00195982-03_SM_SWS_EN.pdf - 第55页
3 SIPLACE wafer system (SWS) function 3.3 Pick and transfer process in detail Service Manual SIPLACE Wafer System (SWS) 11/2018 55 3.3.3 Die attach – transfer position Fig.35: Die attach – transfer position ● The die at…
3 SIPLACE wafer system (SWS) function
3.3 Pick and transfer process in detail
54 Service Manual SIPLACE Wafer System (SWS) 11/2018
3.3.2 Flip chip segment 1 (Z direction)
Fig.34: Flip chip segment 1 (Z direction)
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The X axis of the flip chip rotary part, segment 1 is moved to the transfer position.
3 SIPLACE wafer system (SWS) function
3.3 Pick and transfer process in detail
Service Manual SIPLACE Wafer System (SWS) 11/2018 55
3.3.3 Die attach – transfer position
Fig.35: Die attach – transfer position
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The die attach rotates to the transfer position.
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The placement head picks the chip up from the die attach segment and rotates to the next
star position.
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At the same time the X axis pulls segment no. 1 back into the home position.
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The flip chip unit - segment no. 1 rotates to the pickup position and picks up the next chip.
NOTICE
While using the die attach unit, only the segment no.1 of the flip chip unit is active.
3 SIPLACE wafer system (SWS) function
3.3 Pick and transfer process in detail
56 Service Manual SIPLACE Wafer System (SWS) 11/2018
3.3.4 Flip chip encoded positions (after calibration)
Fig.36: Flip chip encoded positions (after calibration)
0° Home sensor position"
180° Pickup position, segment 1
125° Camera "free position"
96° Discharge position, segment 1
90° Home offset position
83° Discharge position, segment 2
58° Camera "free position"