00195982-03_SM_SWS_EN.pdf - 第7页

7 Service Manual SIPLACE Wafer System (SWS) 11/2018 11 Extension groups .. 255 11.1 Wafer supports .. 255 11.1.1 Overview .. 255 11.1.2 Overview of spare parts .. 256 11.1.3 Replacing spare parts .. 257 11.1.3.…

100%1 / 506
6 Service Manual SIPLACE Wafer System (SWS) 11/2018
8.4.4.1 Correction in X direction (segment 1).. 186
8.4.4.2 Correction in Y direction (segment 1).. 187
8.4.4.3 Correction in X direction (segment 2).. 188
8.4.4.4 Correction in Y direction (segment 1).. 189
8.4.5 Overview of offset correction in X and Y direction.. 190
9 Wafer change system.. 191
9.1 Magazine lift.. 192
9.1.1 Replacing spare parts.. 192
9.1.1.1 Preparations.. 192
9.1.1.2 Replacing the motor.. 193
9.1.1.3 Replacing the proximity switch.. 194
9.1.1.4 Crash sensor and slot query.. 195
9.1.1.5 Switch for checking whether a cassette is present.. 196
9.1.1.6 Cover switch.. 197
9.1.1.7 Door switch.. 198
9.1.1.8 Wafer lift - replacing the recirculating ball screw.. 199
9.1.2 Electrical system.. 200
9.2 Gripper.. 201
9.2.1 Overview of main assemblies.. 201
9.2.2 Overview of spare parts.. 202
9.2.3 Replacing spare parts.. 204
9.2.3.1 Requirements/preparations.. 204
9.2.3.2 Tools.. 204
9.2.4 Replacing the proximity switch on the toothed belt axis.. 204
9.2.4.1 Setting the position of the proximity switch.. 206
9.2.5 Replacing the motor with coupling for wafer handling.. 207
9.2.6 Replacing the solenoid valves.. 208
9.2.6.1 Setting gentle clamping and moving of the gripper (for location 2/4).. 209
9.2.6.2 Setting gentle clamping and moving of the gripper (for location 1/3).. 209
9.2.7 Dismantling the gripper for location 1/3.. 210
9.2.8 Dismantling the gripper for location 2/4.. 211
9.2.9 Replacing the toothed belt axis.. 212
9.2.9.1 Aligning the height of the toothed belt axis on the lift.. 213
9.2.9.2 Aligning the height of the toothed belt axis at the changer.. 213
9.2.10 Replace the wafer changer completely.. 214
10 Option Die Attach Unit SWS.. 215
10.1 Installing the Option Die Attach Unit SWS.. 215
10.1.1 Description of the Die Attach Unit SWS.. 215
10.1.2 Initial situation.. 216
10.1.3 Installing the Option Die Attach Unit in SWS.. 219
10.1.4 Mechanical alignment of the Die Attach segment – flip head segment 1.. 231
10.1.4.1 Alignment in y direction.. 232
10.1.4.2 Alignment in Z direction.. 233
10.1.4.3 Mechanical adjustment of the Transfer-x axis holding cylinder.. 234
10.1.4.4 Storing the cables.. 236
10.1.5 Calibration of the Die Attach Module.. 238
10.1.5.1 Calibration of the Die Attach Rotation Axis.. 238
10.1.5.2 Calibration of the Die Attach Transfer X Axis.. 242
10.2 Dissambling Die-Attach-Unit SWS.. 243
7Service Manual SIPLACE Wafer System (SWS) 11/2018
11 Extension groups.. 255
11.1 Wafer supports.. 255
11.1.1 Overview.. 255
11.1.2 Overview of spare parts.. 256
11.1.3 Replacing spare parts.. 257
11.1.3.1 Replacing the complete wafer support.. 257
11.1.3.2 Turning the wafer locking strip by 180 degrees (option for 8" wafer support).. 258
11.1.3.3 Setting the wafer support width.. 259
11.1.3.4 Replacing the driver on the clamp.. 259
11.1.3.5 Replacing the solenoid valve for the clamp.. 260
11.1.3.6 Replacing the clamp assemblies.. 261
11.1.3.7 Replacing the diffuse mode sensor.. 262
11.1.3.8 Calibrating the wafer support.. 262
11.1.3.9 Replacing the screw-in cylinder for the downholder.. 263
11.2 Linear dipping unit (LDU).. 264
12 Wafer stretcher.. 265
12.1 Explanation of the wafer stretcher.. 265
12.1.1 SIPLACE SWS wafer stretcher.. 265
12.1.2 Safety instructions.. 266
12.1.3 Technical data.. 266
12.1.4 Placement accuracy and performance values.. 267
12.1.5 Description.. 267
12.2 Detailed description of "wafer stretching" procedure.. 270
