00195982-03_SM_SWS_EN.pdf - 第147页

7 Die ejector 7.4 Mechanical adjustment of the needle position in the X/Y position Service Manual SIPLACE Wafer System (SWS) 11/2018 147 Fig.182: ► Press the omega spring down until it has engaged completely. ► Then con…

7 Die ejector

7.3 Replacing spare parts

146 Service Manual SIPLACE Wafer System (SWS) 11/2018

Fig.180:

► Insert the four screws fastening the base plate.

Only tighten these screws slightly to begin with, so that the base plate remains flexible for ad-

justing its alignment.

The two rear screws (towards the wafer lift) are difficult to access.

Fig.181:

► Insert the omega spring. The hole (4) drilled in the omega spring is guided onto the holder

pin(5) in the recess.

7 Die ejector

7.4 Mechanical adjustment of the needle position in the X/Y position

Service Manual SIPLACE Wafer System (SWS) 11/2018 147

Fig.182:

► Press the omega spring down until it has engaged completely.

► Then connect all compressed air and vacuum cables plus all cables to the underside of the

die ejector unit (see 7.3.2 "Removing the complete die ejector unit from the SWS" [}122]).

► Reconnect the SWS to the power supply.

7.4 Mechanical adjustment of the needle position in the X/Y

position

Tools

●

T Allen key 5 mm

●

Fork wrench, 5 mm

●

Allen key 3mm, 4mm

Preconditions

●

SWS connected to power supply

7.4.1 Goal for mechanical adjustment of needle position in X/Y direction

The aim is to align the camera center (red cross in the camera image) with the tip of the ejection

system central needle.

In an ideal case, the adjustment and the checking of it should be performed when the SWS is fitted

in the CA machine.

If the adjustment is performed when the SWS is not fitted in the CA machine, there is a risk that the

center point could moved after the SWS has been fitted into the CA machine. Mechanical tension is

the cause for this.

After fitting the SWS into the CA machine, the needle position in relation to the camera center

needs to be checked again and readjusted, if needed.

7 Die ejector

7.4 Mechanical adjustment of the needle position in the X/Y position

148 Service Manual SIPLACE Wafer System (SWS) 11/2018

7.4.1.1 Explanation of the coordinate system

Fig.183:

(1) Camera center point (red cross)

(2) Center point of central needle in the ejection system (small, bright dot in the central drilled hole)

Fig.184:

(3) Y direction → movement of base plate in the direction of the wafer lift

(4) X direction → movement of base plate in the direction of the SWS sides

(5) Adjusting screw for moving the base plate in the Y direction (Allen key 4mm)

(6) Adjusting square shaft for moving the base plate in the X direction (fork wrench SW5)