00195982-03_SM_SWS_EN.pdf - 第46页
2 Overview of the SIPLACE wafer system (SWS) 2.4 Description of SWS assemblies 46 Service Manual SIPLACE Wafer System (SWS) 11/2018 Description While picking dies from a wafer, there is a danger that the die could begin …
2 Overview of the SIPLACE wafer system (SWS)
2.4 Description of SWS assemblies
Service Manual SIPLACE Wafer System (SWS) 11/2018 45
Safety instructions
Fig.26: Wafer support with SIPLACE SWS wafer stretcher
CAUTION
Risk of burns due to high temperatures!
The heating can reach temperatures of up to 60°C.
► Do not reach into the area around the fan with your hands.
► Be careful when touching the wafer support.
Technical data
SIPLACE SWS wafer stretcher Value
Wafer frame 8" or 12"
Wafer width for 8" wafer frame 10.5" and 10.8"
Weight of stretcher with wafer support 8" 14kg
Weight of stretcher with wafer support 12" 15kg
Wafer frame (metal and plastic) Up to 3.5 mm thick
Minimum operating pressure 4.0bar
Maximum operating pressure 5.5bar
Travel time for full stroke Approx. 2 seconds
Lowering time Approx. 2 seconds
Stretch factor (adjustable) *1) 2 mm, 4 mm, 6 mm, 8 mm
Clamping velocity for wafer centering 0.5 to 1.0 seconds
*1) The specified stretching heights relate to a wafer frame with a thickness of 1.5 mm. The fol-
lowing applies to other wafer frame thicknesses:
Stretching factor = set stretching height + frame thickness -1.5 mm
NOTICE
Definition
Extensive tests with various materials were conducted during the product development
phase.
However, due to the multitude of wafer foils available, the many die sizes and wafer frames,
we are unable to make a general function promise for all imaginable materials. New materi-
als should therefore be tested in advance, if there is any doubt.
Placement accuracy and performance values
See the specifications for the SIPLACE CA-Series, SC 708.0, edition 12/2014
2 Overview of the SIPLACE wafer system (SWS)
2.4 Description of SWS assemblies
46 Service Manual SIPLACE Wafer System (SWS) 11/2018
Description
While picking dies from a wafer, there is a danger that the die could begin to tilt. This can be
caused by an irregular adhesion of the die on the foil or an eccentric positioning of the needle. In
the case of dies which are positioned closely to one another, the neighboring die could be touched
and mutual damage can not be ruled out.
To prevent this, the wafer foil is stretched before the die is picked. This increases the distances
between the dies on the foil and makes it possible to pick dies without risks. The larger distances
between the dies also makes it easier for the Vision system to recognize them.
After the downholder plate has moved up and the clamp has been opened, the wafer foil sags. A
wafer with a sagging foil can not be moved back into the magazine.
Once the clamp and the downholder plate have been opened, the stretched wafer foil is warmed up
by the heater module. This shrinks the wafer foil (sag less than 9 mm) so that it can be moved back
into the magazine.
Fig.27: SIPLACE SWS wafer stretcher with stretched wafer foil
1. Stretched wafer foil in the SIPLACE SWS wafer stretcher
See also
2 12.1 "Explanation of the wafer stretcher" [}265]
3 SIPLACE wafer system (SWS) function
3.1 SWS basic functions
Service Manual SIPLACE Wafer System (SWS) 11/2018 47
3 SIPLACE wafer system (SWS) function
The new SWS provides a fully automatic wafer and chip handling system. It is fully integrated into a
SIPLACE CA placement system location. Each location can (with restrictions) be fitted with an
SWS or with an X table.
The SWS functions like a feeder for the SIPLACE system and transports the dies from the wafer to
a single, fixed pickup position for the placement head. The placement head picks the die up from
the SWS and places this on the board as done during SMD handling.
The SWS appears in SIPLACE Pro like an X table with a special feeder type. The programming of
the SIPLACE system is the same, for example, as that for the SIPLACE X-Series. Die handling is
programmed at a separate terminal on the SWS. The main parameters to be programmed are as
follows:
●
Wafer and die dimensions
●
Magazine type
●
Wafer frame type
●
Die recognition
●
Die ejection parameters
●
Wafer map system
●
Link to component programmed in SIPLACE Pro
3.1 SWS basic functions
The main die handling components are the wafer table, the magazine lift, the ejection system, the
flip unit and the control unit with corresponding SWS software.
The wafer with the relevant die is loaded from the magazine and fixed onto the wafer table. The
wafer table places the die using the ejector system, which releases the die from the wafer foil, and
transfers it to the flip unit. The flip unit rotates the die by 180° and makes this available for pickup
by the placement head.
The SIPLACE CA uses a high precision SIPLACE placement head which has been specifically se-
lected for maximum accuracy, to fulfill the specifications of 35µm at 3sigma for normal conditions
and 25µm at 3sigma under restricted conditions.
NOTICE
All movable positioning axes in the SWS are servo axes!
The following options are available to support the whole range of process-oriented functions:
●
Wafer map system
●
Linear dipping unit
●
Die attach unit
●
Small die kit (on request)
●
Barcode scanner
●
Wafer expander
●
Inspection camera