3 Initialization run for flip rotor MOT5 (E).. 488
18.3.6.4 Initialization run for flip Z (pickup) MOT6 (F).. 488
18.3.6.5 Initialization run for flip X (handover) MOT8 (H).. 489
18.3.6.6 Initialization sequence for die attach unit MOT7(G).. 489
18.3.6.7 Initialization run for wafer magazine lift MOT9 (A).. 489
18.3.6.8 Initialization run for wafer handler MOT10 (B).. 489
18.4 Control system IN/OUT.. 490
18.4.1 Control boards input/output.. 490
18.4.2 Structure of DMC-18x6 I/O system.. 491
18.4.2.1 Signal tracking DMC-18x6.. 492
18.4.3 Control board USB-IO Rev.1(2) (150 x 65mm), installation location: flip unit.. 494
18.4.4 USB-IO general description.. 495
18.4.5 Select list DMC-IN/OUT.. 495
18.4.6 Select list USB-IO.. 497
18.5 Touch-down sensor rev. 1.. 498
18.5.1 Function description.. 498
18.5.2 Electrical connections.. 498
18.5.3 Function.. 499
18.5.3.1 Height measurement of nozzle 1 or 2 in Z lift... 499
18.5.3.2 Distance measurement - nozzle 1 in X lift:.. 499
18.5.3.3 Height measurement needle - die ejector:.. 500
18.5.4 Function procedure - USB-IO program.. 500
18.5.5 Test program motor control.. 501
