00195982-03_SM_SWS_EN.pdf - 第20页
1 Introduction 1.5 Abbreviations 20 Service Manual SIPLACE Wafer System (SWS) 11/2018
1 Introduction
1.4 Staff qualifications and training
Service Manual SIPLACE Wafer System (SWS) 11/2018 19
1.4 Staff qualifications and training
Qualified or adequately trained personnel means that these people are familiar with the setting up,
operation and maintenance of the machine and the add-on devices and are suitably qualified, e.g.:
●
Have been trained, instructed or authorized to switch on and off, isolate, earth and identify
electrical circuits and system components in accordance with normal safety standards.
●
Have been trained or instructed in the upkeep and use of appropriate safety equipment in
accordance with normal safety standards.
●
Have received first aid training.
1.5 Abbreviations
Abbreviation Description
CO Component
COT Changeover table
COT-i Changeover table insert
C&P Collect&Place
CPP Collect&Pick&Place head
ESD Electrostatic sensitive device
EMC Electromagnetic compatibility
P&P Pick&Place
SC Station computer
SWS SIPLACE wafer system
TH TwinHead
1 Introduction
1.5 Abbreviations
20 Service Manual SIPLACE Wafer System (SWS) 11/2018
2 Overview of the SIPLACE wafer system (SWS)
2.1 Technical data
Service Manual SIPLACE Wafer System (SWS) 11/2018 21
2 Overview of the SIPLACE wafer system (SWS)
Fig.2: SIPLACE wafer system (SWS) - overview
1 Main switch 2 EMERGENCY OFF button
3 Indicator lamp 4 Monitor
5 Keyboard 6 Wafer change system
7 Basic design 8 Supply unit
2.1 Technical data
SIPLACE wafer system
Placement process Flip chip, die attach
Die size 0.8 mm x 0.8mm up to 12 x 12 mm (larger dies on request)
Die thickness 0.05 mm to 4mm
Wafer size Up to 12"
Frame size Up to 15"
Wafer cassette Max. 25 slots