00195982-03_SM_SWS_EN.pdf - 第497页
18 Appendix 18.4 Control system IN/OUT Service Manual SIPLACE Wafer System (SWS) 11/2018 497 18.4.6 Select list USB-IO DI1 = camera flash output (signal = 1, flash for LED lighting wafer) DI2 = reserve DI3 = recognition …
18 Appendix
18.4 Control system IN/OUT
496 Service Manual SIPLACE Wafer System (SWS) 11/2018
IN16 = emergency STOP signal in general (signal = 1 emergency STOP not pressed, signal = 0
emergency STOP pressed)
*** recognition of emergency STOP signal from the SIPLACE (signal IN16 = 0 and signal IN1 = 1) **
IN17 = pneumatic wafer expander is open (signal = 1) *** expander = optional ***
IN18 = Pneumatic wafer expander is closed (signal = 1) (identify expander = IN17 or IN18=1)
IN19 = (only SWS8") control sensor for die ejector in advance feed working position (signal = 1)
IN20 = reserve X16
IN21 = reserve X16
IN22 = reserve X16
IN24 = key switch (signal = 1, key switch is enabled for service function
OUT1 = relay K4 100ms switch on/off (emergency STOP will be reset)
OUT2 = valve main compressed air (output = 1, compressed air is switched on)
OUT3 = vacuum pump (output =1, vacuum is switched via the power relay OK7)
OUT4 = open valve for cylinder wafer expander *** expander = optional***
OUT5 = close valve for cylinder wafer expander
OUT6 = reserve X11, X16
OUT7 = valve for cylinder die ejector Z stroke (output = 1, Z stroke upwards)
OUT8 = valve for cylinder die ejector driver pin (output = 1, driver pin has been moved out)
OUT9 = valve for cylinder wafer clamp (output = 1, clamp is closed)
OUT10 = vacuum valve for die ejector (suction of wafer foil) (output = 1, vacuum = on)
OUT11 = reserve X13, X16
OUT12 = enable - optical component sensor (1= enable laser) *** optional for small chip ***
OUT13 = valve for Rückhaltezylinder flip tool Z (output via K1 = 1, cylinder is down)
OUT14 = Valve for clamping cylinder flip tool X (output via K2 = 1, clamping is open)
OUT15 = reserve X16
OUT16 = relay K4, presence signal for SIPLACE (output = 1, CSM is present)
DMC1826
IN1.1 = control sensor for wafer query in the cassette (signal = 1, wafer is present)
IN1.2 = check wafer heating (signal = 1)
IN1.3 = door switch wafer lift (signal = 1, door is closed)
IN1.4 = 2x switch (8", 12") for wafer cassette (signal = 1, cassette present in wafer lift)
IN1.5 = sensor for wafer gripper in top position (signal = 1)
IN1.6 = sensor for wafer gripper in bottom position (signal = 1)
IN1.7 = sensor for wafer gripper opened (signal = 1)
IN1.8 = sensor for wafer gripper is closed, wafer is in gripper (signal = 1)
*** IN1.7 and IN1.8 both signals are 0, wafer gripper is closed without wafer ***
OUT1.1 = reserve
OUT1.2 = valve wafer gripper for top/bottom position (output = 1, = bottom position)
OUT1.3 = valve wafer gripper for open/closed (output = 1, = gripper closed)
OUT1.4 = reserve
OUT1.5 = wafer heating safety time relay (on/off 300ms) ** wafer heating = optional **
OUT1.6 = Wafer heating 1 (heater coil 1000W)
OUT1.7 = Wafer heating 2 (heater coil 1000W)
OUT1.8 = crossflow fan for wafer heater
18 Appendix
18.4 Control system IN/OUT
Service Manual SIPLACE Wafer System (SWS) 11/2018 497
18.4.6 Select list USB-IO
DI1 = camera flash output (signal = 1, flash for LED lighting wafer)
DI2 = reserve
DI3 = recognition for dip module (signal = 1, dip module is connected and OK)
DI4 = dip module ready (signal = 0, dip module in progress, signal = 1, dip module ready)
DI5 = control sensor right bad die box (signal = 1, right bad die box is present)
DI6 = control sensor left bad die box (signal = 1, left bad die box is present)
DI7 = recognition of die attach unit = option (signal = 1, die attach unit is connected)
DI8 = error query for the encoder flip-rotate (signal = 1, encoder = OK)
DO1 = compressed air valve for flip tool 1 (output = 1, compressed air is switched through)
DO2 = vacuum valve for flip tool 1 (output = 1, vacuum switched through)
DO3 = compressed air valve for flip tool 2 (output = 1, compressed air is switched through)
DO4 = vacuum valve for flip tool 2 (output = 1, vacuum switched through)
DO5 = compressed air valve for die attach tool 2 (output = 1, compressed air is switched through)
DO6 = vacuum valve for die attach tool (output = 1, vacuum switched through)
DO7 = initialization signal for dip unit (output = 1, start of initialization)
DO8 = start signal for dip unit (output = 1, start release for one sequence)
AI1 = vacuum sensor for flip tool 1
AI2 = vacuum sensor for flip tool 2
AI3 = vacuum sensor for main vacuum
AI6 = vacuum sensor (external) for die attach unit
The analog output signal depends on the vacuum strength and the tool hole.