12.3 Preparatory measures for working on the wafer stretcher.. 278
12.4 Removing the wafer stretcher.. 279
12.4.1 Preparing removal of the wafer stretcher.. 279
12.4.2 Dismantling the cover plate and the downholder plates.. 279
12.4.3 Removal on the clamping and lifting cylinder side.. 284
12.4.4 Removal at the wafer changer side.. 288
12.5 Overview of wafer stretcher parts.. 293
12.6 Fitting the wafer stretcher.. 293
12.6.1 Preparations for fitting the wafer stretcher.. 293
12.6.2 Fitting the wafer stretcher to the guide trolley.. 294
12.6.3 Fitting the connections.. 299
12.6.4 Fitting the cover plate and the downholder plates.. 302
12.7 Wafer stretcher - configuration changes.. 305
12.7.1 Mechanically setting the stretch factor.. 305
12.7.1.1 Preparations.. 305
12.7.1.2 Settings.. 306
12.7.2 Setting the frame width for 8" wafer supports.. 307
12.7.2.1 Preparations.. 307
12.7.2.2 Settings.. 308
12.7.3 Converting wafer supports from 8" wafer stretchers to 12" wafer stretchers.. 309
12.7.3.1 Retrofit kit parts: 12" wafer expander.. 309
12.7.3.2 Preparations.. 310
12.7.3.3 Removing the 8" wafer support.. 311
12.7.3.4 Difference when converting the 12" to the 8".. 319
12.8 Setting the sag sensor IN 19.. 320
12.8.1 General information about the sag sensor.. 320
12.8.1.1 Sag sensor assembly structure.. 320
12.8.1.2 Sag sensor assembly function.. 321
12.8.1.3 Explanation of light intensity in connection with foil sag.. 322
8 Service Manual SIPLACE Wafer System (SWS) 11/2018
12.8.2 Mechanically setting the sag sensor IN19.. 323
12.8.2.1 Materials and equipment needed.. 323
12.8.2.2 Preparatory tasks.. 324
12.8.2.3 Adjusting (aligning) the sag sensor.. 324
12.8.3 Setting the switching threshold value.. 329
12.8.3.1 Checking the "switching threshold" function.. 332
12.8.4 Final work.. 332
13 BoxPC, GALIL cards and axis control.. 333
13.1 Removing and replacing the BoxPC.. 333
13.1.1 Preparatory tasks.. 333
13.1.1.1 Data backup.. 333
13.1.1.2 Preparing the SWS.. 333
13.1.2 Preparing removal of the BoxPC.. 334
13.1.2.1 Cable connections on the back of the BoxPC.. 335
13.1.3 Removing the BoxPC.. 338
13.1.4 Fitting the new BoxPC.. 339
13.1.4.1 Connecting the new BoxPC.. 340
13.1.4.2 Final work after installation.. 340
13.2 GALIL cards in the BoxPC.. 341
13.2.1 General information about the GALIL cards.. 341
13.2.2 Replacing the GALIL card.. 343
13.3 Replacing the servo amplifier for the axes.. 346
13.3.1 Removing the servo amplifier AMP-19540 from the SWS frame.. 347
13.3.2 GALIL AMP-19540 in detail.. 351
13.3.3 Fitting the servo amplifier AMP-19540 in the SWS frame.. 353
14 Settings and tests.. 357
14.1 SWS GUI - service settings.. 357
14.2 Manual settings.. 358
14.3 Camera calibration.. 359
15 Calibration.. 361
15.1 General information.. 361
15.2 Activation of setup operation at the SWS (hard and software).. 361
15.2.1 Precondition.. 361
15.2.2 Concept of retrofit for setup operation.. 362
15.2.3 Preparation of the software.. 363
15.2.4 Changing the cables at the mounting plate to allow for setup mode.. 364
15.2.5 Rules for the Setup mode - safety relevant issue!.. 368
15.3 Calibration die handling - flip unit.. 368
15.3.1 Preparation – adjusting the holding cylinder Z axis.. 368
15.3.1.1 Different locking systems for the holding cylinder.. 369
15.3.1.2 Adjustment of the holding cylinder Z axis.. 371
15.3.2 Calibration of the SWS – flip head.. 373
15.3.2.1 Entering calibration menu – flip head.. 373
15.3.2.2 Calibration – flip head rotation axis.. 374
15.3.2.3 Calibration – flip head Z axis.. 376
15.3.2.4 Calibration – segment offset calibration in X direction.. 379
15.3.2.5 Calibration – die ejector needle.. 385
15.3.2.6 Calibration – calibration station (not used on SWS).. 389