00195982-03_SM_SWS_EN.pdf - 第44页
2 Overview of the SIPLACE wafer system (SWS) 2.4 Description of SWS assemblies 44 Service Manual SIPLACE Wafer System (SWS) 11/2018 2.4.2.6 SIPLACE SWS wafer stretcher The SWS can be configured with the SIPLACE SWS wafer…
2 Overview of the SIPLACE wafer system (SWS)
2.4 Description of SWS assemblies
Service Manual SIPLACE Wafer System (SWS) 11/2018 43
2.4.2.4 Wafer map system
Wafer mapping is increasingly becoming a standard in the die placement processes. The wafer
map allocates a function class to each die on the wafer.
This function class could mean simply "good" or "bad". However, up to 255 classes can be defined
for a precise description of the die properties.
In the first step, the SWS identifies the wafer. Normally, the barcode on the wafer frame is read for
this. This wafer ID is then used to select the relevant map file on the wafer map server.
In the second step, the abstract die ID from the wafer map file (column/row) is set in relation to the
real position of the die on the wafer. This position can be calculated by identifying special reference
dies on the wafer and by determining the center of the wafer.
NOTICE
Position calculation
The calculation of positions with the help of the wafer edge position recognition function
only works for dies which are 3 mm or larger in size.
The wafer map function is primarily a software option. This includes a server system for the wafer
map files with a conversion of customized wafer map standard to the SWS standard.
2.4.2.5 Barcode scanner
The barcode scanner on the SWS reads the barcode attached to the wafer frame.
Fig.24: Barcode scanner - installation example in the wafer changer
1. Barcode scanner
2 Overview of the SIPLACE wafer system (SWS)
2.4 Description of SWS assemblies
44 Service Manual SIPLACE Wafer System (SWS) 11/2018
2.4.2.6 SIPLACE SWS wafer stretcher
The SWS can be configured with the SIPLACE SWS wafer stretcher option for two different wafer
supports (8" or 12").
The SIPLACE SWS wafer stretcher consists of the following main assemblies.
●
Stretcher
The stretcher stretches the wafer foil to increase the distances of the dies on it.
●
Heater
The heater consists of a heating element and a fan. The fan blows heated air on to the wafer
foil. This reduces the sag of the wafer foil (less than 9 mm), so that the wafer can be transpor-
ted back into the magazine.
Fig.25: Wafer support with SIPLACE SWS wafer stretcher
1. Stretcher frame with wafer support
2. Heater fan
2 Overview of the SIPLACE wafer system (SWS)
2.4 Description of SWS assemblies
Service Manual SIPLACE Wafer System (SWS) 11/2018 45
Safety instructions
Fig.26: Wafer support with SIPLACE SWS wafer stretcher
CAUTION
Risk of burns due to high temperatures!
The heating can reach temperatures of up to 60°C.
► Do not reach into the area around the fan with your hands.
► Be careful when touching the wafer support.
Technical data
SIPLACE SWS wafer stretcher Value
Wafer frame 8" or 12"
Wafer width for 8" wafer frame 10.5" and 10.8"
Weight of stretcher with wafer support 8" 14kg
Weight of stretcher with wafer support 12" 15kg
Wafer frame (metal and plastic) Up to 3.5 mm thick
Minimum operating pressure 4.0bar
Maximum operating pressure 5.5bar
Travel time for full stroke Approx. 2 seconds
Lowering time Approx. 2 seconds
Stretch factor (adjustable) *1) 2 mm, 4 mm, 6 mm, 8 mm
Clamping velocity for wafer centering 0.5 to 1.0 seconds
*1) The specified stretching heights relate to a wafer frame with a thickness of 1.5 mm. The fol-
lowing applies to other wafer frame thicknesses:
Stretching factor = set stretching height + frame thickness -1.5 mm
NOTICE
Definition
Extensive tests with various materials were conducted during the product development
phase.
However, due to the multitude of wafer foils available, the many die sizes and wafer frames,
we are unable to make a general function promise for all imaginable materials. New materi-
als should therefore be tested in advance, if there is any doubt.
Placement accuracy and performance values
See the specifications for the SIPLACE CA-Series, SC 708.0, edition 12/2014