00195982-03_SM_SWS_EN.pdf - 第502页
18 Appendix 18.6 Wafer heating 502 Service Manual SIPLACE Wafer System (SWS) 11/2018 18.6 Wafer heating 18.6.1 Function description The wafer heating is only used in the SWS 12inch, in combination with the wafer expande…
18 Appendix
18.5 Touch-down sensor rev. 1
Service Manual SIPLACE Wafer System (SWS) 11/2018 501
18.5.5 Test program motor control
Height measurement nozzle
The height measurement program at the USB-IO will start.
(1) #Start
(2) CN,,-1 "Latch input is active low "
(3) ALF "Arm latch motor F"
(4) PAF=-2000 "Start position is approx. 1-1.5mm above chip"
(5) BGF "Start motor F tool Z"
(6) #JP1 Jump latch F"
(7) JP#JP1,_ALF=1 "Query latch F"
(8) STF "Stop motor F"
(9) RLF "Read latch motor F"
(10) WT500 "Waiting period 500 ms"
(11) TPF "Read stop pos. motor F"
(12) EN "Program end"
Height measurement needle - die ejector
The height measurement program on the USB-IO will be started.
(1) #Start
(2) CN,,-1 "Latch input is active low "
(3) ALF "Arm latch motor F"
(4) PAF=-2000 "Start position is approx. 1-1.5mm above chip"
(5) BGF "Start motor F tool Z"
(6) #JP1 "Jump latch F"
(7) JP#JP1,_ALF=1 "Query latch F"
(8) STF "Stop motor F"
(9) TPF "Read stop pos. motor F"
(10) WT500 "Waiting period 500 ms"
The height measurement program on the USB-IO will be restarted.
(11) ALD "Arm-latch motor-D"
(12) PAF=2000 "Start position is the home-index position"
(13) BGD "Start motor D die ejector"
(14) #JP2 "Jump latch D"
(15) JP#JP2,_ALD=1 "Query latch-D"
(16) STD "Stop motor D"
(17) RLD "Read latch motor D"
(18) EN "Program end"
18 Appendix
18.6 Wafer heating
502 Service Manual SIPLACE Wafer System (SWS) 11/2018
18.6 Wafer heating
18.6.1 Function description
The wafer heating is only used in the SWS 12inch, in combination with the wafer expander 12".
The dimensions for the wafer heater with fan are: length = 20cm, width = 4cm.
The installation site is under the table plate, between the wafer lift and the die ejector, at the center
of the X axis. The wafer heater is aligned along the Y axis in its length.
After opening the expander, the wafer is positioned over the wafer heater and is moved in an op-
timum oval circle over the heater, so that the wafer foil is evenly tensioned at all positions. The
wafer can then be transported to the cassette.
The question whether the foil needs to be heated before expansion needs to be discussed.
18.6.2 Switching elements
1. F5 automatic 3 pin 5SY6 310-7 C/10A
2. K8 circuit breaker 3 pin/3KW /1Ö 3RT1015-1JB42
3. K9 and K10 solid state relay PFE240025R-MS31XS / 6A
4. K11 time relay 24VDC (release-delayed) 3RP15 40-1BB30
5. Heating element type: 6220RA 230V / 2x1000W
6. Cross-flow fan type: QLZ06/1800A315-2518-125za 230V/50-60Hz
7. NTC resistor type: Epcos B57560-G103F,10K
8. 6.3 AT glass fuse
The control system with fuse and relay has a modular design can be be retrofitted as an option.
18.6.3 Electrical connections and addressing
The wafer heating including fan is supplied with 3-phase 230VAC from transformer T1 and is se-
cured with a 3 pin automatic F5.
When the emergency STOP function has been enabled, all relays and the contactor K8 will be
switched off.
Contactor K8 (OUT1.8) switches the fan on and provides the supply voltage for the two heating ele-
ments up to the semiconductor relay K9 / K10.
The time relay K11 (OUT1.5 300ms on/off signal) enables the heating control. The time relay is a
safety feature. In the event of a control error or a computer crash, the heating would be switched
off after the time period set in the time relay.
The relays K9 (OUT1.6) and K10 (OUT1.7) then (after approx. 50ms) switch the heating on with
1000W each. The heating can only be activated with the switched-on fan (contactor K8 OUT1.8).
Relays K9 and K10 are switched on with 50ms delay to contactor K8 and switched off at least
50ms earlier. This prevents power switching (2KW) via the mechanical contacts of contactor K8
(interference resistance).
A temperature safety switch has been integrated to prevent system overheating.
While the wafer is on its way to the starting heater position, the heating can already be enabled.
The heater needs approx. 2 seconds heat-up time.
After approx. 3 to 5 seconds, the optimum temperature will have spread under the wafer.
To avoid overheating of the wafer, the heating circuit is pulse-controlled.
The power to the heating circuit 2 K10 (OUT1.7) is switched on and off in a frequency of 100ms.
The heating capacity rises and sinks according to the switch-on/off time. An output of 1000W to
2000W is realized.
The whole heating time is calculated using the travel speed of the X/Y axes.
After switching off the heating, there is a decreasing post-heating of approx. 2 seconds. The wafer
can be cooled off with the fan after heating.
Contactor K8 remains switched on during this. The cooling time (0ms to 5000ms) is started after
the heating relay K9 / K10 has been switched off.
18 Appendix
18.6 Wafer heating
Service Manual SIPLACE Wafer System (SWS) 11/2018 503
18.6.4 Temperature control
The temperature of the wafer heater is measured with an NTC resistor (type: Epcos B57560-
G103F(10K)). This measurements gives a one hundred percent monitoring of the functionality of
both the fan and the two heating elements.
The NTC should as far as possible be integrated into the top central position on the air flow outlet
for the wafer heater. The NTC fixtures and the electromechanical connections still need to be
defined.
The analog signal for the NTC will be evaluated in the USB-IO board (input AI8).
(conversion formula: "current C°" = ("current count" - 570) : 15,37 + 23C°, see document "Diagram
of NTC resistance")
The temperature is measured with the "TESTO-610" temperature measuring device. At the same
time, the analog value AI8 is read out in NTC count.
The analog input voltage AI8 is also the recognition that the wafer heater is ready for operation. If
the wafer heater is not connected to the NTC, the analog input voltage will be 0, which corresponds
to a "current C°" of minus 14C°.
For an illustration of the dynamic time constants for NTC, refer to the "Wafer heater timing dia-
gram" document.
The measurements were performed with various heating outputs and switch-on times. The max-
imum output temperature is approx. 83C°.
Two measurements were recorded below the wafer foil. The NTC was stuck in a central position,
underneath the wafer.
18.6.5 Menu items
1. Travel speed for motors of wafer X/Y:
Optimum travel speeds for the wafer over the heater are needed for all common wafer and foil
types. The overall travel time is the same as the heating time.
Menu entry from 5 seconds to 15 seconds, in increments of seconds.
2. Heat-up time:
To increase the temperature as fast as possible, you need a heat-up time at full power.
Menu entry from 2000ms to 10000ms, in 100ms increments.
3. Heating output:
Menu entry from 1000W to 2000W, in 100W increments.
4. Cooling time:
Menu entry from 0ms to 5000ms, in 100ms increments.
18.6.6 Temperature display:
Menu display: "Temperature wafer heater" in 1 C° increments.