00195982-03_SM_SWS_EN.pdf - 第251页
10 Option Die Attach Unit SWS 10.2 Dissambling Die-Attach-Unit SWS Service Manual SIPLACE Wafer System (SWS) 11/2018 251 Fig.342: ► Insert the filling piece (see figure). However, do not fully tighten the safety screws …
10 Option Die Attach Unit SWS
10.2 Dissambling Die-Attach-Unit SWS
250 Service Manual SIPLACE Wafer System (SWS) 11/2018
Fig.340:
The filling piece is required to fill the gap in the flip head raceway after removing the Die Attach
Unit. The filling piece is mounted on the Die Attach Unit (see figure).
Fig.341:
► Open the safety screws of the filling piece and take it out.
10 Option Die Attach Unit SWS
10.2 Dissambling Die-Attach-Unit SWS
Service Manual SIPLACE Wafer System (SWS) 11/2018 251
Fig.342:
► Insert the filling piece (see figure). However, do not fully tighten the safety screws yet.
Fig.343:
The filling piece must be adjusted with the adjustment gauge shown in the figure. It can be found in
the service box of the SWS.
CAUTION
If the filling piece is not adjusted with the gauge, there will be a step to the flip head race-
way. When the bearing of the segment moves over this step the picked die will be lost or
shifted!
► Insert the adjustment gauge into the loosely mounted filling piece. The edges of the
adjustment gauge must be inside the raceway (see following figure).
10 Option Die Attach Unit SWS
10.2 Dissambling Die-Attach-Unit SWS
252 Service Manual SIPLACE Wafer System (SWS) 11/2018
Fig.344:
NOTICE
► Cover the opening of the die ejector, e.g. with a cardboard (as a protection to prevent
damages should the gauge fall down). Do not forget to lift the cover off once you are
finished.
Fig.345:
► Gently tighten the two safety screws of the filling piece.
► Take the adjustment gauge out.
► Move the rotation axis of the flip head manually and make sure the bearing of the segment
moves smoothly over the filling piece.
► The cables and tubes for the Die Attach Unit must be bound together with cable ties (see fol-
lowing figures).
– If the cables stand up, there will be a crash with the placement head!
– If the cables sag, they will be damaged by the wafer table!