00195982-03_SM_SWS_EN.pdf - 第120页

7 Die ejector 7.2 Overview of spare parts 120 Service Manual SIPLACE Wafer System (SWS) 11/2018 7.2 Overview of spare parts Fig.133: Die ejector from front and back

7 Die ejector

7.1 Overview of main assemblies

Service Manual SIPLACE Wafer System (SWS) 11/2018 119

7 Die ejector

According to the location there are two different variants that only differ in their mirrored arrange-

ment of the modules.

●

Die ejector SWS12 (1/3) [00387913-xx]

●

Die ejector SWS12 (2/4) [00387881-xx]

7.1 Overview of main assemblies

Fig.132: Main die ejector assemblies

1. Z axis die ejector

7 Die ejector

7.2 Overview of spare parts

120 Service Manual SIPLACE Wafer System (SWS) 11/2018

7.2 Overview of spare parts

Fig.133: Die ejector from front and back

7 Die ejector

7.3 Replacing spare parts

Service Manual SIPLACE Wafer System (SWS) 11/2018 121

Item Item no. Spare part

1 03098367-xx

03098236-xx

Z axis die ejector (2/4), magnetic

Z axis die ejector (1/3), magnetic

2 00385741-xx Dual light barrier board 27.5 x14mm

3 00387580-xx Sealing unit

4 03050539-xx Solenoid valve MHE3-M1H-3/2G-1/8

5 00384600-xx AD-MOT Rev.0 Sub-D board = angled

6 03027512-xx Proximity switch SME-8F-DS-24V-K2.5-OE

7 00386142-xx AD board 12-pin connector pin strip 55x35mm MS-E543

8 03075723-xx Solenoid valve CPE10

9 00385053-xx Proximity switch NBN4-F29-E2

00201141-xx O-Ring 3x1mm

10 00387919-xx Omega spring

7.3 Replacing spare parts

7.3.1 Preparatory tasks

To remove the complete die ejector unit from the SWS, proceed as follows:

► Remove the ejection system.

See 7.6 "Converting the bayonet needle ejector unit (old version) to the magnetic needle

ejector unit (current version)" [}168]

► Move the wafer table to the change position so that you have access to the base plate of the

die ejector.

Fig.134:

NOTICE

The wafer table should, if possible, be moved with the software (see diagram). This is the

only guarantee that the die ejector is then in a low and secure position.

► However, if the die ejector is in the top position, it will need to be moved with the software to

the secure, lower position: