00195982-03_SM_SWS_EN.pdf - 第7页
7 Service Manual SIPLACE Wafer System (SWS) 11/2018 11 Extension groups .. 255 11.1 Wafer supports .. 255 11.1.1 Overview .. 255 11.1.2 Overview of spare parts .. 256 11.1.3 Replacing spare parts .. 257 11.1.3.…

6 Service Manual SIPLACE Wafer System (SWS) 11/2018
8.4.4.1 Correction in X direction (segment 1).. 186
8.4.4.2 Correction in Y direction (segment 1).. 187
8.4.4.3 Correction in X direction (segment 2).. 188
8.4.4.4 Correction in Y direction (segment 1).. 189
8.4.5 Overview of offset correction in X and Y direction.. 190
9 Wafer change system.. 191
9.1 Magazine lift.. 192
9.1.1 Replacing spare parts.. 192
9.1.1.1 Preparations.. 192
9.1.1.2 Replacing the motor.. 193
9.1.1.3 Replacing the proximity switch.. 194
9.1.1.4 Crash sensor and slot query.. 195
9.1.1.5 Switch for checking whether a cassette is present.. 196
9.1.1.6 Cover switch.. 197
9.1.1.7 Door switch.. 198
9.1.1.8 Wafer lift - replacing the recirculating ball screw.. 199
9.1.2 Electrical system.. 200
9.2 Gripper.. 201
9.2.1 Overview of main assemblies.. 201
9.2.2 Overview of spare parts.. 202
9.2.3 Replacing spare parts.. 204
9.2.3.1 Requirements/preparations.. 204
9.2.3.2 Tools.. 204
9.2.4 Replacing the proximity switch on the toothed belt axis.. 204
9.2.4.1 Setting the position of the proximity switch.. 206
9.2.5 Replacing the motor with coupling for wafer handling.. 207
9.2.6 Replacing the solenoid valves.. 208
9.2.6.1 Setting gentle clamping and moving of the gripper (for location 2/4).. 209
9.2.6.2 Setting gentle clamping and moving of the gripper (for location 1/3).. 209
9.2.7 Dismantling the gripper for location 1/3.. 210
9.2.8 Dismantling the gripper for location 2/4.. 211
9.2.9 Replacing the toothed belt axis.. 212
9.2.9.1 Aligning the height of the toothed belt axis on the lift.. 213
9.2.9.2 Aligning the height of the toothed belt axis at the changer.. 213
9.2.10 Replace the wafer changer completely.. 214
10 Option Die Attach Unit SWS.. 215
10.1 Installing the Option Die Attach Unit SWS.. 215
10.1.1 Description of the Die Attach Unit SWS.. 215
10.1.2 Initial situation.. 216
10.1.3 Installing the Option Die Attach Unit in SWS.. 219
10.1.4 Mechanical alignment of the Die Attach segment – flip head segment 1.. 231
10.1.4.1 Alignment in y direction.. 232
10.1.4.2 Alignment in Z direction.. 233
10.1.4.3 Mechanical adjustment of the Transfer-x axis holding cylinder.. 234
10.1.4.4 Storing the cables.. 236
10.1.5 Calibration of the Die Attach Module.. 238
10.1.5.1 Calibration of the Die Attach Rotation Axis.. 238
10.1.5.2 Calibration of the Die Attach Transfer X Axis.. 242
10.2 Dissambling Die-Attach-Unit SWS.. 243

7Service Manual SIPLACE Wafer System (SWS) 11/2018
11 Extension groups.. 255
11.1 Wafer supports.. 255
11.1.1 Overview.. 255
11.1.2 Overview of spare parts.. 256
11.1.3 Replacing spare parts.. 257
11.1.3.1 Replacing the complete wafer support.. 257
11.1.3.2 Turning the wafer locking strip by 180 degrees (option for 8" wafer support).. 258
11.1.3.3 Setting the wafer support width.. 259
11.1.3.4 Replacing the driver on the clamp.. 259
11.1.3.5 Replacing the solenoid valve for the clamp.. 260
11.1.3.6 Replacing the clamp assemblies.. 261
11.1.3.7 Replacing the diffuse mode sensor.. 262
11.1.3.8 Calibrating the wafer support.. 262
11.1.3.9 Replacing the screw-in cylinder for the downholder.. 263
11.2 Linear dipping unit (LDU).. 264
12 Wafer stretcher.. 265
12.1 Explanation of the wafer stretcher.. 265
12.1.1 SIPLACE SWS wafer stretcher.. 265
12.1.2 Safety instructions.. 266
12.1.3 Technical data.. 266
12.1.4 Placement accuracy and performance values.. 267
12.1.5 Description.. 267
12.2 Detailed description of "wafer stretching" procedure.. 270
12.3 Preparatory measures for working on the wafer stretcher.. 278
12.4 Removing the wafer stretcher.. 279
12.4.1 Preparing removal of the wafer stretcher.. 279
12.4.2 Dismantling the cover plate and the downholder plates.. 279
12.4.3 Removal on the clamping and lifting cylinder side.. 284
12.4.4 Removal at the wafer changer side.. 288
12.5 Overview of wafer stretcher parts.. 293
12.6 Fitting the wafer stretcher.. 293
12.6.1 Preparations for fitting the wafer stretcher.. 293
12.6.2 Fitting the wafer stretcher to the guide trolley.. 294
12.6.3 Fitting the connections.. 299
12.6.4 Fitting the cover plate and the downholder plates.. 302
12.7 Wafer stretcher - configuration changes.. 305
12.7.1 Mechanically setting the stretch factor.. 305
12.7.1.1 Preparations.. 305
12.7.1.2 Settings.. 306
12.7.2 Setting the frame width for 8" wafer supports.. 307
12.7.2.1 Preparations.. 307
12.7.2.2 Settings.. 308
12.7.3 Converting wafer supports from 8" wafer stretchers to 12" wafer stretchers.. 309
12.7.3.1 Retrofit kit parts: 12" wafer expander.. 309
12.7.3.2 Preparations.. 310
12.7.3.3 Removing the 8" wafer support.. 311
12.7.3.4 Difference when converting the 12" to the 8".. 319
12.8 Setting the sag sensor IN 19.. 320
12.8.1 General information about the sag sensor.. 320
12.8.1.1 Sag sensor assembly structure.. 320
12.8.1.2 Sag sensor assembly function.. 321
12.8.1.3 Explanation of light intensity in connection with foil sag.. 322

8 Service Manual SIPLACE Wafer System (SWS) 11/2018
12.8.2 Mechanically setting the sag sensor IN19.. 323
12.8.2.1 Materials and equipment needed.. 323
12.8.2.2 Preparatory tasks.. 324
12.8.2.3 Adjusting (aligning) the sag sensor.. 324
12.8.3 Setting the switching threshold value.. 329
12.8.3.1 Checking the "switching threshold" function.. 332
12.8.4 Final work.. 332
13 BoxPC, GALIL cards and axis control.. 333
13.1 Removing and replacing the BoxPC.. 333
13.1.1 Preparatory tasks.. 333
13.1.1.1 Data backup.. 333
13.1.1.2 Preparing the SWS.. 333
13.1.2 Preparing removal of the BoxPC.. 334
13.1.2.1 Cable connections on the back of the BoxPC.. 335
13.1.3 Removing the BoxPC.. 338
13.1.4 Fitting the new BoxPC.. 339
13.1.4.1 Connecting the new BoxPC.. 340
13.1.4.2 Final work after installation.. 340
13.2 GALIL cards in the BoxPC.. 341
13.2.1 General information about the GALIL cards.. 341
13.2.2 Replacing the GALIL card.. 343
13.3 Replacing the servo amplifier for the axes.. 346
13.3.1 Removing the servo amplifier AMP-19540 from the SWS frame.. 347
13.3.2 GALIL AMP-19540 in detail.. 351
13.3.3 Fitting the servo amplifier AMP-19540 in the SWS frame.. 353
14 Settings and tests.. 357
14.1 SWS GUI - service settings.. 357
14.2 Manual settings.. 358
14.3 Camera calibration.. 359
15 Calibration.. 361
15.1 General information.. 361
15.2 Activation of setup operation at the SWS (hard and software).. 361
15.2.1 Precondition.. 361
15.2.2 Concept of retrofit for setup operation.. 362
15.2.3 Preparation of the software.. 363
15.2.4 Changing the cables at the mounting plate to allow for setup mode.. 364
15.2.5 Rules for the Setup mode - safety relevant issue!.. 368
15.3 Calibration die handling - flip unit.. 368
15.3.1 Preparation – adjusting the holding cylinder Z axis.. 368
15.3.1.1 Different locking systems for the holding cylinder.. 369
15.3.1.2 Adjustment of the holding cylinder Z axis.. 371
15.3.2 Calibration of the SWS – flip head.. 373
15.3.2.1 Entering calibration menu – flip head.. 373
15.3.2.2 Calibration – flip head rotation axis.. 374
15.3.2.3 Calibration – flip head Z axis.. 376
15.3.2.4 Calibration – segment offset calibration in X direction.. 379
15.3.2.5 Calibration – die ejector needle.. 385
15.3.2.6 Calibration – calibration station (not used on SWS).. 389