00195982-03_SM_SWS_EN.pdf - 第504页

18 Appendix 18.6 Wafer heating 504 Service Manual SIPLACE Wafer System (SWS) 11/2018

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18 Appendix
18.6 Wafer heating
Service Manual SIPLACE Wafer System (SWS) 11/2018 503
18.6.4 Temperature control
The temperature of the wafer heater is measured with an NTC resistor (type: Epcos B57560-
G103F(10K)). This measurements gives a one hundred percent monitoring of the functionality of
both the fan and the two heating elements.
The NTC should as far as possible be integrated into the top central position on the air flow outlet
for the wafer heater. The NTC fixtures and the electromechanical connections still need to be
defined.
The analog signal for the NTC will be evaluated in the USB-IO board (input AI8).
(conversion formula: "current C°" = ("current count" - 570) : 15,37 + 23C°, see document "Diagram
of NTC resistance")
The temperature is measured with the "TESTO-610" temperature measuring device. At the same
time, the analog value AI8 is read out in NTC count.
The analog input voltage AI8 is also the recognition that the wafer heater is ready for operation. If
the wafer heater is not connected to the NTC, the analog input voltage will be 0, which corresponds
to a "current C°" of minus 14C°.
For an illustration of the dynamic time constants for NTC, refer to the "Wafer heater timing dia-
gram" document.
The measurements were performed with various heating outputs and switch-on times. The max-
imum output temperature is approx. 83C°.
Two measurements were recorded below the wafer foil. The NTC was stuck in a central position,
underneath the wafer.
18.6.5 Menu items
1. Travel speed for motors of wafer X/Y:
Optimum travel speeds for the wafer over the heater are needed for all common wafer and foil
types. The overall travel time is the same as the heating time.
Menu entry from 5 seconds to 15 seconds, in increments of seconds.
2. Heat-up time:
To increase the temperature as fast as possible, you need a heat-up time at full power.
Menu entry from 2000ms to 10000ms, in 100ms increments.
3. Heating output:
Menu entry from 1000W to 2000W, in 100W increments.
4. Cooling time:
Menu entry from 0ms to 5000ms, in 100ms increments.
18.6.6 Temperature display:
Menu display: "Temperature wafer heater" in 1 C° increments.
18 Appendix
18.6 Wafer heating
504 Service Manual SIPLACE Wafer System (SWS) 11/2018