The lower the vacuum value and the larger the tool hole, the lower the output voltage of the
vacuum sensor will be.
If there is a chip held on the tool (suction), the output voltage will change by approx. 50 to 200mV
(for small tool holes) and by approx. 200‑1000mV (for large tool holes).
AI4 = height check for flip tool 1 (analog signal 3.5 to 4V = output signal)
AI5 = height check for flip tool 2 (analog signal 3.5 to 4V = output signal)
A change in decreasing voltage by <100mV → recognition that the tool has made contact with the
wafer.
AI7 = reserve STA3
AI8 = reserve STA3
ILED1 = LED illumination "bright field" 4x corners illuminated
ILED2 = LED illumination "bright field" 4x lines illuminated (outer)
ILED3 = LED illumination "bright field" center illuminated
ILED4 = reserve
ILED5 = LED illumination in circle "dark field" 2x corners illuminated (rear)
ILED6 = LED illumination in circle "dark field" 2x corners illuminated (front)
ILED7 = LED illumination in circle "dark field" 2x lines illuminated (right, left)
ILED8 = LED illumination in circle "dark field" 2x lines illuminated (front, back)
The illumination is addressed via the power control (current output signal ILED1, ILED2…ILED8).
The maximum permanently present current per hardware is 60mA, which is limited to 30 mA per
software.
The maximum current for the flash function is 120 mA. The time is limited per software.
18 Appendix
18.5 Touch-down sensor rev. 1
498 Service Manual SIPLACE Wafer System (SWS) 11/2018
18.5 Touch-down sensor rev. 1
18.5.1 Function description
The touch-down sensor (Hall sensor Micronas type:815K) is a universal magnetic and program-
mable field sensor.
There is a magnet positioned at approx. 400µm distance from the sensor, which is aligned with its
plus pole towards the sensor.
When the sensor has a distance of 400µm to the magnet, the sensor issues voltage of approx.
4.0V. The basic output voltage should be between 3.0V and 4.2V.
When the voltage is over 4.75 V, the sensor is saturated and will not issue any more changes in
voltage.
The touch-down movement sees the nozzle and the magnet being pressed upwards against a
spring. The distance of the magnet to the sensor increases and the output voltage of the Hall
sensor decreases, linear to the distance.
A change in distance of 100µm produces a change in voltage of 0.25V. This produces a change
in analog-digital conversion of 100 count.
18.5.2 Electrical connections
The two touch-down sensors are supplied via a special high-flex round cable (4 pin) through the
hollow shaft (torsion 180°) to the distributor board AD-HC.
The two flat-flex cables run from the AD-HC board to the AD-HCS sensor boards, placed with the
Hall sensor 815K (placement variant left and right). The flat-flex cable is integrated into the Z move-
ment (pickup) of the two nozzles.
Since the cable is subject to high stress (lift 7-8mm, 6,000cycles/h), it is important to avoid any
damage or folding of the flex cable.
The electrical connection of the touch-down sensors on the USB-IO board (cable 4 pin) is as fol-
lows:
●
Brown = terminal 5V
●
Green = terminal AI4 (analog input touch-down sensor nozzle 1)
●
Black = terminal AI5 (analog input touch-down sensor nozzle 2)
●
Blue = terminal AGND
The supply voltage for the sensors us 5 V against AGND.
The voltage output for the sensors can be picked off at the terminals A14 (nozzle 1) or A15 (nozzle
2) against the terminal AGND.
Since the analog evaluation of the sensors takes place at the USB-IO board and the motor move-
ment takes place at the Galil motor controller, there is a digital output signal from the USB-IO board
to the motor controller, directly to the latch inputs, IN4 = die ejector, IN10 = flip Z, IN12 = flip X. This
output signal is made available through a hardware modification to the USB-IO board.
This means that we bypass the communication times for the USB interface and have a direct signal
for the encoder value storage.