00195982-03_SM_SWS_EN.pdf - 第8页

8 Service Manual SIPLACE Wafer System (SWS) 11/2018 12.8.2 Mechanically setting the sag sensor IN19 .. 323 12.8.2.1 Materials and equipment needed .. 323 12.8.2.2 Preparatory tasks .. 324 12.8.2.3 Adjusting (aligni…

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7Service Manual SIPLACE Wafer System (SWS) 11/2018
11 Extension groups.. 255
11.1 Wafer supports.. 255
11.1.1 Overview.. 255
11.1.2 Overview of spare parts.. 256
11.1.3 Replacing spare parts.. 257
11.1.3.1 Replacing the complete wafer support.. 257
11.1.3.2 Turning the wafer locking strip by 180 degrees (option for 8" wafer support).. 258
11.1.3.3 Setting the wafer support width.. 259
11.1.3.4 Replacing the driver on the clamp.. 259
11.1.3.5 Replacing the solenoid valve for the clamp.. 260
11.1.3.6 Replacing the clamp assemblies.. 261
11.1.3.7 Replacing the diffuse mode sensor.. 262
11.1.3.8 Calibrating the wafer support.. 262
11.1.3.9 Replacing the screw-in cylinder for the downholder.. 263
11.2 Linear dipping unit (LDU).. 264
12 Wafer stretcher.. 265
12.1 Explanation of the wafer stretcher.. 265
12.1.1 SIPLACE SWS wafer stretcher.. 265
12.1.2 Safety instructions.. 266
12.1.3 Technical data.. 266
12.1.4 Placement accuracy and performance values.. 267
12.1.5 Description.. 267
12.2 Detailed description of "wafer stretching" procedure.. 270
12.3 Preparatory measures for working on the wafer stretcher.. 278
12.4 Removing the wafer stretcher.. 279
12.4.1 Preparing removal of the wafer stretcher.. 279
12.4.2 Dismantling the cover plate and the downholder plates.. 279
12.4.3 Removal on the clamping and lifting cylinder side.. 284
12.4.4 Removal at the wafer changer side.. 288
12.5 Overview of wafer stretcher parts.. 293
12.6 Fitting the wafer stretcher.. 293
12.6.1 Preparations for fitting the wafer stretcher.. 293
12.6.2 Fitting the wafer stretcher to the guide trolley.. 294
12.6.3 Fitting the connections.. 299
12.6.4 Fitting the cover plate and the downholder plates.. 302
12.7 Wafer stretcher - configuration changes.. 305
12.7.1 Mechanically setting the stretch factor.. 305
12.7.1.1 Preparations.. 305
12.7.1.2 Settings.. 306
12.7.2 Setting the frame width for 8" wafer supports.. 307
12.7.2.1 Preparations.. 307
12.7.2.2 Settings.. 308
12.7.3 Converting wafer supports from 8" wafer stretchers to 12" wafer stretchers.. 309
12.7.3.1 Retrofit kit parts: 12" wafer expander.. 309
12.7.3.2 Preparations.. 310
12.7.3.3 Removing the 8" wafer support.. 311
12.7.3.4 Difference when converting the 12" to the 8".. 319
12.8 Setting the sag sensor IN 19.. 320
12.8.1 General information about the sag sensor.. 320
12.8.1.1 Sag sensor assembly structure.. 320
12.8.1.2 Sag sensor assembly function.. 321
12.8.1.3 Explanation of light intensity in connection with foil sag.. 322
8 Service Manual SIPLACE Wafer System (SWS) 11/2018
12.8.2 Mechanically setting the sag sensor IN19.. 323
12.8.2.1 Materials and equipment needed.. 323
12.8.2.2 Preparatory tasks.. 324
12.8.2.3 Adjusting (aligning) the sag sensor.. 324
12.8.3 Setting the switching threshold value.. 329
12.8.3.1 Checking the "switching threshold" function.. 332
12.8.4 Final work.. 332
13 BoxPC, GALIL cards and axis control.. 333
13.1 Removing and replacing the BoxPC.. 333
13.1.1 Preparatory tasks.. 333
13.1.1.1 Data backup.. 333
13.1.1.2 Preparing the SWS.. 333
13.1.2 Preparing removal of the BoxPC.. 334
13.1.2.1 Cable connections on the back of the BoxPC.. 335
13.1.3 Removing the BoxPC.. 338
13.1.4 Fitting the new BoxPC.. 339
13.1.4.1 Connecting the new BoxPC.. 340
13.1.4.2 Final work after installation.. 340
13.2 GALIL cards in the BoxPC.. 341
13.2.1 General information about the GALIL cards.. 341
13.2.2 Replacing the GALIL card.. 343
