00195982-03_SM_SWS_EN.pdf - 第37页
2 Overview of the SIPLACE wafer system (SWS) 2.4 Description of SWS assemblies Service Manual SIPLACE Wafer System (SWS) 11/2018 37 2.4.1.6 Wafer changer system The wafer changer system consists of the magazine lift and …
2 Overview of the SIPLACE wafer system (SWS)
2.4 Description of SWS assemblies
36 Service Manual SIPLACE Wafer System (SWS) 11/2018
The ejector tool is fitted to the basic unit and consists of the interface, the needle system and a
vacuum cap.
The ejector tool is fitted to the die ejector unit!
The old ejector tool with bayonet lock is no longer used as it was prone to faults. It has been re-
placed by an ejector tool with magnetic lock, which is used in the current versions of the SWS and
which can also be retrofitted in older versions of the SWS.
The wafer foil is picked up by vacuum suction at the vacuum cap, the needle system moves up and
releases the die from the wafer foil. The die can now be taken up by the nozzle of the flip unit.
The ejector tool needs to be adjusted to the size of the die and can therefore be exchanged as re-
quired. It is fixed to the basic unit with a bayonet lock.
The ejector tool can be equipped with 2 different needle types:
●
Non-piercing needles
These cause the wafer foil to curve upwards and so release the die. The wafer foil is not
pierced in this case, so that the components are not touched by the needles.
●
Piercing needles
These pierce the foil and lift the die directly off the foil.
NOTICE
No automatic ejector tool changeover
In this first version there is no automatic ejection tool changer available.
The SWS can therefore only continuously process dies which can be released using the
same ejector tool.
2 Overview of the SIPLACE wafer system (SWS)
2.4 Description of SWS assemblies
Service Manual SIPLACE Wafer System (SWS) 11/2018 37
2.4.1.6 Wafer changer system
The wafer changer system consists of the magazine lift and the wafer changer with gripper. The
wafer changer system is needed to ensure fully automatic production with the SWS. The operator
is only needed for refilling the magazine lift with new wafer magazines.
The wafers are provided in a wafer magazine. The wafer magazine is placed by the user into the
wafer magazine lift. The magazine lift lifts the wafer magazine to the appropriate height so that the
corresponding wafer is in handover position. In this position the wafer changer can take the wafer
out of the magazine and push it back in after the wafer has been processed.
The wafer changer consists primarily of the gripper unit and the guidance rails. The gripper unit
takes up the wafer and moves it to the position currently required.
Fig.18: Wafer changer system
1. Wafer changer with gripper
2. Magazine lift
2 Overview of the SIPLACE wafer system (SWS)
2.4 Description of SWS assemblies
38 Service Manual SIPLACE Wafer System (SWS) 11/2018
Magazine lift
Fig.19: Magazine lift
1. Magazine unit with adjustable changer plate for accommodating 8" and 12 " magazine cas-
settes
2. Motor
3. Wafer changer with cover