00195982-03_SM_SWS_EN.pdf - 第148页

7 Die ejector 7.4 Mechanical adjustment of the needle position in the X/Y position 148 Service Manual SIPLACE Wafer System (SWS) 11/2018 7.4.1.1 Explanation of the coordinate system Fig.183: (1) Camera center point (red…

100%1 / 506
7 Die ejector
7.4 Mechanical adjustment of the needle position in the X/Y position
Service Manual SIPLACE Wafer System (SWS) 11/2018 147
Fig.182:
► Press the omega spring down until it has engaged completely.
► Then connect all compressed air and vacuum cables plus all cables to the underside of the
die ejector unit (see 7.3.2 "Removing the complete die ejector unit from the SWS" [}122]).
► Reconnect the SWS to the power supply.
7.4 Mechanical adjustment of the needle position in the X/Y
position
Tools
●
T Allen key 5 mm
●
Fork wrench, 5 mm
●
Allen key 3mm, 4mm
Preconditions
●
SWS connected to power supply
7.4.1 Goal for mechanical adjustment of needle position in X/Y direction
The aim is to align the camera center (red cross in the camera image) with the tip of the ejection
system central needle.
In an ideal case, the adjustment and the checking of it should be performed when the SWS is fitted
in the CA machine.
If the adjustment is performed when the SWS is not fitted in the CA machine, there is a risk that the
center point could moved after the SWS has been fitted into the CA machine. Mechanical tension is
the cause for this.
After fitting the SWS into the CA machine, the needle position in relation to the camera center
needs to be checked again and readjusted, if needed.
7 Die ejector
7.4 Mechanical adjustment of the needle position in the X/Y position
148 Service Manual SIPLACE Wafer System (SWS) 11/2018
7.4.1.1 Explanation of the coordinate system
Fig.183:
(1) Camera center point (red cross)
(2) Center point of central needle in the ejection system (small, bright dot in the central drilled hole)
Fig.184:
(3) Y direction → movement of base plate in the direction of the wafer lift
(4) X direction → movement of base plate in the direction of the SWS sides
(5) Adjusting screw for moving the base plate in the Y direction (Allen key 4mm)
(6) Adjusting square shaft for moving the base plate in the X direction (fork wrench SW5)
7 Die ejector
7.4 Mechanical adjustment of the needle position in the X/Y position
Service Manual SIPLACE Wafer System (SWS) 11/2018 149
7.4.1.2 Preparatory tasks
► Switch the SWS on and initialize the system.
► Log yourself in as SIPLACE Service.
Fig.185:
► Switch menu to Wafer Handling (1 to 3).
Fig.186:
► Move the wafer table to the change position (4).
► Leave this menu in the main view.