00195982-03_SM_SWS_EN.pdf - 第152页

7 Die ejector 7.4 Mechanical adjustment of the needle position in the X/Y position 152 Service Manual SIPLACE Wafer System (SWS) 11/2018 7.4.2 Adjusting the needle in the X/Y position Fig.191: ► Remove the four screws (…

7 Die ejector

7.4 Mechanical adjustment of the needle position in the X/Y position

Service Manual SIPLACE Wafer System (SWS) 11/2018 151

Fig.189:

► Move the die ejector unit upwards (9).

► Press the emergency STOP switch on the SWS.

The emergency STOP button releases all axes so that they can be moved manually.

The die ejector unit remains in the top position which it was moved to.

Fig.190:

► Move the wafer table in the direction of the wafer lift(2), in order to access all screws(1)

fastening the die ejector base plate.

7 Die ejector

7.4 Mechanical adjustment of the needle position in the X/Y position

152 Service Manual SIPLACE Wafer System (SWS) 11/2018

7.4.2 Adjusting the needle in the X/Y position

Fig.191:

► Remove the four screws (1 and 2) fastening the base plate and press the base plate in the

direction of the eccentric shaft.

Fig.192:

► Switch to the live image from the wafer camera (3 and 4).

7 Die ejector

7.4 Mechanical adjustment of the needle position in the X/Y position

Service Manual SIPLACE Wafer System (SWS) 11/2018 153

Fig.193:

NOTICE

► If the needle tip is not visible, switch to the menu Illumination and set the lighting so

that you can see the dot showing the needle tip/needle cone.

Fig.194:

► Turn the eccentric shaft (5), until the wafer camera live image shows the needle tip dot under

the red line. → Adjustment in X position