13.3 Replacing the servo amplifier for the axes.. 346
13.3.1 Removing the servo amplifier AMP-19540 from the SWS frame.. 347
13.3.2 GALIL AMP-19540 in detail.. 351
13.3.3 Fitting the servo amplifier AMP-19540 in the SWS frame.. 353
14 Settings and tests.. 357
14.1 SWS GUI - service settings.. 357
14.2 Manual settings.. 358
14.3 Camera calibration.. 359
15 Calibration.. 361
15.1 General information.. 361
15.2 Activation of setup operation at the SWS (hard and software).. 361
15.2.1 Precondition.. 361
15.2.2 Concept of retrofit for setup operation.. 362
15.2.3 Preparation of the software.. 363
15.2.4 Changing the cables at the mounting plate to allow for setup mode.. 364
15.2.5 Rules for the Setup mode - safety relevant issue!.. 368
15.3 Calibration die handling - flip unit.. 368
15.3.1 Preparation – adjusting the holding cylinder Z axis.. 368
15.3.1.1 Different locking systems for the holding cylinder.. 369
15.3.1.2 Adjustment of the holding cylinder Z axis.. 371
15.3.2 Calibration of the SWS – flip head.. 373
15.3.2.1 Entering calibration menu – flip head.. 373
15.3.2.2 Calibration – flip head rotation axis.. 374
15.3.2.3 Calibration – flip head Z axis.. 376
15.3.2.4 Calibration – segment offset calibration in X direction.. 379
15.3.2.5 Calibration – die ejector needle.. 385
15.3.2.6 Calibration – calibration station (not used on SWS).. 389
9Service Manual SIPLACE Wafer System (SWS) 11/2018
15.4 Calibration of the complete wafer handling.. 389
15.4.1 Calibrating the wafer lift.. 390
15.4.1.1 Calibrating the magazine lift limit positions.. 390
15.4.1.2 Calibrating the magazine slot scan position.. 391
15.4.1.3 Calibrating the wafer transfer position of the magazine with respect to the wafer table.. 394
15.4.1.4 Calibrating the wafer lift position – magazine change position.. 397
15.4.2 Wafer table calibration menu.. 398
15.4.2.1 Wafer table calibration.. 398
15.4.2.2 Wafer table positions.. 399
15.4.3 Calibration wafer changer menu.. 405
15.5 SWS data backup and restore.. 408
15.5.1 Machine data.. 408
15.5.2 Product data.. 409
16 Software.. 411
16.1 General information.. 411
16.1.1 Brief description.. 411
16.1.2 Scope of delivery.. 411
16.1.2.1 SWS software package.. 411
16.1.2.2 SWS operating system package.. 411
16.2 Installation of operating system.. 412
16.2.1 Backup of installed software.. 412
16.2.1.1 Backup of calibration and product data via GUI.. 412
16.2.1.2 Backup of Halcon license.. 416
16.2.1.3 Backup of Halcon license via Linux console... 416
16.2.1.4 Restoring the Halcon license via the GUI.. 419
16.2.1.5 Backup of installed SWS software via Linux console.. 421
16.2.1.6 Backup via bug report.. 424
16.2.1.7 Creating a recovery DVD for restoring the system.. 427
16.2.1.8 Restoring the system with the recovery DVD.. 432
16.2.1.9 Adding network addresses.. 433
16.2.2 Installation of operating system.. 436
16.2.2.1 Completing backup of the installed version first.. 437
16.2.2.2 Installing the GUI.. 438
16.2.3 Restoring the data.. 442
16.2.3.1 Restoring the Halcon license.. 442
16.2.3.2 Selecting the SWS location.. 444
16.2.3.3 Restoring the network addresses.. 447
16.2.3.4 Restoring the process data via the GUI.. 458
16.2.3.5 Restoring the calibration data via the GUI.. 460
16.2.3.6 Restoring the backup via the Linux console.. 462
16.2.3.7 Restoring the data from a bug report.. 465
16.2.4 Calibrating the touchscreen.. 465
16.3 Installing a new software version (GUI).. 466
16.4 Restoring an old software version (GUI).. 466
17 Tips and tricks.. 471
17.1 Moving the Z axis for die ejector downwards in the switched off and removed
SWS..
471
17.2 Wafer changer calibration problems.. 474
17.3 Wafers are recognized in the wrong slot of the magazine.. 476