00195982-03_SM_SWS_EN.pdf - 第501页
18 Appendix 18.5 Touch-down sensor rev. 1 Service Manual SIPLACE Wafer System (SWS) 11/2018 501 18.5.5 Test program motor control Height measurement nozzle The height measurement program at the USB-IO will start. (1) #St…
18 Appendix
18.5 Touch-down sensor rev. 1
500 Service Manual SIPLACE Wafer System (SWS) 11/2018
18.5.3.3 Height measurement needle - die ejector:
To measure the height of the needle, you need to start measurement 2x. The first measurement
will be performed with the motor flip Z.
The die ejector vacuum will be switched on.
The position of the chip surface is approached with the nozzle and measured (see description:
"height measurement - nozzle 1 or 2 in Z lift").
The nozzle spring has then compressed by approx. 50-100µm. A new measurement is then star-
ted in the USB-IO. The USB-IO sets the output for the latch inputs (IN4, IN10, IN12) to "0". This is
the release for the motor start. The die ejector motor starts from the home-index position. The max-
imum starting lift is 2000count (2000µm).
If the change in voltage (measurement sensitivity approx. 10-30µm) is large enough, the output
signal = "1" will immediately switch the latch inputs (IN4, IN10, IN12). The latch input immediately
freezes the die ejector axis encoder value. The die ejector motor will immediately receive a stop
command.
The calculated offset downwards gives the exact needle height.
18.5.4 Function procedure - USB-IO program
The USB-IO control receives the start signal for the measurement program nozzle 1 or 2 from the
control computer.
After this, the output value for the sensor is read 10x within 1ms to form an average value. The two
highest and the two lowest values are not included in this calculation. The smoothed values are
then saved for the final comparative calculation. The analog values must be in the measurement
window between 1100count and 1850count. If this is not the case, an error message will be is-
sued at the control computer.
If the analog value is valid, the USB-IO sets the output signal for the latch inputs to "0" and meas-
urement can begin. The latch input signal "0" (IN4, IN10, IN12) is the release for the motor start.
When measurement starts, the analog values for the touch-down sensor are constantly read in.
One read-in process takes approx. 60 us. The last three measurements are added after each read-
in process and divided by three. The value currently calculated is then subtracted from the saved
value.
If the result is greater than 10count (measurement sensitivity = 10µm), the output for the latch in-
puts (IN4, IN10, IN12) will be immediately switched to "1".
18 Appendix
18.5 Touch-down sensor rev. 1
Service Manual SIPLACE Wafer System (SWS) 11/2018 501
18.5.5 Test program motor control
Height measurement nozzle
The height measurement program at the USB-IO will start.
(1) #Start
(2) CN,,-1 "Latch input is active low "
(3) ALF "Arm latch motor F"
(4) PAF=-2000 "Start position is approx. 1-1.5mm above chip"
(5) BGF "Start motor F tool Z"
(6) #JP1 Jump latch F"
(7) JP#JP1,_ALF=1 "Query latch F"
(8) STF "Stop motor F"
(9) RLF "Read latch motor F"
(10) WT500 "Waiting period 500 ms"
(11) TPF "Read stop pos. motor F"
(12) EN "Program end"
Height measurement needle - die ejector
The height measurement program on the USB-IO will be started.
(1) #Start
(2) CN,,-1 "Latch input is active low "
(3) ALF "Arm latch motor F"
(4) PAF=-2000 "Start position is approx. 1-1.5mm above chip"
(5) BGF "Start motor F tool Z"
(6) #JP1 "Jump latch F"
(7) JP#JP1,_ALF=1 "Query latch F"
(8) STF "Stop motor F"
(9) TPF "Read stop pos. motor F"
(10) WT500 "Waiting period 500 ms"
The height measurement program on the USB-IO will be restarted.
(11) ALD "Arm-latch motor-D"
(12) PAF=2000 "Start position is the home-index position"
(13) BGD "Start motor D die ejector"
(14) #JP2 "Jump latch D"
(15) JP#JP2,_ALD=1 "Query latch-D"
(16) STD "Stop motor D"
(17) RLD "Read latch motor D"
(18) EN "Program end"
18 Appendix
18.6 Wafer heating
502 Service Manual SIPLACE Wafer System (SWS) 11/2018
18.6 Wafer heating
18.6.1 Function description
The wafer heating is only used in the SWS 12inch, in combination with the wafer expander 12".
The dimensions for the wafer heater with fan are: length = 20cm, width = 4cm.
The installation site is under the table plate, between the wafer lift and the die ejector, at the center
of the X axis. The wafer heater is aligned along the Y axis in its length.
After opening the expander, the wafer is positioned over the wafer heater and is moved in an op-
timum oval circle over the heater, so that the wafer foil is evenly tensioned at all positions. The
wafer can then be transported to the cassette.
The question whether the foil needs to be heated before expansion needs to be discussed.
18.6.2 Switching elements
1. F5 automatic 3 pin 5SY6 310-7 C/10A
2. K8 circuit breaker 3 pin/3KW /1Ö 3RT1015-1JB42
3. K9 and K10 solid state relay PFE240025R-MS31XS / 6A
4. K11 time relay 24VDC (release-delayed) 3RP15 40-1BB30
5. Heating element type: 6220RA 230V / 2x1000W
6. Cross-flow fan type: QLZ06/1800A315-2518-125za 230V/50-60Hz
7. NTC resistor type: Epcos B57560-G103F,10K
8. 6.3 AT glass fuse
The control system with fuse and relay has a modular design can be be retrofitted as an option.
18.6.3 Electrical connections and addressing
The wafer heating including fan is supplied with 3-phase 230VAC from transformer T1 and is se-
cured with a 3 pin automatic F5.
When the emergency STOP function has been enabled, all relays and the contactor K8 will be
switched off.
Contactor K8 (OUT1.8) switches the fan on and provides the supply voltage for the two heating ele-
ments up to the semiconductor relay K9 / K10.
The time relay K11 (OUT1.5 300ms on/off signal) enables the heating control. The time relay is a
safety feature. In the event of a control error or a computer crash, the heating would be switched
off after the time period set in the time relay.
The relays K9 (OUT1.6) and K10 (OUT1.7) then (after approx. 50ms) switch the heating on with
1000W each. The heating can only be activated with the switched-on fan (contactor K8 OUT1.8).
Relays K9 and K10 are switched on with 50ms delay to contactor K8 and switched off at least
50ms earlier. This prevents power switching (2KW) via the mechanical contacts of contactor K8
(interference resistance).
A temperature safety switch has been integrated to prevent system overheating.
While the wafer is on its way to the starting heater position, the heating can already be enabled.
The heater needs approx. 2 seconds heat-up time.
After approx. 3 to 5 seconds, the optimum temperature will have spread under the wafer.
To avoid overheating of the wafer, the heating circuit is pulse-controlled.
The power to the heating circuit 2 K10 (OUT1.7) is switched on and off in a frequency of 100ms.
The heating capacity rises and sinks according to the switch-on/off time. An output of 1000W to
2000W is realized.
The whole heating time is calculated using the travel speed of the X/Y axes.
After switching off the heating, there is a decreasing post-heating of approx. 2 seconds. The wafer
can be cooled off with the fan after heating.
Contactor K8 remains switched on during this. The cooling time (0ms to 5000ms) is started after
the heating relay K9 / K10 has been switched off.