00195982-03_SM_SWS_EN.pdf - 第387页

15 Calibration 15.3 Calibration die handling - flip unit Service Manual SIPLACE Wafer System (SWS) 11/2018 387 Fig.560: ► Choose Move to needle down position . Fig.561: ► Move a finger over the die ejector. ► If the ne…

15 Calibration

15.3 Calibration die handling - flip unit

386 Service Manual SIPLACE Wafer System (SWS) 11/2018

Fig.558:

► Choose Die handling calibration.

Fig.559:

► Choose Service Calibration Needle (1).

► Choose Die View (2).

ð Needle down position (µm) shows the current value! (3).

→ 1000µm in the example.

15 Calibration

15.3 Calibration die handling - flip unit

Service Manual SIPLACE Wafer System (SWS) 11/2018 387

Fig.560:

► Choose Move to needle down position.

Fig.561:

► Move a finger over the die ejector.

► If the needle down position is correct, you should feel a slight sharp scratching on your finger.

► Based on SWS experience, the protrusion of the needle can be up to 40µm!

Less is better which can, however, only be "measured" with a finger.

► In our example, the scratching at the fingertip is too strong.

We need to adjust the needle down position lower.

15 Calibration

15.3 Calibration die handling - flip unit

388 Service Manual SIPLACE Wafer System (SWS) 11/2018

Fig.562:

► Enter a value lower than 1000µm → in example here 800µm (1).

► Choose Move to needle down position (2).

► Check the needle position with your fingertip.

► If you can´t feel anything, the needle position is too low. In that case, adjust the value between

800µm – 1000µm.

► If the scratching is too strong, minimize the value again.

Fig.563:

► Enter a lower value, for example 780µm (1).

► Choose Move to needle down position (2).

► Check the needle position with your fingertip.

► Repeat this sequences again and again, until you can´t feel any scratching and then until you

feel a scratching again.

► This is finally the needle down value!

► Move the die ejector down using the software!